BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260702T043000Z
DTEND:20260702T044500Z
DTSTAMP:20260806T035039
CREATED:20260701T145524Z
LAST-MODIFIED:20260701T145524Z
UID:40806-1782948600-1782949500@hdpusergroup.org
SUMMARY:curt testing
DESCRIPTION:testing meeting notices to curt mitchell 
URL:https://hdpusergroup.org/event/curt-testing/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260702T140000Z
DTEND:20260702T150000Z
DTSTAMP:20260806T035039
CREATED:20260611T154706Z
LAST-MODIFIED:20260611T154706Z
UID:40625-1782982800-1782986400@hdpusergroup.org
SUMMARY:Electrochemical Migration 4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/electrochemical-migration-4-2/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260702T150000Z
DTEND:20260702T160000Z
DTSTAMP:20260806T035039
CREATED:20260623T124456Z
LAST-MODIFIED:20260623T124456Z
UID:40780-1782986400-1782990000@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-17/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260702T210000Z
DTEND:20260702T220000Z
DTSTAMP:20260806T035039
CREATED:20260618T221748Z
LAST-MODIFIED:20260618T221748Z
UID:40773-1783008000-1783011600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:The project has entered the implementation phase\, with participation limited to members and non-members approved for continued involvement. 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-38/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260707T030000Z
DTEND:20260707T040000Z
DTSTAMP:20260806T035039
CREATED:20260703T153949Z
LAST-MODIFIED:20260703T153949Z
UID:40828-1783375200-1783378800@hdpusergroup.org
SUMMARY:Foxconn – HDP Discussion
DESCRIPTION:Foxconn – HDP Discussion 
URL:https://hdpusergroup.org/event/foxconn-hdp-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260707T170000Z
DTEND:20260707T180000Z
DTSTAMP:20260806T035039
CREATED:20260521T182053Z
LAST-MODIFIED:20260521T182053Z
UID:40345-1783425600-1783429200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-12/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260708T140000Z
DTEND:20260708T150000Z
DTSTAMP:20260806T035039
CREATED:20260625T141350Z
LAST-MODIFIED:20260625T141350Z
UID:40789-1783501200-1783504800@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-23/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260708T150000Z
DTEND:20260708T160000Z
DTSTAMP:20260806T035039
CREATED:20260617T153249Z
LAST-MODIFIED:20260617T153249Z
UID:40752-1783504800-1783508400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Ca
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-ca-2/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260709T010000Z
DTEND:20260709T020000Z
DTSTAMP:20260806T035039
CREATED:20260611T011652Z
LAST-MODIFIED:20260611T011652Z
UID:40556-1783540800-1783544400@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-38/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260709T150000Z
DTEND:20260709T160000Z
DTSTAMP:20260806T035039
CREATED:20260630T014028Z
LAST-MODIFIED:20260630T014028Z
UID:40799-1783591200-1783594800@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260709T150000Z
DTEND:20260709T160000Z
DTSTAMP:20260806T035039
CREATED:20260706T004838Z
LAST-MODIFIED:20260706T004838Z
UID:40800-1783591200-1783594800@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260709T200000Z
DTEND:20260709T210000Z
DTSTAMP:20260806T035039
CREATED:20260622T133507Z
LAST-MODIFIED:20260622T133507Z
UID:40778-1783609200-1783612800@hdpusergroup.org
SUMMARY:Copper Outer Layer Trace Adhesion
DESCRIPTION:Thin Ttrace adhesion project.  
URL:https://hdpusergroup.org/event/copper-outer-layer-trace-adhesion-2/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260714T160000Z
DTEND:20260714T170000Z
DTSTAMP:20260806T035039
CREATED:20260625T161552Z
LAST-MODIFIED:20260625T161552Z
UID:40790-1784026800-1784030400@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-7/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T010000Z
DTEND:20260715T020000Z
DTSTAMP:20260806T035039
CREATED:20260701T021722Z
LAST-MODIFIED:20260701T021722Z
UID:40804-1784059200-1784062800@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-2/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T140000Z
DTEND:20260715T150000Z
DTSTAMP:20260806T035039
CREATED:20260616T145459Z
LAST-MODIFIED:20260616T145459Z
UID:40747-1784106000-1784109600@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-19/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T160000Z
DTEND:20260715T170000Z
DTSTAMP:20260806T035039
CREATED:20260701T170102Z
LAST-MODIFIED:20260701T170102Z
UID:40807-1784113200-1784116800@hdpusergroup.org
SUMMARY:TCE Materials
DESCRIPTION:Calibration and validation of CTE test method update 
URL:https://hdpusergroup.org/event/tce-materials-6/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T180000Z
DTEND:20260715T190000Z
DTSTAMP:20260806T035039
CREATED:20260618T161958Z
LAST-MODIFIED:20260618T161958Z
UID:40764-1784120400-1784124000@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limits
DESCRIPTION:Discuss new project for test vehicle design to test several diamter holes sizes and aspect ratios  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits/
CATEGORIES:High Aspect Ratio Plating Limits
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260715T180000Z
DTEND:20260715T190000Z
DTSTAMP:20260806T035039
CREATED:20260702T141211Z
LAST-MODIFIED:20260702T141211Z
UID:40818-1784120400-1784124000@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limits
DESCRIPTION:Discuss TV for evaluation 
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits-2/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T140000Z
DTEND:20260716T150000Z
DTSTAMP:20260806T035039
CREATED:20260625T224759Z
LAST-MODIFIED:20260625T224759Z
UID:40793-1784192400-1784196000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-10/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T150000Z
DTEND:20260716T160000Z
DTSTAMP:20260806T035039
CREATED:20260618T152549Z
LAST-MODIFIED:20260618T152549Z
UID:40763-1784196000-1784199600@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-8/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260716T160000Z
DTEND:20260716T170000Z
DTSTAMP:20260806T035039
CREATED:20260707T110030Z
LAST-MODIFIED:20260707T110030Z
UID:40798-1784199600-1784203200@hdpusergroup.org
SUMMARY:Non-Glass Microvia
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260717T010000Z
DTEND:20260717T020000Z
DTSTAMP:20260806T035039
CREATED:20260715T030404Z
LAST-MODIFIED:20260715T030404Z
UID:40945-1784232000-1784235600@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Building on the procedure developed in phase 1 and will apply to a ndw set of solderable finishes. 
URL:https://hdpusergroup.org/event/porosity-testing-2-2/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260721T150000Z
DTEND:20260721T160000Z
DTSTAMP:20260806T035039
CREATED:20260713T164759Z
LAST-MODIFIED:20260713T164759Z
UID:40821-1784628000-1784631600@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-17/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260721T170000Z
DTEND:20260721T180000Z
DTSTAMP:20260806T035039
CREATED:20260707T141317Z
LAST-MODIFIED:20260707T141317Z
UID:40843-1784635200-1784638800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-5/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260722T140000Z
DTEND:20260722T150000Z
DTSTAMP:20260806T035039
CREATED:20260708T141037Z
LAST-MODIFIED:20260708T141037Z
UID:40845-1784710800-1784714400@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-24/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260722T150000Z
DTEND:20260722T160000Z
DTSTAMP:20260806T035039
CREATED:20260624T153216Z
LAST-MODIFIED:20260624T153216Z
UID:40787-1784714400-1784718000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-48/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260722T160000Z
DTEND:20260722T170000Z
DTSTAMP:20260806T035039
CREATED:20260714T141859Z
LAST-MODIFIED:20260714T141859Z
UID:40553-1784718000-1784721600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-9/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260723T150000Z
DTEND:20260723T160000Z
DTSTAMP:20260806T035039
CREATED:20260708T160838Z
LAST-MODIFIED:20260708T160838Z
UID:40846-1784800800-1784804400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-15/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260723T160000Z
DTEND:20260723T170000Z
DTSTAMP:20260806T035039
CREATED:20260714T114259Z
LAST-MODIFIED:20260714T114259Z
UID:40857-1784804400-1784808000@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260723T210000Z
DTEND:20260723T220000Z
DTSTAMP:20260806T035039
CREATED:20260702T222018Z
LAST-MODIFIED:20260702T222018Z
UID:40827-1784822400-1784826000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-39/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR