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35 events found.
Calendar of Events
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Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
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Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
Reflow Cycle Via Reliability Impact SMTAi Paper Review
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Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
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2 events,
3 events,
Cu Outer Trace Adhesion
Cu Outer Trace Adhesion
Material order/ship status
Trace thickness and width confirmation
Any build info?
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
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Thin Dielectric Skew Project Kickoff
Thin Dielectric Skew Project Kickoff
This new HDP project seeks to determine the worst case electrical skew that is now possible when using thinner dielectrics, and how much electrical skew can be mitigated by changing the orientation / alignme...
1 event,
D-Coupon IST CITC Reliability Testing
D-Coupon IST CITC Reliability Testing
Project to measure and compare sensitivity of each test method to preconditioning/assembly reflow profile diference(s) taht significantly impact long term reliability.