Better CAF Eq
2025-12-03 15:00 - 16:00 UTC
Hopefully analysis update from Joe

Sequential Lamination Meeting
2025-12-03 17:00 - 18:00
Meeting

Porosity
2025-12-04 00:00 - 01:00
Compare X-ray results

Pb Free Materials 7 Project Call
2025-12-04 15:00 - 16:00

PCB Flatness at Large Package Attach Locations
2025-12-04 16:00 - 17:00

Glass Substrate Reliability Analysis
2025-12-04 22:00 - 23:00, 2025-12-18 22:00 - 23:00

Stacked Microvia Capability Improvement
2025-12-09 16:00 - 17:00

Discussion on June 2026 HDP Asia Member Meeting
2025-12-10 01:00 - 02:00

Backdrill Sliver Detection and Removal Project Kick-Off Meeting
2025-12-10 15:00 - 16:00

Thin Dielectric Skew Project
2025-12-10 16:00 - 17:00
Project Meeting

Investigate New Test Methods for Copper Foil Adhesion Project Call
2025-12-11 00:00 - 01:00, 2025-12-31 01:00 - 02:00

Correlating CF Profile to Signal Integrity Project Call
2025-12-11 01:00 - 02:00

SIR Testing meeting
2025-12-11 15:00 - 16:00

ECM-4
2025-12-11 16:00 - 17:00

HDP Board of Directors 2025 Performance to Op Plan Review
2025-12-15 19:00 - 21:00

Microvia Electrical Characterization
2025-12-16 16:00 - 17:00

Non-Glass Microvia Build-ups
2025-12-16 21:00 - 22:00
Progress on testing

D-Coupon IST CITC Reliability Testing
2025-12-17 15:00 - 16:00

Porosity
2025-12-18 00:00 - 01:00
Compare XRF and Xray results

TCE Materials
2025-12-18 17:00 - 18:00
Touch base on the CTE validation with each of the laminators.

Cu Outer Trace Adhesion
2025-12-18 19:30 - 20:30
Status of materials and build schedule

Meeting with Nittobo
2025-12-23 06:00 - 07:00
HDP Overview
