BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240501T140000Z
DTEND:20240501T150000Z
DTSTAMP:20260420T042217
CREATED:20240327T152727Z
LAST-MODIFIED:20240327T152727Z
UID:26002-1714554000-1714557600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-10/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240501T150000Z
DTEND:20240501T160000Z
DTSTAMP:20260420T042217
CREATED:20240417T172806Z
LAST-MODIFIED:20240417T172806Z
UID:26246-1714557600-1714561200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-7/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240502T140000Z
DTEND:20240502T150000Z
DTSTAMP:20260420T042217
CREATED:20240402T153306Z
LAST-MODIFIED:20240402T153306Z
UID:26036-1714640400-1714644000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-29/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240502T150000Z
DTEND:20240502T160000Z
DTSTAMP:20260420T042217
CREATED:20240419T133729Z
LAST-MODIFIED:20240419T133729Z
UID:26268-1714644000-1714647600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-23/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240502T200000Z
DTEND:20240502T210000Z
DTSTAMP:20260420T042217
CREATED:20240418T202136Z
LAST-MODIFIED:20240418T202136Z
UID:26253-1714662000-1714665600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Drop and ATC updates 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-24/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240506T160000Z
DTEND:20240506T170000Z
DTSTAMP:20260420T042217
CREATED:20240430T215134Z
LAST-MODIFIED:20240430T215134Z
UID:26301-1714993200-1714996800@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Review results and align tasks for microsectioning and data collection 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-13/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240506T230000Z
DTEND:20240507T000000Z
DTSTAMP:20260420T042217
CREATED:20240503T133801Z
LAST-MODIFIED:20240503T133801Z
UID:26282-1715018400-1715022000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Talk about: flow chart\, test methods\, short list of finishes\, who will test what\, contact with Penn State and Mike Carano. 
URL:https://hdpusergroup.org/event/porosity-7/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240507T160000Z
DTEND:20240507T170000Z
DTSTAMP:20260420T042217
CREATED:20240423T164547Z
LAST-MODIFIED:20240423T164547Z
UID:26280-1715079600-1715083200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-10/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240507T180000Z
DTEND:20240507T190000Z
DTSTAMP:20260420T042217
CREATED:20240501T170907Z
LAST-MODIFIED:20240501T170907Z
UID:26306-1715086800-1715090400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Pogress on final report. \nIdeas for next project? 
URL:https://hdpusergroup.org/event/microvia-rel-46/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240508T140000Z
DTEND:20240508T150000Z
DTSTAMP:20260420T042217
CREATED:20240327T144355Z
LAST-MODIFIED:20240327T144355Z
UID:26001-1715158800-1715162400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-8/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240509T140000Z
DTEND:20240509T150000Z
DTSTAMP:20260420T042217
CREATED:20240502T144439Z
LAST-MODIFIED:20240502T144439Z
UID:26310-1715245200-1715248800@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-30/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240509T210000Z
DTEND:20240509T220000Z
DTSTAMP:20260420T042217
CREATED:20240418T222859Z
LAST-MODIFIED:20240418T222859Z
UID:26265-1715270400-1715274000@hdpusergroup.org
SUMMARY:Idea discussion: Glass substrates for IC packages
DESCRIPTION:Idea discussion: Glass substrates for IC packages (Please bring any shareable information with us) \n 
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240510T010000Z
DTEND:20240510T020000Z
DTSTAMP:20260420T042217
CREATED:20240430T042437Z
LAST-MODIFIED:20240430T042437Z
UID:26298-1715284800-1715288400@hdpusergroup.org
SUMMARY:Kinwong Onboard Orientation Call
DESCRIPTION:Kinwong Onboard Orientation Call 
URL:https://hdpusergroup.org/event/kinwong-onboard-orientation-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240510T150000Z
DTEND:20240510T160000Z
DTSTAMP:20260420T042217
CREATED:20240429T162145Z
LAST-MODIFIED:20240429T162145Z
UID:26295-1715335200-1715338800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-46/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240513T150000Z
DTEND:20240513T160000Z
DTSTAMP:20260420T042217
CREATED:20240512T231709Z
LAST-MODIFIED:20240512T231709Z
UID:26529-1715594400-1715598000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Test status updates \nReview Member Meeting presentation 
URL:https://hdpusergroup.org/event/better-caf-eq-37/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240514T160000Z
DTEND:20240514T170000Z
DTSTAMP:20260420T042217
CREATED:20240430T150305Z
LAST-MODIFIED:20240430T150305Z
UID:26300-1715684400-1715688000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Are we ready to build? \nLook at presentation for Member Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-12/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T140000Z
DTEND:20240515T150000Z
DTSTAMP:20260420T042217
CREATED:20240501T144845Z
LAST-MODIFIED:20240501T144845Z
UID:26303-1715763600-1715767200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-11/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T150000Z
DTEND:20240515T160000Z
DTSTAMP:20260420T042217
CREATED:20240501T155522Z
LAST-MODIFIED:20240501T155522Z
UID:26304-1715767200-1715770800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting \n  \n  \n  
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T200000Z
DTEND:20240515T210000Z
DTSTAMP:20260420T042217
CREATED:20240507T141541Z
LAST-MODIFIED:20240507T141541Z
UID:26356-1715785200-1715788800@hdpusergroup.org
SUMMARY:NEW PROJECT - Outer Trace Adhesion
DESCRIPTION:HDP recently completed a project about the adhesion strength of inner layer copper traces.  This new project proposes to investigate and validate a quantitative test method for determining the adhesion strength of ultra thin traces on the outside of a PCB.  Come bring your ideas to this kick-off meeting. 
URL:https://hdpusergroup.org/event/new-project-outer-trace-adhesion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240516T140000Z
DTEND:20240516T150000Z
DTSTAMP:20260420T042217
CREATED:20240502T152547Z
LAST-MODIFIED:20240502T152547Z
UID:26311-1715850000-1715853600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-24/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240517T010000Z
DTEND:20240517T020000Z
DTSTAMP:20260420T042217
CREATED:20240507T135008Z
LAST-MODIFIED:20240507T135008Z
UID:26353-1715889600-1715893200@hdpusergroup.org
SUMMARY:Dry run with linked agenda and final presentations
DESCRIPTION:Dry run on linked presentations and final copies and ID of presenters. 
URL:https://hdpusergroup.org/event/dry-run-with-linked-agenda-and-final-presentations/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240521T060000Z
DTEND:20240521T080000Z
DTSTAMP:20260420T042217
CREATED:20240517T012727Z
LAST-MODIFIED:20240517T012727Z
UID:26600-1716253200-1716260400@hdpusergroup.org
SUMMARY:Internet and AV check at Co-Tech for Member Meeting
DESCRIPTION:Internet and AV check at Co-Tech for Member Meeting 
URL:https://hdpusergroup.org/event/internet-and-av-check-at-co-tech-for-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240522T010000Z
DTEND:20240522T093000Z
DTSTAMP:20260420T042217
CREATED:20240516T162631Z
LAST-MODIFIED:20240516T162631Z
UID:25021-1716321600-1716352200@hdpusergroup.org
SUMMARY:HDP May Asia 2024 Member Meeting
DESCRIPTION: \nThe HDP May 2024 Asia Meeting will be held on May 22 & 23\, 2024 (Taiwan Time) / May 21 & 22 (US Time) in Taipei\, Taiwan.  The meeting will be hosted by Co-Tech.  Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews\, at kima77@hdpug.org \nThe meeting will also be available virtually.  \nMeeting Location: \nCo-Tech HeadquartersNo.392\, Ruiguang Rd.\, Neihu Dist.Taipei City 114\, Taiwan\, R.O.C. \nHotel: \nGrand Victoria Hotel Taipei (5-minute walk from Jiannan Road Station)No. 168\, Jingye 4th Rd\, Zhongshan DistrictTaipei City\, Taiwan 10491Tel: +886 2 8502 0000 \nhttps://grandvictoria.com.tw/ \nCo-Tech has assisted HDP in receiving a special corporate room rate:Standard Room with breakfast NT$ 4800 (~ 153.11 USD)Reservation deadline for rooms is end of April 2024\, after this date the rate will increase to NT$ 5830 (~187.29 USD)For reservations you can contact the HDP Business Manager\, include your hotel request when using the registration form on this page\, or email the hotel directly (be sure to state that you are an HDP May 2024 Asia Member Meeting guest) at: \nsamuel.chen@grandvictoria.com.tw \nres@grandvictoria.com.tw \nCall information (call ics files are available for download at the bottom of this page) \nDay 1Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m1dc538a0587e2ac60ac80303b53b851dJoin by meeting numberMeeting number (access code): 2555 542 1916Meeting password: HDPAsia2024Day1Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n \nDay 2Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m72c9df2b89624a3dd3c250725f402cd8Join by meeting numberMeeting number (access code): 2555 457 7864Meeting password: HDPAsia2024Day2Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-may-asia-2024-member-meeting/2024-05-22/
LOCATION:Taipei\, Taiwan
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240524T150000Z
DTEND:20240524T160000Z
DTSTAMP:20260420T042217
CREATED:20240514T174848Z
LAST-MODIFIED:20240514T174848Z
UID:26551-1716544800-1716548400@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Singapore good to go? 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-13/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240528T170000Z
DTEND:20240528T180000Z
DTSTAMP:20260420T042217
CREATED:20240501T143337Z
LAST-MODIFIED:20240501T143337Z
UID:26302-1716897600-1716901200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-8/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T140000Z
DTEND:20240529T150000Z
DTSTAMP:20260420T042217
CREATED:20240509T200923Z
LAST-MODIFIED:20240509T200923Z
UID:26283-1716973200-1716976800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-20/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T150000Z
DTEND:20240529T160000Z
DTSTAMP:20260420T042217
CREATED:20240509T204630Z
LAST-MODIFIED:20240509T204630Z
UID:26440-1716976800-1716980400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-31/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T160000Z
DTEND:20240529T170000Z
DTSTAMP:20260420T042217
CREATED:20240507T222818Z
LAST-MODIFIED:20240507T222818Z
UID:26245-1716980400-1716984000@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Backdrill Via Transition Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition-2/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240529T230000Z
DTEND:20240530T000000Z
DTSTAMP:20260420T042217
CREATED:20240506T233713Z
LAST-MODIFIED:20240506T233713Z
UID:26334-1717005600-1717009200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue working on project definition 
URL:https://hdpusergroup.org/event/porosity-8/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240530T160000Z
DTEND:20240530T170000Z
DTSTAMP:20260420T042217
CREATED:20240507T164018Z
LAST-MODIFIED:20240507T164018Z
UID:26363-1717066800-1717070400@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-11/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR