BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260624T150000Z
DTEND:20260624T160000Z
DTSTAMP:20260622T210049
CREATED:20260527T152038Z
LAST-MODIFIED:20260527T152038Z
UID:40360-1782295200-1782298800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-47/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260625T140000Z
DTEND:20260625T150000Z
DTSTAMP:20260622T210049
CREATED:20260611T151215Z
LAST-MODIFIED:20260611T151215Z
UID:40608-1782378000-1782381600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-22/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260625T150000Z
DTEND:20260625T160000Z
DTSTAMP:20260622T210049
CREATED:20260521T151745Z
LAST-MODIFIED:20260521T151745Z
UID:40342-1782381600-1782385200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-9/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260625T160000Z
DTEND:20260625T170000Z
DTSTAMP:20260622T210049
CREATED:20260519T152316Z
LAST-MODIFIED:20260519T152316Z
UID:40106-1782385200-1782388800@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-6/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260625T170000Z
DTEND:20260625T180000Z
DTSTAMP:20260622T210049
CREATED:20260611T172252Z
LAST-MODIFIED:20260611T172252Z
UID:40289-1782388800-1782392400@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-Ups
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-21/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260629T150000Z
DTEND:20260629T160000Z
DTSTAMP:20260622T210049
CREATED:20260615T232150Z
LAST-MODIFIED:20260615T232150Z
UID:40737-1782727200-1782730800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-8/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260630T150000Z
DTEND:20260630T160000Z
DTSTAMP:20260622T210049
CREATED:20260616T113804Z
LAST-MODIFIED:20260616T113804Z
UID:40746-1782813600-1782817200@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-16/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260630T170000Z
DTEND:20260630T180000Z
DTSTAMP:20260622T210049
CREATED:20260622T140029Z
LAST-MODIFIED:20260622T140029Z
UID:40779-1782820800-1782824400@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-4/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260701T020000Z
DTEND:20260701T030000Z
DTSTAMP:20260622T210049
CREATED:20260617T025323Z
LAST-MODIFIED:20260617T025323Z
UID:40751-1782853200-1782856800@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR