BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260407T150000Z
DTEND:20260407T160000Z
DTSTAMP:20260403T151747
CREATED:20260327T132925Z
LAST-MODIFIED:20260327T132925Z
UID:39829-1775556000-1775559600@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-11/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260407T170000Z
DTEND:20260407T180000Z
DTSTAMP:20260403T151747
CREATED:20260313T155928Z
LAST-MODIFIED:20260313T155928Z
UID:39602-1775563200-1775566800@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluation-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260408T150000Z
DTEND:20260408T160000Z
DTSTAMP:20260403T151747
CREATED:20260325T154002Z
LAST-MODIFIED:20260325T154002Z
UID:39794-1775642400-1775646000@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-12/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260408T160000Z
DTEND:20260408T170000Z
DTSTAMP:20260403T151747
CREATED:20260325T171305Z
LAST-MODIFIED:20260325T171305Z
UID:39800-1775646000-1775649600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project WebEx Call 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-7/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260409T140000Z
DTEND:20260409T150000Z
DTSTAMP:20260403T151747
CREATED:20260312T133230Z
LAST-MODIFIED:20260312T133230Z
UID:39575-1775725200-1775728800@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-20/
CATEGORIES:Electro-Chemical Migration 4
END:VEVENT
BEGIN:VEVENT
DTSTART:20260413T150000Z
DTEND:20260413T160000Z
DTSTAMP:20260403T151747
CREATED:20260323T160624Z
LAST-MODIFIED:20260323T160624Z
UID:39790-1776074400-1776078000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-4/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260414T150000Z
DTEND:20260414T160000Z
DTSTAMP:20260403T151747
CREATED:20260401T192322Z
LAST-MODIFIED:20260401T192322Z
UID:39968-1776160800-1776164400@hdpusergroup.org
SUMMARY:Better CAF  Eq
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/better-caf-eq-57/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260414T190000Z
DTEND:20260414T200000Z
DTSTAMP:20260403T151747
CREATED:20260402T152744Z
LAST-MODIFIED:20260402T152744Z
UID:39992-1776175200-1776178800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260415T200000Z
DTEND:20260415T210000Z
DTSTAMP:20260403T151747
CREATED:20260401T205730Z
LAST-MODIFIED:20260401T205730Z
UID:39972-1776265200-1776268800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-27/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T140000Z
DTEND:20260416T150000Z
DTSTAMP:20260403T151747
CREATED:20260330T160121Z
LAST-MODIFIED:20260330T160121Z
UID:39690-1776330000-1776333600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-18/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T150000Z
DTEND:20260416T160000Z
DTSTAMP:20260403T151747
CREATED:20260327T005130Z
LAST-MODIFIED:20260327T005130Z
UID:39809-1776333600-1776337200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project WebEx Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-15/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260416T190000Z
DTEND:20260416T200000Z
DTSTAMP:20260403T151747
CREATED:20260326T204227Z
LAST-MODIFIED:20260326T204227Z
UID:39804-1776348000-1776351600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Latest FA results \nWork on final report? 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-19/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260417T000000Z
DTEND:20260417T010000Z
DTSTAMP:20260403T151747
CREATED:20260403T002641Z
LAST-MODIFIED:20260403T002641Z
UID:40002-1776366000-1776369600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Close to finishing final report \nFinalize prsesentation for BoD for phase 2? 
URL:https://hdpusergroup.org/event/porosity-32/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260422T150000Z
DTEND:20260422T160000Z
DTSTAMP:20260403T151747
CREATED:20260331T151724Z
LAST-MODIFIED:20260331T151724Z
UID:39947-1776852000-1776855600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-43/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260423T150000Z
DTEND:20260423T160000Z
DTSTAMP:20260403T151747
CREATED:20260402T155218Z
LAST-MODIFIED:20260402T155218Z
UID:39995-1776938400-1776942000@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-5/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260423T210000Z
DTEND:20260423T220000Z
DTSTAMP:20260403T151747
CREATED:20260402T224006Z
LAST-MODIFIED:20260402T224006Z
UID:40000-1776960000-1776963600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-34/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T160000Z
DTEND:20260430T170000Z
DTSTAMP:20260403T151747
CREATED:20260402T155556Z
LAST-MODIFIED:20260402T155556Z
UID:39803-1777546800-1777550400@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-5/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR