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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20260308T080000
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DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260422T140000Z
DTEND:20260422T150000Z
DTSTAMP:20260417T013135
CREATED:20260409T144851Z
LAST-MODIFIED:20260409T144851Z
UID:40022-1776848400-1776852000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-21/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260422T150000Z
DTEND:20260422T160000Z
DTSTAMP:20260417T013135
CREATED:20260331T151724Z
LAST-MODIFIED:20260331T151724Z
UID:39947-1776852000-1776855600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-43/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260423T150000Z
DTEND:20260423T160000Z
DTSTAMP:20260417T013135
CREATED:20260402T155218Z
LAST-MODIFIED:20260402T155218Z
UID:39995-1776938400-1776942000@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-5/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260423T210000Z
DTEND:20260423T220000Z
DTSTAMP:20260417T013135
CREATED:20260402T224006Z
LAST-MODIFIED:20260402T224006Z
UID:40000-1776960000-1776963600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-34/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260424T000000Z
DTEND:20260424T010000Z
DTSTAMP:20260417T013135
CREATED:20260417T003203Z
LAST-MODIFIED:20260417T003203Z
UID:40035-1776970800-1776974400@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Finish final report? \nWork on presentations for Closeout and Phase 2 
URL:https://hdpusergroup.org/event/porosity-testing-12/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260428T150000Z
DTEND:20260428T160000Z
DTSTAMP:20260417T013135
CREATED:20260409T123300Z
LAST-MODIFIED:20260409T123300Z
UID:40021-1777370400-1777374000@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-13/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260428T170000Z
DTEND:20260428T180000Z
DTSTAMP:20260417T013135
CREATED:20260414T113100Z
LAST-MODIFIED:20260414T113100Z
UID:40028-1777377600-1777381200@hdpusergroup.org
SUMMARY:Paste Interconnect Exploratory Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-exploratory-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20260428T190000Z
DTEND:20260428T200000Z
DTSTAMP:20260417T013135
CREATED:20260415T154025Z
LAST-MODIFIED:20260415T154025Z
UID:40030-1777384800-1777388400@hdpusergroup.org
SUMMARY:Effect of Metal Additions on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-on-solder-joint-reliability-project-call/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260429T150000Z
DTEND:20260429T160000Z
DTSTAMP:20260417T013135
CREATED:20260408T155235Z
LAST-MODIFIED:20260408T155235Z
UID:40015-1777456800-1777460400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-13/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T140000Z
DTEND:20260430T150000Z
DTSTAMP:20260417T013135
CREATED:20260416T142607Z
LAST-MODIFIED:20260416T142607Z
UID:40033-1777539600-1777543200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-19/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T150000Z
DTEND:20260430T160000Z
DTSTAMP:20260417T013135
CREATED:20260408T161949Z
LAST-MODIFIED:20260408T161949Z
UID:40016-1777543200-1777546800@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-6/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T160000Z
DTEND:20260430T170000Z
DTSTAMP:20260417T013135
CREATED:20260402T155556Z
LAST-MODIFIED:20260402T155556Z
UID:39803-1777546800-1777550400@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-5/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260430T200000Z
DTEND:20260430T210000Z
DTSTAMP:20260417T013135
CREATED:20260415T205225Z
LAST-MODIFIED:20260415T205225Z
UID:40031-1777561200-1777564800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Talk about a phase 2 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-28/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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