BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230706T150000Z
DTEND:20230706T160000Z
DTSTAMP:20260420T193645
CREATED:20230703T133450Z
LAST-MODIFIED:20230703T133450Z
UID:24355-1688637600-1688641200@hdpusergroup.org
SUMMARY:Call with Mike to discuss new microvia project
DESCRIPTION:Call to discuss Julie's idea 
URL:https://hdpusergroup.org/event/call-with-mike-to-discuss-new-microvia-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230707T140000Z
DTEND:20230707T150000Z
DTSTAMP:20260420T193645
CREATED:20230617T135655Z
LAST-MODIFIED:20230617T135655Z
UID:24268-1688720400-1688724000@hdpusergroup.org
SUMMARY:Permittivity of Cooling Fluids
DESCRIPTION:Use of cooling fluids and measuring effectiveness of these fluids. Develope a model to predict performance of thwese fluids in terms of signal integrity and cooling performance. \nIn an immersion cooling system\, infrastructure equipment can be submerged in a non-conductive cooling liqui \nIdea is to develop a model to predict permittivity of different cooling liquids for improved reliability and energy efficiency \nCompare costs of each fluid vs other properties to determine best options. \nWhen using colling liquids for this application\, there is little understanding of the complex permittivity properties of these liquids \nThere are technical challenges that pose risks when trying to accurately model electrical performance of high-speed buses immersed in cooling liquids vs air \nWhat issues arise with permittivity when using different cooling liquids? \n  
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-2/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230712T150000Z
DTEND:20230712T160000Z
DTSTAMP:20260420T193645
CREATED:20230615T155559Z
LAST-MODIFIED:20230615T155559Z
UID:24265-1689156000-1689159600@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-27/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230712T190000Z
DTEND:20230712T200000Z
DTSTAMP:20260420T193645
CREATED:20230629T181456Z
LAST-MODIFIED:20230629T181456Z
UID:24342-1689170400-1689174000@hdpusergroup.org
SUMMARY:Nonglass Microvia Build-ups
DESCRIPTION:Continue working on the ideas for the project 
URL:https://hdpusergroup.org/event/nonglass-microvia-build-ups/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230713T133000Z
DTEND:20230713T143000Z
DTSTAMP:20260420T193645
CREATED:20230711T202738Z
LAST-MODIFIED:20230711T202738Z
UID:24362-1689237000-1689240600@hdpusergroup.org
SUMMARY:Call with Mike C
DESCRIPTION:Call to discuss Projects 
URL:https://hdpusergroup.org/event/call-with-mike-c/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230713T150000Z
DTEND:20230713T160000Z
DTSTAMP:20260420T193645
CREATED:20230614T153238Z
LAST-MODIFIED:20230614T153238Z
UID:24258-1689242400-1689246000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-9/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230713T160000Z
DTEND:20230713T170000Z
DTSTAMP:20260420T193645
CREATED:20230627T150132Z
LAST-MODIFIED:20230627T150132Z
UID:24341-1689246000-1689249600@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-6/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230714T140000Z
DTEND:20230714T150000Z
DTSTAMP:20260420T193645
CREATED:20230616T142014Z
LAST-MODIFIED:20230616T142014Z
UID:24267-1689325200-1689328800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230717T150000Z
DTEND:20230717T160000Z
DTSTAMP:20260420T193645
CREATED:20230626T153031Z
LAST-MODIFIED:20230626T153031Z
UID:24324-1689588000-1689591600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-26/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230718T160000Z
DTEND:20230718T170000Z
DTSTAMP:20260420T193645
CREATED:20230627T220413Z
LAST-MODIFIED:20230627T220413Z
UID:24343-1689678000-1689681600@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Continue discussion on Huray Roughness Modeling. Report on progress from TUC 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-5/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230718T170000Z
DTEND:20230718T180000Z
DTSTAMP:20260420T193645
CREATED:20230626T142859Z
LAST-MODIFIED:20230626T142859Z
UID:24280-1689681600-1689685200@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Progress on data analysis for final report 
URL:https://hdpusergroup.org/event/ta-mehod/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230719T010000Z
DTEND:20230719T020000Z
DTSTAMP:20260420T193645
CREATED:20230622T012106Z
LAST-MODIFIED:20230622T012106Z
UID:24294-1689710400-1689714000@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-9/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230719T150000Z
DTEND:20230719T160000Z
DTSTAMP:20260420T193645
CREATED:20230629T151659Z
LAST-MODIFIED:20230629T151659Z
UID:24350-1689760800-1689764400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Progress on builds 
URL:https://hdpusergroup.org/event/microvia-rel-35/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230720T150000Z
DTEND:20230720T160000Z
DTSTAMP:20260420T193645
CREATED:20230622T152507Z
LAST-MODIFIED:20230622T152507Z
UID:24296-1689847200-1689850800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-11/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230720T160000Z
DTEND:20230720T170000Z
DTSTAMP:20260420T193645
CREATED:20230626T152527Z
LAST-MODIFIED:20230626T152527Z
UID:24232-1689850800-1689854400@hdpusergroup.org
SUMMARY:Cu Balance Project Call
DESCRIPTION:  \nHad to move the call because of Gary’s work conflict. \nCall to discuss the latest measurement results.
URL:https://hdpusergroup.org/event/cu-balance-project-call/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230725T170000Z
DTEND:20230725T180000Z
DTSTAMP:20260420T193645
CREATED:20230703T150953Z
LAST-MODIFIED:20230703T150953Z
UID:24356-1690286400-1690290000@hdpusergroup.org
SUMMARY:HDP Harsh USe Alloy Evaluations project call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230726T150000Z
DTEND:20230726T160000Z
DTSTAMP:20260420T193645
CREATED:20230621T152650Z
LAST-MODIFIED:20230621T152650Z
UID:24290-1690365600-1690369200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-19/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230726T160000Z
DTEND:20230726T170000Z
DTSTAMP:20260420T193645
CREATED:20230719T020751Z
LAST-MODIFIED:20230719T020751Z
UID:24388-1690369200-1690372800@hdpusergroup.org
SUMMARY:Copper Surface Peel Strength 2
DESCRIPTION:Discuss final report and close out 
URL:https://hdpusergroup.org/event/copper-surface-peel-strength-2/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230726T180000Z
DTEND:20230726T190000Z
DTSTAMP:20260420T193645
CREATED:20230712T160506Z
LAST-MODIFIED:20230712T160506Z
UID:24365-1690376400-1690380000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-28/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230726T190000Z
DTEND:20230726T200000Z
DTSTAMP:20260420T193645
CREATED:20230712T194320Z
LAST-MODIFIED:20230712T194320Z
UID:24366-1690380000-1690383600@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Continue fleshing out the project 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230727T150000Z
DTEND:20230727T160000Z
DTSTAMP:20260420T193645
CREATED:20230628T193601Z
LAST-MODIFIED:20230628T193601Z
UID:24347-1690452000-1690455600@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-5/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230727T190000Z
DTEND:20230727T200000Z
DTSTAMP:20260420T193645
CREATED:20230719T235939Z
LAST-MODIFIED:20230719T235939Z
UID:24348-1690466400-1690470000@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:If avaiable\, results of first drop \nStatus of ATC 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-21/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230728T140000Z
DTEND:20230728T150000Z
DTSTAMP:20260420T193645
CREATED:20230714T142414Z
LAST-MODIFIED:20230714T142414Z
UID:24373-1690534800-1690538400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-2/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230728T150000Z
DTEND:20230728T160000Z
DTSTAMP:20260420T193645
CREATED:20230719T023439Z
LAST-MODIFIED:20230719T023439Z
UID:24390-1690538400-1690542000@hdpusergroup.org
SUMMARY:Permittity of Coolng fluids
DESCRIPTION:Understandingn the performacne of cooling fluids in immersed electronic systems. \n  
URL:https://hdpusergroup.org/event/permittity-of-coolng-fluids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR