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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
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TZOFFSETFROM:-0500
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DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260518T150000Z
DTEND:20260518T160000Z
DTSTAMP:20260518T063126
CREATED:20260504T160442Z
LAST-MODIFIED:20260504T160442Z
UID:40117-1779098400-1779102000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-6/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260519T190000Z
DTEND:20260519T200000Z
DTSTAMP:20260518T063126
CREATED:20260507T140756Z
LAST-MODIFIED:20260507T140756Z
UID:40129-1779199200-1779202800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-2/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260520T010000Z
DTEND:20260520T020000Z
DTSTAMP:20260518T063126
CREATED:20260514T015545Z
LAST-MODIFIED:20260514T015545Z
UID:40235-1779220800-1779224400@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-36/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260520T150000Z
DTEND:20260520T160000Z
DTSTAMP:20260518T063126
CREATED:20260513T172826Z
LAST-MODIFIED:20260513T172826Z
UID:40227-1779271200-1779274800@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-15/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260521T140000Z
DTEND:20260521T150000Z
DTSTAMP:20260518T063126
CREATED:20260430T141743Z
LAST-MODIFIED:20260430T141743Z
UID:40101-1779354000-1779357600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-20/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260521T150000Z
DTEND:20260521T160000Z
DTSTAMP:20260518T063126
CREATED:20260430T152111Z
LAST-MODIFIED:20260430T152111Z
UID:40102-1779357600-1779361200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Thin Dielectric Skew Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-8/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260521T160000Z
DTEND:20260521T170000Z
DTSTAMP:20260518T063126
CREATED:20260502T174759Z
LAST-MODIFIED:20260502T174759Z
UID:40114-1779361200-1779364800@hdpusergroup.org
SUMMARY:TCE Materials
DESCRIPTION:Review data received for Z and XY measurements. Discuss path forward. 
URL:https://hdpusergroup.org/event/tce-materials-5/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260521T210000Z
DTEND:20260521T220000Z
DTSTAMP:20260518T063126
CREATED:20260507T220748Z
LAST-MODIFIED:20260507T220748Z
UID:40131-1779379200-1779382800@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-36/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260527T150000Z
DTEND:20260527T160000Z
DTSTAMP:20260518T063126
CREATED:20260506T152732Z
LAST-MODIFIED:20260506T152732Z
UID:40127-1779876000-1779879600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-46/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260528T140000Z
DTEND:20260528T150000Z
DTSTAMP:20260518T063126
CREATED:20260507T153339Z
LAST-MODIFIED:20260507T153339Z
UID:40130-1779958800-1779962400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-17/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260528T200000Z
DTEND:20260528T210000Z
DTSTAMP:20260518T063126
CREATED:20260514T202445Z
LAST-MODIFIED:20260514T202445Z
UID:40275-1779980400-1779984000@hdpusergroup.org
SUMMARY:Copper Outer Layer Trace Adhesion
DESCRIPTION:Finalize data for Members meeting presentation 
URL:https://hdpusergroup.org/event/copper-outer-layer-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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