BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230802T160000Z
DTEND:20230802T170000Z
DTSTAMP:20260420T175514
CREATED:20230628T164723Z
LAST-MODIFIED:20230628T164723Z
UID:24346-1690974000-1690977600@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Historically\, UL considered glass reinforcement an inert portion of the laminate composition. Glass styles were tested within a range of thicknesses. Recently UL has data showing differences in performance between E-glass and Low Dk-glass. Modern circuit design trends require Low Dk-glass  for microvia technology requirements\, improving CAF\, and extending the usable frequency range.The question is how these glass trends affect the laminate performance from a short term and long term degradation perspective? This project will evaluate the need for additional testing of Low Dk glass types.  
URL:https://hdpusergroup.org/event/glass-type-comparison-4/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230802T190000Z
DTEND:20230802T200000Z
DTSTAMP:20260420T175514
CREATED:20230727T002129Z
LAST-MODIFIED:20230727T002129Z
UID:24417-1690984800-1690988400@hdpusergroup.org
SUMMARY:Non-glass Microvias
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/non-glass-microvias/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230802T200000Z
DTEND:20230802T210000Z
DTSTAMP:20260420T175514
CREATED:20230731T200211Z
LAST-MODIFIED:20230731T200211Z
UID:24432-1690988400-1690992000@hdpusergroup.org
SUMMARY:Call to discuss Artwork Conversion work
DESCRIPTION:Discuss PO 
URL:https://hdpusergroup.org/event/call-to-discuss-artwork-conversion-work/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230803T160000Z
DTEND:20230803T170000Z
DTSTAMP:20260420T175514
CREATED:20230713T161944Z
LAST-MODIFIED:20230713T161944Z
UID:24370-1691060400-1691064000@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-call/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230807T150000Z
DTEND:20230807T160000Z
DTSTAMP:20260420T175514
CREATED:20230717T154424Z
LAST-MODIFIED:20230717T154424Z
UID:24383-1691402400-1691406000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequncy 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-27/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230808T160000Z
DTEND:20230808T170000Z
DTSTAMP:20260420T175514
CREATED:20230719T021242Z
LAST-MODIFIED:20230719T021242Z
UID:24389-1691492400-1691496000@hdpusergroup.org
SUMMARY:cu Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness.This new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-10/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230808T230000Z
DTEND:20230808T233000Z
DTSTAMP:20260420T175514
CREATED:20230808T132509Z
LAST-MODIFIED:20230808T132509Z
UID:24452-1691517600-1691519400@hdpusergroup.org
SUMMARY:test webex sync from prod
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/test-webex-sync-from-prod/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230809T150000Z
DTEND:20230809T160000Z
DTSTAMP:20260420T175514
CREATED:20230713T154709Z
LAST-MODIFIED:20230713T154709Z
UID:24369-1691575200-1691578800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-10/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230810T150000Z
DTEND:20230810T160000Z
DTSTAMP:20260420T175514
CREATED:20230720T152029Z
LAST-MODIFIED:20230720T152029Z
UID:24397-1691661600-1691665200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-12/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230810T200000Z
DTEND:20230810T210000Z
DTSTAMP:20260420T175514
CREATED:20230727T193922Z
LAST-MODIFIED:20230727T193922Z
UID:24423-1691679600-1691683200@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Progress on ATC and drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-22/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230815T160000Z
DTEND:20230815T170000Z
DTSTAMP:20260420T175514
CREATED:20230720T211107Z
LAST-MODIFIED:20230720T211107Z
UID:24398-1692097200-1692100800@hdpusergroup.org
SUMMARY:Inner Layer Cu Balancing Call
DESCRIPTION:Discussion on latest results and phase 2 planning 
URL:https://hdpusergroup.org/event/inner-layer-cu-balancing-call/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230816T020000Z
DTEND:20230816T030000Z
DTSTAMP:20260420T175514
CREATED:20230627T095200Z
LAST-MODIFIED:20230627T095200Z
UID:24126-1692133200-1692136800@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-47/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230816T150000Z
DTEND:20230816T160000Z
DTSTAMP:20260420T175514
CREATED:20230719T151453Z
LAST-MODIFIED:20230719T151453Z
UID:24391-1692180000-1692183600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Status of progress of the build 
URL:https://hdpusergroup.org/event/microvia-rel-36/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230816T190000Z
DTEND:20230816T200000Z
DTSTAMP:20260420T175514
CREATED:20230802T195308Z
LAST-MODIFIED:20230802T195308Z
UID:24444-1692194400-1692198000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Examne Bob's layup \nAnyone willing to build? 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-2/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230817T140000Z
DTEND:20230817T150000Z
DTSTAMP:20260420T175514
CREATED:20230816T160528Z
LAST-MODIFIED:20230816T160528Z
UID:24507-1692262800-1692266400@hdpusergroup.org
SUMMARY:Call to discuss Cu Peel final report and Board request
DESCRIPTION:Discuss presentation and final report 
URL:https://hdpusergroup.org/event/call-to-discuss-cu-peel-final-report-and-board-request/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230817T150000Z
DTEND:20230817T160000Z
DTSTAMP:20260420T175514
CREATED:20230726T184036Z
LAST-MODIFIED:20230726T184036Z
UID:24415-1692266400-1692270000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-29/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230817T190000Z
DTEND:20230817T200000Z
DTSTAMP:20260420T175514
CREATED:20230727T155901Z
LAST-MODIFIED:20230727T155901Z
UID:24422-1692280800-1692284400@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-6/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230818T140000Z
DTEND:20230818T150000Z
DTSTAMP:20260420T175514
CREATED:20230728T141240Z
LAST-MODIFIED:20230728T141240Z
UID:24424-1692349200-1692352800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230818T150000Z
DTEND:20230818T160000Z
DTSTAMP:20260420T175514
CREATED:20230728T155552Z
LAST-MODIFIED:20230728T155552Z
UID:24425-1692352800-1692356400@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Cooling fluids used for immeresed electronic systems. \nMeasuring peformance and reliability. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids-5/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230821T150000Z
DTEND:20230821T160000Z
DTSTAMP:20260420T175514
CREATED:20230807T153141Z
LAST-MODIFIED:20230807T153141Z
UID:24446-1692612000-1692615600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-28/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230821T150000Z
DTEND:20230821T160000Z
DTSTAMP:20260420T175514
CREATED:20230807T153522Z
LAST-MODIFIED:20230807T153522Z
UID:24447-1692612000-1692615600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-29/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230821T150000Z
DTEND:20230821T160000Z
DTSTAMP:20260420T175514
CREATED:20230808T020423Z
LAST-MODIFIED:20230808T020423Z
UID:24448-1692612000-1692615600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-30/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230821T150000Z
DTEND:20230821T160000Z
DTSTAMP:20260420T175514
CREATED:20230808T133856Z
LAST-MODIFIED:20230808T133856Z
UID:24453-1692612000-1692615600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-31/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230822T170000Z
DTEND:20230822T180000Z
DTSTAMP:20260420T175514
CREATED:20230731T195715Z
LAST-MODIFIED:20230731T195715Z
UID:24431-1692705600-1692709200@hdpusergroup.org
SUMMARY:HDP Harsh USe Alloy Projects Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-projects-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230823T150000Z
DTEND:20230823T160000Z
DTSTAMP:20260420T175514
CREATED:20230726T153115Z
LAST-MODIFIED:20230726T153115Z
UID:24412-1692784800-1692788400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-20/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230823T170000Z
DTEND:20230823T180000Z
DTSTAMP:20260420T175514
CREATED:20230814T181934Z
LAST-MODIFIED:20230814T181934Z
UID:24384-1692792000-1692795600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Review progress on final report. \nReview proposed abstract for IPC APEX 2024 \nCritique Bev’s proposed mini-presentation on the project to be given at a one day SMTA Toronto event Oct 16th. 
URL:https://hdpusergroup.org/event/ta-method-16/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230824T200000Z
DTEND:20230824T210000Z
DTSTAMP:20260420T175514
CREATED:20230810T204750Z
LAST-MODIFIED:20230810T204750Z
UID:24466-1692889200-1692892800@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Progress on rel testing 
URL:https://hdpusergroup.org/event/photonic-soldering-2-10/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230825T140000Z
DTEND:20230825T150000Z
DTSTAMP:20260420T175514
CREATED:20230818T145711Z
LAST-MODIFIED:20230818T145711Z
UID:24520-1692954000-1692957600@hdpusergroup.org
SUMMARY:CAF Eq
DESCRIPTION:Testing update \nTalk about possiblity of additional testing 
URL:https://hdpusergroup.org/event/caf-eq-5/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230829T150000Z
DTEND:20230829T160000Z
DTSTAMP:20260420T175514
CREATED:20230825T141424Z
LAST-MODIFIED:20230825T141424Z
UID:24550-1693303200-1693306800@hdpusergroup.org
SUMMARY:Call with Matt
DESCRIPTION:Call to discuss HDP 
URL:https://hdpusergroup.org/event/call-with-matt-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230829T160000Z
DTEND:20230829T170000Z
DTSTAMP:20260420T175514
CREATED:20230808T164127Z
LAST-MODIFIED:20230808T164127Z
UID:24457-1693306800-1693310400@hdpusergroup.org
SUMMARY:Cu surface roughness model
DESCRIPTION:Continue review of the roughness for copper surface treatments. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-11/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR