BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20250309T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20251102T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20250401T170000Z
DTEND:20250401T180000Z
DTSTAMP:20260421T035829
CREATED:20250311T150101Z
LAST-MODIFIED:20250311T150101Z
UID:29519-1743508800-1743512400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-7/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250402T140000Z
DTEND:20250402T150000Z
DTSTAMP:20260421T035829
CREATED:20250205T151618Z
LAST-MODIFIED:20250205T151618Z
UID:29164-1743584400-1743588000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-16/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250402T150000Z
DTEND:20250402T160000Z
DTSTAMP:20260421T035829
CREATED:20250320T153051Z
LAST-MODIFIED:20250320T153051Z
UID:29559-1743588000-1743591600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-8/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250403T000000Z
DTEND:20250403T010000Z
DTSTAMP:20260421T035829
CREATED:20250331T235407Z
LAST-MODIFIED:20250331T235407Z
UID:29675-1743620400-1743624000@hdpusergroup.org
SUMMARY:Call with Ed Kelly
DESCRIPTION:Call with Ed Kelly 
URL:https://hdpusergroup.org/event/call-with-ed-kelly/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250403T010000Z
DTEND:20250403T020000Z
DTSTAMP:20260421T035829
CREATED:20250313T013141Z
LAST-MODIFIED:20250313T013141Z
UID:29532-1743624000-1743627600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-16/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250403T160000Z
DTEND:20250403T170000Z
DTSTAMP:20260421T035829
CREATED:20250205T172746Z
LAST-MODIFIED:20250205T172746Z
UID:29171-1743678000-1743681600@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-18/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250403T210000Z
DTEND:20250403T220000Z
DTSTAMP:20260421T035829
CREATED:20250313T220829Z
LAST-MODIFIED:20250313T220829Z
UID:29542-1743696000-1743699600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-14/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250408T200000Z
DTEND:20250408T210000Z
DTSTAMP:20260421T035829
CREATED:20250311T211026Z
LAST-MODIFIED:20250311T211026Z
UID:29520-1744124400-1744128000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Hopefully discuss results of trial run. 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-13/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250409T010000Z
DTEND:20250409T020000Z
DTSTAMP:20260421T035829
CREATED:20250409T003248Z
LAST-MODIFIED:20250409T003248Z
UID:29564-1744142400-1744146000@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion New Idea Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion New Idea Project Call – 1st meeting 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-new-idea-project-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250409T150000Z
DTEND:20250409T160000Z
DTSTAMP:20260421T035829
CREATED:20250305T161741Z
LAST-MODIFIED:20250305T161741Z
UID:29493-1744192800-1744196400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-30/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250410T140000Z
DTEND:20250410T150000Z
DTSTAMP:20260421T035829
CREATED:20250403T202631Z
LAST-MODIFIED:20250403T202631Z
UID:29676-1744275600-1744279200@hdpusergroup.org
SUMMARY:TCE Materials-Validating Test Method to Measure CTE in the X-Y axis
DESCRIPTION:Discussion omn next phase of project. Focus on test method validation  and test vehicle design. In addition\, range to temperatures tp test 
URL:https://hdpusergroup.org/event/tce-materials-validating-test-method-to-measure-cte-in-the-x-y-axis/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250414T150000Z
DTEND:20250414T160000Z
DTSTAMP:20260421T035829
CREATED:20250331T155401Z
LAST-MODIFIED:20250331T155401Z
UID:29765-1744624800-1744628400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-62/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250414T150000Z
DTEND:20250414T160000Z
DTSTAMP:20260421T035829
CREATED:20250414T182909Z
LAST-MODIFIED:20250414T182909Z
UID:30054-1744624800-1744628400@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:ECM-4 continues from ECM-3 
URL:https://hdpusergroup.org/event/ecm-4-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250416T160000Z
DTEND:20250416T170000Z
DTSTAMP:20260421T035829
CREATED:20250403T164702Z
LAST-MODIFIED:20250403T164702Z
UID:29784-1744801200-1744804800@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-19/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250417T010000Z
DTEND:20250417T020000Z
DTSTAMP:20260421T035829
CREATED:20250403T011427Z
LAST-MODIFIED:20250403T011427Z
UID:29780-1744833600-1744837200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-17/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250417T150000Z
DTEND:20250417T160000Z
DTSTAMP:20260421T035829
CREATED:20250327T151249Z
LAST-MODIFIED:20250327T151249Z
UID:29610-1744884000-1744887600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-41/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250417T170000Z
DTEND:20250417T180000Z
DTSTAMP:20260421T035829
CREATED:20250410T140309Z
LAST-MODIFIED:20250410T140309Z
UID:29619-1744891200-1744894800@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Build update 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-7/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250417T210000Z
DTEND:20250417T220000Z
DTSTAMP:20260421T035829
CREATED:20250403T213308Z
LAST-MODIFIED:20250403T213308Z
UID:29787-1744905600-1744909200@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-15/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250417T230000Z
DTEND:20250418T000000Z
DTSTAMP:20260421T035829
CREATED:20250410T140127Z
LAST-MODIFIED:20250410T140127Z
UID:29545-1744912800-1744916400@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Progress reports 
URL:https://hdpusergroup.org/event/porosity-17/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250418T010000Z
DTEND:20250418T020000Z
DTSTAMP:20260421T035829
CREATED:20250411T170424Z
LAST-MODIFIED:20250411T170424Z
UID:29872-1744920000-1744923600@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:NA 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-15/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250421T170000Z
DTEND:20250421T180000Z
DTSTAMP:20260421T035829
CREATED:20250409T114322Z
LAST-MODIFIED:20250409T114322Z
UID:29794-1745236800-1745240400@hdpusergroup.org
SUMMARY:Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250422T180000Z
DTEND:20250422T183000Z
DTSTAMP:20260421T035829
CREATED:20250422T175426Z
LAST-MODIFIED:20250422T175426Z
UID:30197-1745326800-1745328600@hdpusergroup.org
SUMMARY:Test Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/test-meeting-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250423T140000Z
DTEND:20250423T150000Z
DTSTAMP:20260421T035829
CREATED:20250402T145209Z
LAST-MODIFIED:20250402T145209Z
UID:29776-1745398800-1745402400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-17/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250423T150000Z
DTEND:20250423T160000Z
DTSTAMP:20260421T035829
CREATED:20250326T160045Z
LAST-MODIFIED:20250326T160045Z
UID:29568-1745402400-1745406000@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Phase 2
DESCRIPTION:Inner Layer Copper Balancing 2 Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250423T160000Z
DTEND:20250423T170000Z
DTSTAMP:20260421T035829
CREATED:20250409T161401Z
LAST-MODIFIED:20250409T161401Z
UID:29819-1745406000-1745409600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/april-9-1100-am-1200-pm-edt-sir-testing-meeting/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250424T010000Z
DTEND:20250424T020000Z
DTSTAMP:20260421T035829
CREATED:20250423T162950Z
LAST-MODIFIED:20250423T162950Z
UID:29802-1745438400-1745442000@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250424T150000Z
DTEND:20250424T160000Z
DTSTAMP:20260421T035829
CREATED:20250402T155651Z
LAST-MODIFIED:20250402T155651Z
UID:29777-1745488800-1745492400@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-9/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250424T160000Z
DTEND:20250424T170000Z
DTSTAMP:20260421T035829
CREATED:20250410T154751Z
LAST-MODIFIED:20250410T154751Z
UID:29891-1745492400-1745496000@hdpusergroup.org
SUMMARY:TCE Materials-investigate test methods for x-y CTE
DESCRIPTION:Investigating test methods to confirm accuracy of the CTE in the X-Y direction 
URL:https://hdpusergroup.org/event/tce-materials-investigate-test-methods-for-x-y-cte/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250425T160000Z
DTEND:20250425T170000Z
DTSTAMP:20260421T035829
CREATED:20250409T114402Z
LAST-MODIFIED:20250409T114402Z
UID:29795-1745578800-1745582400@hdpusergroup.org
SUMMARY:Investigate Electrical Performance of Stacked vs. Staggered Microvias
DESCRIPTION:Meeting
URL:https://hdpusergroup.org/event/investigate-electrical-performance-of-stacked-vs-staggered-microvias/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250428T150000Z
DTEND:20250428T160000Z
DTSTAMP:20260421T035829
CREATED:20250414T154248Z
LAST-MODIFIED:20250414T154248Z
UID:30053-1745834400-1745838000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-63/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR