BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240304T160000Z
DTEND:20240304T170000Z
DTSTAMP:20260420T062230
CREATED:20240219T170817Z
LAST-MODIFIED:20240219T170817Z
UID:25692-1709546400-1709550000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-42/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240305T000000Z
DTEND:20240305T010000Z
DTSTAMP:20260420T062230
CREATED:20240310T164841Z
LAST-MODIFIED:20240310T164841Z
UID:25659-1709575200-1709578800@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Viable project or not? 
URL:https://hdpusergroup.org/event/porosity-3/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240305T160000Z
DTEND:20240305T170000Z
DTSTAMP:20260420T062230
CREATED:20240213T165839Z
LAST-MODIFIED:20240213T165839Z
UID:25656-1709632800-1709636400@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-7/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240305T180000Z
DTEND:20240305T190000Z
DTSTAMP:20260420T062230
CREATED:20240206T182331Z
LAST-MODIFIED:20240206T182331Z
UID:25527-1709640000-1709643600@hdpusergroup.org
SUMMARY:HDP Harsh USe Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-6/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240306T150000Z
DTEND:20240306T160000Z
DTSTAMP:20260420T062230
CREATED:20240131T153011Z
LAST-MODIFIED:20240131T153011Z
UID:25416-1709715600-1709719200@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-6/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240306T160000Z
DTEND:20240306T170000Z
DTSTAMP:20260420T062230
CREATED:20240202T154816Z
LAST-MODIFIED:20240202T154816Z
UID:25423-1709719200-1709722800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-8/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240306T170000Z
DTEND:20240306T180000Z
DTSTAMP:20260420T062230
CREATED:20240222T165519Z
LAST-MODIFIED:20240222T165519Z
UID:25694-1709722800-1709726400@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-4/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240306T190000Z
DTEND:20240306T200000Z
DTSTAMP:20260420T062230
CREATED:20240215T195901Z
LAST-MODIFIED:20240215T195901Z
UID:25675-1709730000-1709733600@hdpusergroup.org
SUMMARY:PFAS Discussion
DESCRIPTION:Discussion Meeting 
URL:https://hdpusergroup.org/event/pfas-discussion-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240306T200000Z
DTEND:20240306T210000Z
DTSTAMP:20260420T062230
CREATED:20240304T204110Z
LAST-MODIFIED:20240304T204110Z
UID:25807-1709733600-1709737200@hdpusergroup.org
SUMMARY:Discussion on Packaging
DESCRIPTION:Discussion with Larry Smith on Adv Packaging 
URL:https://hdpusergroup.org/event/discussion-on-packaging/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240307T140000Z
DTEND:20240307T150000Z
DTSTAMP:20260420T062230
CREATED:20240208T141457Z
LAST-MODIFIED:20240208T141457Z
UID:25591-1709798400-1709802000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Jason and Hubert. 
URL:https://hdpusergroup.org/event/better-caf-eq-36/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240307T150000Z
DTEND:20240307T160000Z
DTSTAMP:20260420T062230
CREATED:20240207T211421Z
LAST-MODIFIED:20240207T211421Z
UID:25580-1709802000-1709805600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-18/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240307T160000Z
DTEND:20240307T170000Z
DTSTAMP:20260420T062230
CREATED:20240207T152705Z
LAST-MODIFIED:20240207T152705Z
UID:25570-1709805600-1709809200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-27/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240307T170000Z
DTEND:20240307T180000Z
DTSTAMP:20260420T062230
CREATED:20240126T165614Z
LAST-MODIFIED:20240126T165614Z
UID:25399-1709809200-1709812800@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Project 1 and 2
DESCRIPTION:Project Meeting - WebEx 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-project-1-and-2/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240307T180000Z
DTEND:20240307T190000Z
DTSTAMP:20260420T062230
CREATED:20240304T140904Z
LAST-MODIFIED:20240304T140904Z
UID:25780-1709812800-1709816400@hdpusergroup.org
SUMMARY:Meeting with Karl on 2024 Objectives
DESCRIPTION:2024 Contract 
URL:https://hdpusergroup.org/event/meeting-with-karl-on-2024-objectives/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240312T010000Z
DTEND:20240312T020000Z
DTSTAMP:20260420T062230
CREATED:20240307T133607Z
LAST-MODIFIED:20240307T133607Z
UID:25839-1710187200-1710190800@hdpusergroup.org
SUMMARY:Kinwong and HDP Introductory Meeting
DESCRIPTION:Kinwong and HDP Introductory Meeting 
URL:https://hdpusergroup.org/event/kinwong-and-hdp-introductory-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240312T160000Z
DTEND:20240312T170000Z
DTSTAMP:20260420T062230
CREATED:20240213T194216Z
LAST-MODIFIED:20240213T194216Z
UID:25657-1710241200-1710244800@hdpusergroup.org
SUMMARY:High Speed Test Coupon New Idea Project
DESCRIPTION:Many OEMs are relying on Delta-L 3.0\, 4.0\, and similar ~20 GHz test coupons to ensure good board performance in the field. Of greatest concern are PCB manufacturing process changes that are not sufficiently detectable by standard TDR testing. These potential changes include core surface alternate oxide treatment\, copper foil\, glass style/weave and/or glass type. However\, published test data showing the limits of the sensitivity of current higher speed process monitoring test coupons to these changes is lacking. Also\, a follow-on HDP project phase may identify how much better certain process controls\, such as for dielectric thickness\, may need to be for boards operating at 60-70 GHz. 
URL:https://hdpusergroup.org/event/high-speed-test-coupon-new-idea-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240312T230000Z
DTEND:20240313T000000Z
DTSTAMP:20260420T062230
CREATED:20240311T013327Z
LAST-MODIFIED:20240311T013327Z
UID:25817-1710266400-1710270000@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Do we have a team leader? \nMethodlogy\, finishes and pass/fail criteria \nWho does what? 
URL:https://hdpusergroup.org/event/porosity-4/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240313T160000Z
DTEND:20240313T170000Z
DTSTAMP:20260420T062230
CREATED:20240207T223354Z
LAST-MODIFIED:20240207T223354Z
UID:25584-1710327600-1710331200@hdpusergroup.org
SUMMARY:Backdrill Transition Project
DESCRIPTION:HDP Backdrill Via Transition Project meeting 
URL:https://hdpusergroup.org/event/backdrill-transition-project-5/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240314T150000Z
DTEND:20240314T160000Z
DTSTAMP:20260420T062230
CREATED:20240214T164351Z
LAST-MODIFIED:20240214T164351Z
UID:25661-1710410400-1710414000@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-21/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240314T160000Z
DTEND:20240314T170000Z
DTSTAMP:20260420T062230
CREATED:20240215T184105Z
LAST-MODIFIED:20240215T184105Z
UID:25673-1710414000-1710417600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Any further analysis? \nReport writing \nNext project? 
URL:https://hdpusergroup.org/event/microvia-rel-44/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240314T170000Z
DTEND:20240314T180000Z
DTSTAMP:20260420T062230
CREATED:20240215T184251Z
LAST-MODIFIED:20240215T184251Z
UID:25674-1710417600-1710421200@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Drop and ATC updates 
URL:https://hdpusergroup.org/event/photonic-soldering-2-19/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240314T180000Z
DTEND:20240314T190000Z
DTSTAMP:20260420T062230
CREATED:20240306T201622Z
LAST-MODIFIED:20240306T201622Z
UID:25833-1710421200-1710424800@hdpusergroup.org
SUMMARY:PFAS Discussion
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/march-6-200-pm-300-pm-est-pfas-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240318T140000Z
DTEND:20240318T143000Z
DTSTAMP:20260420T062230
CREATED:20240318T135643Z
LAST-MODIFIED:20240318T135643Z
UID:25891-1710752400-1710754200@hdpusergroup.org
SUMMARY:Kim Mobile Testing
DESCRIPTION:Testing joinin meetings using mobile devices. Round 1 
URL:https://hdpusergroup.org/event/kim-mobile-testing/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240318T150000Z
DTEND:20240318T160000Z
DTSTAMP:20260420T062230
CREATED:20240304T162504Z
LAST-MODIFIED:20240304T162504Z
UID:25799-1710756000-1710759600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-43/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240321T140000Z
DTEND:20240321T150000Z
DTSTAMP:20260420T062230
CREATED:20240319T151829Z
LAST-MODIFIED:20240319T151829Z
UID:25902-1711011600-1711015200@hdpusergroup.org
SUMMARY:Call to discuss webex issues and training
DESCRIPTION:Call to discuss Webex issues and training 
URL:https://hdpusergroup.org/event/call-to-discuss-webex-issues-and-training/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240321T150000Z
DTEND:20240321T160000Z
DTSTAMP:20260420T062230
CREATED:20240321T124843Z
LAST-MODIFIED:20240321T124843Z
UID:25901-1711015200-1711018800@hdpusergroup.org
SUMMARY:Call to discuss Tech Direction Slides
DESCRIPTION:Call to discuss slide presentation 
URL:https://hdpusergroup.org/event/call-to-discuss-tech-direction-slides/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240325T160000Z
DTEND:20240325T170000Z
DTSTAMP:20260420T062230
CREATED:20240315T153919Z
LAST-MODIFIED:20240315T153919Z
UID:25888-1711364400-1711368000@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:REview latest results of the Huray model project. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-11/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240326T010000Z
DTEND:20240326T020000Z
DTSTAMP:20260420T062230
CREATED:20240131T013018Z
LAST-MODIFIED:20240131T013018Z
UID:25415-1711396800-1711400400@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call-3/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240326T170000Z
DTEND:20240326T180000Z
DTSTAMP:20260420T062230
CREATED:20240320T234508Z
LAST-MODIFIED:20240320T234508Z
UID:25907-1711454400-1711458000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Discuss info package for Sanmina 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-10/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240326T230000Z
DTEND:20240327T000000Z
DTSTAMP:20260420T062230
CREATED:20240312T234918Z
LAST-MODIFIED:20240312T234918Z
UID:25863-1711476000-1711479600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Nail down test methods\, finishes and work and who will do what. 
URL:https://hdpusergroup.org/event/porosity-5/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR