BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240401T150000Z
DTEND:20240401T160000Z
DTSTAMP:20260420T045207
CREATED:20240318T154943Z
LAST-MODIFIED:20240318T154943Z
UID:25896-1711965600-1711969200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-44/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240401T170000Z
DTEND:20240401T180000Z
DTSTAMP:20260420T045207
CREATED:20240329T193428Z
LAST-MODIFIED:20240329T193428Z
UID:25887-1711972800-1711976400@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Updates on ATC and drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-2-20/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240402T150000Z
DTEND:20240402T160000Z
DTSTAMP:20260420T045207
CREATED:20240307T164647Z
LAST-MODIFIED:20240307T164647Z
UID:25842-1712052000-1712055600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-28/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240402T170000Z
DTEND:20240402T180000Z
DTSTAMP:20260420T045207
CREATED:20240305T182809Z
LAST-MODIFIED:20240305T182809Z
UID:25819-1712059200-1712062800@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240404T170000Z
DTEND:20240404T180000Z
DTSTAMP:20260420T045207
CREATED:20240326T171328Z
LAST-MODIFIED:20240326T171328Z
UID:25995-1712232000-1712235600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Result of Singapore's examination of document packet \nArranging shippment of materials 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240417T150000Z
DTEND:20240417T160000Z
DTSTAMP:20260420T045207
CREATED:20240328T170546Z
LAST-MODIFIED:20240328T170546Z
UID:26022-1713348000-1713351600@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-6/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240417T160000Z
DTEND:20240417T170000Z
DTSTAMP:20260420T045207
CREATED:20240329T234821Z
LAST-MODIFIED:20240329T234821Z
UID:26025-1713351600-1713355200@hdpusergroup.org
SUMMARY:Backdrill Via Transition
DESCRIPTION:Backdrill Via Transition Project Meeting 
URL:https://hdpusergroup.org/event/backdrill-via-transition/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240417T170000Z
DTEND:20240417T180000Z
DTSTAMP:20260420T045207
CREATED:20240404T165422Z
LAST-MODIFIED:20240404T165422Z
UID:26122-1713355200-1713358800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Writing final report 
URL:https://hdpusergroup.org/event/microvia-rel-45/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240417T200000Z
DTEND:20240417T210000Z
DTSTAMP:20260420T045207
CREATED:20240413T002712Z
LAST-MODIFIED:20240413T002712Z
UID:26229-1713366000-1713369600@hdpusergroup.org
SUMMARY:New UL Project Idea Coordination Meeting
DESCRIPTION:New Idea Project Coordination Meeting with UL 
URL:https://hdpusergroup.org/event/new-ul-project-idea-coordination-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240417T210000Z
DTEND:20240417T220000Z
DTSTAMP:20260420T045207
CREATED:20240416T162009Z
LAST-MODIFIED:20240416T162009Z
UID:26235-1713369600-1713373200@hdpusergroup.org
SUMMARY:Call with Gary – Project Planning
DESCRIPTION:Discuss workaround plan 
URL:https://hdpusergroup.org/event/call-with-gary-project-planning/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240418T050000Z
DTEND:20240419T045959Z
DTSTAMP:20260420T045207
CREATED:20240416T135344Z
LAST-MODIFIED:20240426T002543Z
UID:26234-1713398400-1713484799@hdpusergroup.org
SUMMARY:HDP App Testing
DESCRIPTION:Call to review how to access the HDP app for testing and testing goals.\n\n
URL:https://hdpusergroup.org/event/hdp-app-testing/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240418T140000Z
DTEND:20240418T150000Z
DTSTAMP:20260420T045207
CREATED:20240314T153126Z
LAST-MODIFIED:20240314T153126Z
UID:25884-1713430800-1713434400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-22/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240418T160000Z
DTEND:20240418T170000Z
DTSTAMP:20260420T045207
CREATED:20240329T235557Z
LAST-MODIFIED:20240329T235557Z
UID:26026-1713438000-1713441600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Project Phase 1 and 2
DESCRIPTION:Inner Layer Local Copper Balancing Project 1 and 2 Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-project-phase-1-and-2/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240418T200000Z
DTEND:20240418T210000Z
DTSTAMP:20260420T045207
CREATED:20240401T173903Z
LAST-MODIFIED:20240401T173903Z
UID:26032-1713452400-1713456000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Updates on drop and ATC testing 
URL:https://hdpusergroup.org/event/photonic-soldering-2-21/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240418T210000Z
DTEND:20240418T220000Z
DTSTAMP:20260420T045207
CREATED:20240329T213906Z
LAST-MODIFIED:20240329T213906Z
UID:26024-1713456000-1713459600@hdpusergroup.org
SUMMARY:Idea discussion: Glass substrates for IC packages
DESCRIPTION:Idea discussion: Glass substrates for IC packages 
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T060000Z
DTEND:20240423T070000Z
DTSTAMP:20260420T045207
CREATED:20240422T103546Z
LAST-MODIFIED:20240422T103546Z
UID:26275-1713834000-1713837600@hdpusergroup.org
SUMMARY:Co Tech HDP AV Internet Check for May Member Meeting
DESCRIPTION:Co Tech HDP AV Internet Check for May Member Meeting 
URL:https://hdpusergroup.org/event/co-tech-hdp-av-internet-check-for-may-member-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T150000Z
DTEND:20240423T160000Z
DTSTAMP:20260420T045207
CREATED:20240404T171023Z
LAST-MODIFIED:20240404T171023Z
UID:26123-1713866400-1713870000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Any questions from Sanmina Singapore? Others? \nAmount of material needed? 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-11/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T160000Z
DTEND:20240423T170000Z
DTSTAMP:20260420T045207
CREATED:20240327T164249Z
LAST-MODIFIED:20240327T164249Z
UID:26008-1713870000-1713873600@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-9/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240423T230000Z
DTEND:20240424T000000Z
DTSTAMP:20260420T045207
CREATED:20240326T235502Z
LAST-MODIFIED:20240326T235502Z
UID:25999-1713895200-1713898800@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/porosity-6/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240424T140000Z
DTEND:20240424T150000Z
DTSTAMP:20260420T045207
CREATED:20240403T161922Z
LAST-MODIFIED:20240403T161922Z
UID:25840-1713949200-1713952800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-19/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240425T010000Z
DTEND:20240425T020000Z
DTSTAMP:20260420T045207
CREATED:20240326T045447Z
LAST-MODIFIED:20240326T045447Z
UID:25980-1713988800-1713992400@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call-4/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240426T180000Z
DTEND:20240426T190000Z
DTSTAMP:20260420T045207
CREATED:20240424T170552Z
LAST-MODIFIED:20240424T170552Z
UID:26286-1714136400-1714140000@hdpusergroup.org
SUMMARY:Call to discuss short Tech Direction slides
DESCRIPTION:Call to review slides 
URL:https://hdpusergroup.org/event/call-to-discuss-short-tech-direction-slides/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240429T153000Z
DTEND:20240429T163000Z
DTSTAMP:20260420T045207
CREATED:20240418T223306Z
LAST-MODIFIED:20240418T223306Z
UID:26030-1714386600-1714390200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-45/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240430T170000Z
DTEND:20240430T180000Z
DTSTAMP:20260420T045207
CREATED:20240402T193521Z
LAST-MODIFIED:20240402T193521Z
UID:26056-1714478400-1714482000@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations -- Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-7/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR