BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230403T150000Z
DTEND:20230403T160000Z
DTSTAMP:20260421T024644
CREATED:20230313T160700Z
LAST-MODIFIED:20230313T160700Z
UID:23902-1680516000-1680519600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-21/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230404T170000Z
DTEND:20230404T180000Z
DTSTAMP:20260421T024644
CREATED:20230314T144255Z
LAST-MODIFIED:20230314T144255Z
UID:23905-1680609600-1680613200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-4/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230405T140000Z
DTEND:20230405T150000Z
DTSTAMP:20260421T024644
CREATED:20230308T163005Z
LAST-MODIFIED:20230308T163005Z
UID:23886-1680685200-1680688800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-4/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230405T150000Z
DTEND:20230405T160000Z
DTSTAMP:20260421T024644
CREATED:20230308T163448Z
LAST-MODIFIED:20230308T163448Z
UID:23887-1680688800-1680692400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-6/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230405T160000Z
DTEND:20230405T170000Z
DTSTAMP:20260421T024644
CREATED:20230327T172233Z
LAST-MODIFIED:20230327T172233Z
UID:23965-1680692400-1680696000@hdpusergroup.org
SUMMARY:HDP Large Footprint BGA Warpage Project Call
DESCRIPTION:Project Planning Call 
URL:https://hdpusergroup.org/event/hdp-large-footprint-bga-warpage-project-call/
CATEGORIES:Large Footprint BGA Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230406T150000Z
DTEND:20230406T160000Z
DTSTAMP:20260421T024644
CREATED:20230315T220343Z
LAST-MODIFIED:20230315T220343Z
UID:23914-1680775200-1680778800@hdpusergroup.org
SUMMARY:Kick-Off meeting for Sequential Lamination -  Stress Factors and Failure Modes
DESCRIPTION:Kick Off 
URL:https://hdpusergroup.org/event/kick-off-meeting-for-sequential-lamination-stress-factors-and-failure-modes/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230406T160000Z
DTEND:20230406T170000Z
DTSTAMP:20260421T024644
CREATED:20230329T154811Z
LAST-MODIFIED:20230329T154811Z
UID:23970-1680778800-1680782400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:More discussion on coupons\, subpanels and panel layouts. 
URL:https://hdpusergroup.org/event/microvia-rel-29/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230411T160000Z
DTEND:20230411T170000Z
DTSTAMP:20260421T024644
CREATED:20230327T143854Z
LAST-MODIFIED:20230327T143854Z
UID:23962-1681210800-1681214400@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Copper surface roughness modeling valiadation. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-7/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230412T160000Z
DTEND:20230412T170000Z
DTSTAMP:20260421T024644
CREATED:20230330T135719Z
LAST-MODIFIED:20230330T135719Z
UID:23972-1681297200-1681300800@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Continued vetting of the results for peel strength  
URL:https://hdpusergroup.org/event/cu-peel-strength-2-11/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230412T200000Z
DTEND:20230412T210000Z
DTSTAMP:20260421T024644
CREATED:20230315T201721Z
LAST-MODIFIED:20230315T201721Z
UID:23912-1681311600-1681315200@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Ptrogress on: second reflow batch manufacture\, x-sectioing of same and drop testing 
URL:https://hdpusergroup.org/event/photo-solder-2-6/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T150000Z
DTEND:20230413T160000Z
DTSTAMP:20260421T024644
CREATED:20230323T153913Z
LAST-MODIFIED:20230323T153913Z
UID:23949-1681380000-1681383600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-16/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T160000Z
DTEND:20230413T170000Z
DTSTAMP:20260421T024644
CREATED:20230323T162937Z
LAST-MODIFIED:20230323T162937Z
UID:23950-1681383600-1681387200@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T190000Z
DTEND:20230413T200000Z
DTSTAMP:20260421T024644
CREATED:20230330T192235Z
LAST-MODIFIED:20230330T192235Z
UID:23974-1681394400-1681398000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Final look at project report? 
URL:https://hdpusergroup.org/event/pcb-feature-min-36/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T200000Z
DTEND:20230413T210000Z
DTSTAMP:20260421T024644
CREATED:20230323T130347Z
LAST-MODIFIED:20230323T130347Z
UID:23946-1681398000-1681401600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss - Project Call
DESCRIPTION:Review Final report draft 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-7/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230414T140000Z
DTEND:20230414T150000Z
DTSTAMP:20260421T024644
CREATED:20230324T143056Z
LAST-MODIFIED:20230324T143056Z
UID:23958-1681462800-1681466400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-24/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230414T150000Z
DTEND:20230414T160000Z
DTSTAMP:20260421T024644
CREATED:20230405T035720Z
LAST-MODIFIED:20230405T035720Z
UID:23990-1681466400-1681470000@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Develop the idea stage of this project. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230419T140000Z
DTEND:20230419T150000Z
DTSTAMP:20260421T024644
CREATED:20230405T142807Z
LAST-MODIFIED:20230405T142807Z
UID:23992-1681894800-1681898400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-5/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230419T160000Z
DTEND:20230419T170000Z
DTSTAMP:20260421T024644
CREATED:20230407T025558Z
LAST-MODIFIED:20230407T025558Z
UID:24004-1681902000-1681905600@hdpusergroup.org
SUMMARY:HDP Large Footprint BGA Warpage
DESCRIPTION:Periodic Project Review 
URL:https://hdpusergroup.org/event/hdp-large-footprint-bga-warpage/
CATEGORIES:Large Footprint BGA Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230419T170000Z
DTEND:20230419T180000Z
DTSTAMP:20260421T024644
CREATED:20230329T174026Z
LAST-MODIFIED:20230329T174026Z
UID:23971-1681905600-1681909200@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Results from Jennie and Jason 
URL:https://hdpusergroup.org/event/ta-method-13/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230420T150000Z
DTEND:20230420T160000Z
DTSTAMP:20260421T024644
CREATED:20230321T154302Z
LAST-MODIFIED:20230321T154302Z
UID:23931-1681984800-1681988400@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Hubert and Jason 
URL:https://hdpusergroup.org/event/better-caf-eq-29/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230420T190000Z
DTEND:20230420T200000Z
DTSTAMP:20260421T024644
CREATED:20230322T185516Z
LAST-MODIFIED:20230322T185516Z
UID:23943-1681999200-1682002800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-23/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230424T150000Z
DTEND:20230424T160000Z
DTSTAMP:20260421T024644
CREATED:20230403T160208Z
LAST-MODIFIED:20230403T160208Z
UID:23979-1682330400-1682334000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-22/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230425T160000Z
DTEND:20230425T170000Z
DTSTAMP:20260421T024644
CREATED:20230412T154539Z
LAST-MODIFIED:20230412T154539Z
UID:24029-1682420400-1682424000@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Roughness Modeling evaluation 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-8/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230426T140000Z
DTEND:20230426T150000Z
DTSTAMP:20260421T024644
CREATED:20230405T152113Z
LAST-MODIFIED:20230405T152113Z
UID:23993-1682499600-1682503200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-7/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230426T160000Z
DTEND:20230426T170000Z
DTSTAMP:20260421T024644
CREATED:20230412T163351Z
LAST-MODIFIED:20230412T163351Z
UID:24031-1682506800-1682510400@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Copper Peel Strength 2-results of peel testing omn different foils and resin systems 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-12/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230426T190000Z
DTEND:20230426T200000Z
DTSTAMP:20260421T024644
CREATED:20230426T142929Z
LAST-MODIFIED:20230426T142929Z
UID:24066-1682517600-1682521200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:Review Final report 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-6/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T010000Z
DTEND:20230427T020000Z
DTSTAMP:20260421T024644
CREATED:20230331T012659Z
LAST-MODIFIED:20230331T012659Z
UID:23975-1682539200-1682542800@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-6/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T150000Z
DTEND:20230427T160000Z
DTSTAMP:20260421T024644
CREATED:20230406T163456Z
LAST-MODIFIED:20230406T163456Z
UID:24001-1682589600-1682593200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T160000Z
DTEND:20230427T170000Z
DTSTAMP:20260421T024644
CREATED:20230413T161845Z
LAST-MODIFIED:20230413T161845Z
UID:24034-1682593200-1682596800@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-2/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T190000Z
DTEND:20230427T200000Z
DTSTAMP:20260421T024644
CREATED:20230413T193401Z
LAST-MODIFIED:20230413T193401Z
UID:24037-1682604000-1682607600@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Hopefully complete final report \nWork on defining next project 
URL:https://hdpusergroup.org/event/pcb-feature-min-37/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR