BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240702T170000Z
DTEND:20240702T180000Z
DTSTAMP:20260420T000938
CREATED:20240619T121119Z
LAST-MODIFIED:20240619T121119Z
UID:26762-1719921600-1719925200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-9/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240703T010000Z
DTEND:20240703T020000Z
DTSTAMP:20260420T000938
CREATED:20240612T013448Z
LAST-MODIFIED:20240612T013448Z
UID:26790-1719950400-1719954000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240708T150000Z
DTEND:20240708T160000Z
DTSTAMP:20260420T000938
CREATED:20240610T154521Z
LAST-MODIFIED:20240610T154521Z
UID:26786-1720432800-1720436400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-48/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240708T160000Z
DTEND:20240708T170000Z
DTSTAMP:20260420T000938
CREATED:20240619T163547Z
LAST-MODIFIED:20240619T163547Z
UID:26815-1720436400-1720440000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue working on final report \nAny ideas/interest in another microvia project? 
URL:https://hdpusergroup.org/event/microvia-rel-49/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T140000Z
DTEND:20240710T150000Z
DTSTAMP:20260420T000938
CREATED:20240710T134646Z
LAST-MODIFIED:20240710T134646Z
UID:26553-1720602000-1720605600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CFT at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CFT at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-cft-at-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T150000Z
DTEND:20240710T160000Z
DTSTAMP:20260420T000938
CREATED:20240529T145201Z
LAST-MODIFIED:20240529T145201Z
UID:26752-1720605600-1720609200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-21/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T160000Z
DTEND:20240710T170000Z
DTSTAMP:20260420T000938
CREATED:20240626T161217Z
LAST-MODIFIED:20240626T161217Z
UID:26892-1720609200-1720612800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-11/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T200000Z
DTEND:20240710T210000Z
DTSTAMP:20260420T000938
CREATED:20240625T202541Z
LAST-MODIFIED:20240625T202541Z
UID:26891-1720623600-1720627200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue pulling things together to move from Idea to Definition 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-2/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T150000Z
DTEND:20240711T160000Z
DTSTAMP:20260420T000938
CREATED:20240529T153334Z
LAST-MODIFIED:20240529T153334Z
UID:26753-1720692000-1720695600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-32/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T200000Z
DTEND:20240711T210000Z
DTSTAMP:20260420T000938
CREATED:20240626T183539Z
LAST-MODIFIED:20240626T183539Z
UID:26894-1720710000-1720713600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Starting on final report \nStatus on drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-25/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240716T150000Z
DTEND:20240716T160000Z
DTSTAMP:20260420T000938
CREATED:20240618T151837Z
LAST-MODIFIED:20240618T151837Z
UID:26808-1721124000-1721127600@hdpusergroup.org
SUMMARY:Better CAF eq
DESCRIPTION:Status update on testing \nPossible further discussion on data already colllected 
URL:https://hdpusergroup.org/event/better-caf-eq-39/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T010000Z
DTEND:20240717T020000Z
DTSTAMP:20260420T000938
CREATED:20240703T020328Z
LAST-MODIFIED:20240703T020328Z
UID:26974-1721160000-1721163600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-2/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T140000Z
DTEND:20240717T150000Z
DTSTAMP:20260420T000938
CREATED:20240612T141254Z
LAST-MODIFIED:20240612T141254Z
UID:26792-1721206800-1721210400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-10/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240717T160000Z
DTEND:20240717T170000Z
DTSTAMP:20260420T000938
CREATED:20240613T163408Z
LAST-MODIFIED:20240613T163408Z
UID:26802-1721214000-1721217600@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Backdrill Via Transition Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T140000Z
DTEND:20240718T150000Z
DTSTAMP:20260420T000938
CREATED:20240620T141945Z
LAST-MODIFIED:20240620T141945Z
UID:26818-1721293200-1721296800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-27/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T150000Z
DTEND:20240718T160000Z
DTSTAMP:20260420T000938
CREATED:20240716T160530Z
LAST-MODIFIED:20240716T160530Z
UID:27043-1721296800-1721300400@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Hopefully ressolve any difficulties 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-2/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T210000Z
DTEND:20240718T220000Z
DTSTAMP:20260420T000938
CREATED:20240627T220403Z
LAST-MODIFIED:20240627T220403Z
UID:26899-1721318400-1721322000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240718T230000Z
DTEND:20240719T000000Z
DTSTAMP:20260420T000938
CREATED:20240628T005745Z
LAST-MODIFIED:20240628T005745Z
UID:26900-1721325600-1721329200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/porosity-10/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240719T150000Z
DTEND:20240719T160000Z
DTSTAMP:20260420T000938
CREATED:20240711T175331Z
LAST-MODIFIED:20240711T175331Z
UID:27033-1721383200-1721386800@hdpusergroup.org
SUMMARY:permittivity of cooling fluids
DESCRIPTION:Study of non PFAS cooling fluids under time and temperature excursions 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-6/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240723T150000Z
DTEND:20240723T160000Z
DTSTAMP:20260420T000938
CREATED:20240708T162242Z
LAST-MODIFIED:20240708T162242Z
UID:27021-1721728800-1721732400@hdpusergroup.org
SUMMARY:Microvia Reliability
DESCRIPTION:Continuing to review final report 
URL:https://hdpusergroup.org/event/microvia-reliability-4/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240724T140000Z
DTEND:20240724T150000Z
DTSTAMP:20260420T000938
CREATED:20240710T141037Z
LAST-MODIFIED:20240710T141037Z
UID:27024-1721811600-1721815200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-12/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240724T150000Z
DTEND:20240724T160000Z
DTSTAMP:20260420T000938
CREATED:20240710T165503Z
LAST-MODIFIED:20240710T165503Z
UID:27026-1721815200-1721818800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-12/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T140000Z
DTEND:20240725T150000Z
DTSTAMP:20260420T000938
CREATED:20240718T160104Z
LAST-MODIFIED:20240718T160104Z
UID:27052-1721898000-1721901600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Response from Singapore \nNext steps 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T150000Z
DTEND:20240725T160000Z
DTSTAMP:20260420T000938
CREATED:20240627T153219Z
LAST-MODIFIED:20240627T153219Z
UID:26896-1721901600-1721905200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-13/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T200000Z
DTEND:20240725T210000Z
DTSTAMP:20260420T000938
CREATED:20240710T202911Z
LAST-MODIFIED:20240710T202911Z
UID:27027-1721919600-1721923200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping out the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-3/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240729T150000Z
DTEND:20240729T160000Z
DTSTAMP:20260420T000938
CREATED:20240708T160728Z
LAST-MODIFIED:20240708T160728Z
UID:27020-1722247200-1722250800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency  
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-49/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240731T150000Z
DTEND:20240731T160000Z
DTSTAMP:20260420T000938
CREATED:20240710T155645Z
LAST-MODIFIED:20240710T155645Z
UID:27025-1722420000-1722423600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-22/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240801T010000Z
DTEND:20240801T020000Z
DTSTAMP:20260420T000938
CREATED:20240717T021607Z
LAST-MODIFIED:20240717T021607Z
UID:27044-1722456000-1722459600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-3/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR