BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230201T170000Z
DTEND:20230201T180000Z
DTSTAMP:20260421T060153
CREATED:20230118T173758Z
LAST-MODIFIED:20230118T173758Z
UID:23668-1675249200-1675252800@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review progress on peel strenghts\, IST\, microsections and SI 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-8/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T180000Z
DTEND:20230201T190000Z
DTSTAMP:20260421T060153
CREATED:20230112T201743Z
LAST-MODIFIED:20230112T201743Z
UID:23651-1675252800-1675256400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Work on members' meeting presentation \nSee if our design guys have anything to show 
URL:https://hdpusergroup.org/event/microvia-rel-26/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T200000Z
DTEND:20230201T210000Z
DTSTAMP:20260421T060153
CREATED:20230111T201242Z
LAST-MODIFIED:20230111T201242Z
UID:23641-1675260000-1675263600@hdpusergroup.org
SUMMARY:Photo Solder II
DESCRIPTION:Status on new boards \nStatus on x-sections \nFirst drop results \nMeeting presentation 
URL:https://hdpusergroup.org/event/photo-solder-ii-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T160000Z
DTEND:20230202T180000Z
DTSTAMP:20260421T060153
CREATED:20230119T173758Z
LAST-MODIFIED:20230119T173758Z
UID:23675-1675332000-1675339200@hdpusergroup.org
SUMMARY:Reduced cost CAF
DESCRIPTION:Reduced cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-7/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T170000Z
DTEND:20230202T180000Z
DTSTAMP:20260421T060153
CREATED:20230113T213845Z
LAST-MODIFIED:20230113T213845Z
UID:23656-1675335600-1675339200@hdpusergroup.org
SUMMARY:Cu surface roughness model
DESCRIPTION:Present stack up for test vehicle. \nAnd resources moving forward. \ndevelop slides to move to implementation stage \n  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-5/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T190000Z
DTEND:20230202T200000Z
DTSTAMP:20260421T060153
CREATED:20230119T192353Z
LAST-MODIFIED:20230119T192353Z
UID:23677-1675342800-1675346400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Complete Closeout presentation and work on Final Report 
URL:https://hdpusergroup.org/event/pcb-feature-min-31/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T210000Z
DTEND:20230202T220000Z
DTSTAMP:20260421T060153
CREATED:20230113T164240Z
LAST-MODIFIED:20230113T164240Z
UID:23655-1675350000-1675353600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:·       Discuss follow-on test to determine why Arsenic affects loss \n \n·       Discuss the final report
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-4/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230203T150000Z
DTEND:20230203T160000Z
DTSTAMP:20260421T060153
CREATED:20230113T153735Z
LAST-MODIFIED:20230113T153735Z
UID:23654-1675414800-1675418400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-21/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T000000Z
DTEND:20230207T010000Z
DTSTAMP:20260421T060153
CREATED:20230110T110522Z
LAST-MODIFIED:20230110T110522Z
UID:23519-1675706400-1675710000@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-16/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T010000Z
DTEND:20230207T020000Z
DTSTAMP:20260421T060153
CREATED:20230110T020707Z
LAST-MODIFIED:20230110T020707Z
UID:23596-1675710000-1675713600@hdpusergroup.org
SUMMARY:Non-contact CF Profile Project Call
DESCRIPTION:Non-contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-3/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T160000Z
DTEND:20230207T170000Z
DTSTAMP:20260421T060153
CREATED:20230206T151230Z
LAST-MODIFIED:20230206T151230Z
UID:23736-1675764000-1675767600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-4/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230207T180000Z
DTEND:20230207T190000Z
DTSTAMP:20260421T060153
CREATED:20230125T154711Z
LAST-MODIFIED:20230125T154711Z
UID:23686-1675771200-1675774800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230208T170000Z
DTEND:20230208T180000Z
DTSTAMP:20260421T060153
CREATED:20230111T180911Z
LAST-MODIFIED:20230111T180911Z
UID:23640-1675854000-1675857600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:More discussion\, plus presentation for meeting 
URL:https://hdpusergroup.org/event/ta-method-9/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230208T190000Z
DTEND:20230208T200000Z
DTSTAMP:20260421T060153
CREATED:20230202T192735Z
LAST-MODIFIED:20230202T192735Z
UID:23730-1675861200-1675864800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Last review of Closeout presentation 
URL:https://hdpusergroup.org/event/pcb-feature-min-32/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T140000Z
DTEND:20230209T150000Z
DTSTAMP:20260421T060153
CREATED:20230112T140825Z
LAST-MODIFIED:20230112T140825Z
UID:23647-1675929600-1675933200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Jason and Hubert 
URL:https://hdpusergroup.org/event/better-caf-eq-26/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T160000Z
DTEND:20230209T170000Z
DTSTAMP:20260421T060153
CREATED:20230115T032550Z
LAST-MODIFIED:20230115T032550Z
UID:23657-1675936800-1675940400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-13/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T170000Z
DTEND:20230209T180000Z
DTSTAMP:20260421T060153
CREATED:20230112T175019Z
LAST-MODIFIED:20230112T175019Z
UID:23649-1675940400-1675944000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer copper balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-9/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230209T190000Z
DTEND:20230209T200000Z
DTSTAMP:20260421T060153
CREATED:20230202T202515Z
LAST-MODIFIED:20230202T202515Z
UID:23731-1675947600-1675951200@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:update on CAF Testing quotes. \nFurther define project/Test vehicles \nDiscuss resources required 
URL:https://hdpusergroup.org/event/reduced-cost-caf-8/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230213T160000Z
DTEND:20230213T170000Z
DTSTAMP:20260421T060153
CREATED:20230227T163915Z
LAST-MODIFIED:20230227T163915Z
UID:23831-1676282400-1676286000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-18/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230214T170000Z
DTEND:20230215T003000Z
DTSTAMP:20260421T060153
CREATED:20230206T162659Z
LAST-MODIFIED:20230206T162659Z
UID:23638-1676372400-1676399400@hdpusergroup.org
SUMMARY:HDP Board of Directors  Feb 14 2023
DESCRIPTION:Annual meeting – Op Plan and Budget approval – Project moves \nCall Information \n \nWhen it’s time\, join the Webex meeting hereJoin meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m8158e26407a1b6e91db397544c6040a9 \nJoin by meeting numberMeeting number (access code): 2550 229 1773Meeting password: HDPFebBoD (43733226 from video systems)Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers 
URL:https://hdpusergroup.org/event/hdp-board-of-directors-feb-14-2023/
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230215T140000Z
DTEND:20230215T230000Z
DTSTAMP:20260421T060153
CREATED:20230224T142629Z
LAST-MODIFIED:20230224T142629Z
UID:23468-1676448000-1676480400@hdpusergroup.org
SUMMARY:HDP February 2023 Annual Member Meeting
DESCRIPTION:The HDP February Annual Member Meeting will be held February 15 & 16\, 2023 in Santa Rosa\, California\, USA.  The meeting will be hosted by Keysight.  Members can register for the meeting by clicking the register button on this page\, or contacting the HDP Business Manager\, Kim Andrews\, at kima77@hdpug.org \nThe meeting will also be available virtually.  \nMeeting Location: \nKeysight Technologies1400 Fountaingrove ParkwaySanta Rosa\, CA  95403 USA \nDirections on campus: \n \nEnter the site on Fountain Grove Parkway at the 2nd entrance\, turn right at the traffic light just past the crest of the first hill.   \nThe first building on the left is 1 Upper and has the lobby where you must check in.  If you go down the hill\, turn around. \nPark in any Visitor parking spot.  These are on both sides of the loop.  Do not park in any Reserved spot. \nBring picture ID and check in at one of the terminals. \nAn escort will take you to the Auditorium. \nYou must be escorted at all times while on site. \nHotel Information: \nHDP and Keysight have arranged a special group rate with the Hyatt Regency Sonoma Wine Country.  The group rate is $159 per night plus tax\, with a daily destination fee of $15\, and waived parking fees.  This special rate is only guaranteed until January 20\, 2023.  For assistance with reservations\, please contact the  HDP Business Manager or use the link below. \nHyatt Regency Sonoma Wine Country170 Railroad StreetSanta Rosa\, CA 95401 USA \nreservations:https://www.hyatt.com/en-US/group-booking/SONOM/G-HDPU \nCall Information (Meeting ICS Files are available for download at the bottom of this page) \nDay 1 \n \nWhen it’s time\, join the Webex meeting here.Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=ma4785770d2c08e4612703238d3207672Join by meeting numberMeeting number (access code): 2557 001 0789Meeting password: HDPFeb1 (4373321 from video systems)Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \nDay 2 \n \nWhen it’s time\, join the Webex meeting here.Join meetingMore ways to join:Join from the meeting linkhttps://hdpug.webex.com/hdpug/j.php?MTID=m365774a384fb4f778cc8d5f8b0e8f0c7Join by meeting numberMeeting number (access code): 2556 452 1249Meeting password: HDPFeb2 (4373322 from video systems)Join by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n  
URL:https://hdpusergroup.org/event/hdp-february-2023-annual-member-meeting/2023-02-15/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230222T150000Z
DTEND:20230222T160000Z
DTSTAMP:20260421T060153
CREATED:20230125T155614Z
LAST-MODIFIED:20230125T155614Z
UID:23694-1677056400-1677060000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230222T170000Z
DTEND:20230222T180000Z
DTSTAMP:20260421T060153
CREATED:20230201T171918Z
LAST-MODIFIED:20230201T171918Z
UID:23725-1677063600-1677067200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review latest peel strength\, SI and delamination/cycles to failure data 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-9/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230223T170000Z
DTEND:20230223T180000Z
DTSTAMP:20260421T060153
CREATED:20230210T040043Z
LAST-MODIFIED:20230210T040043Z
UID:23763-1677150000-1677153600@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:CAF and ECM project 
URL:https://hdpusergroup.org/event/reduced-cost-caf-9/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230223T190000Z
DTEND:20230223T200000Z
DTSTAMP:20260421T060153
CREATED:20230206T152410Z
LAST-MODIFIED:20230206T152410Z
UID:23672-1677157200-1677160800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-21/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230223T210000Z
DTEND:20230223T220000Z
DTSTAMP:20260421T060153
CREATED:20230203T184923Z
LAST-MODIFIED:20230203T184923Z
UID:23733-1677164400-1677168000@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:Call to discuss test results \nFinal report assignments 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-5/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230224T150000Z
DTEND:20230224T160000Z
DTSTAMP:20260421T060153
CREATED:20230203T160117Z
LAST-MODIFIED:20230203T160117Z
UID:23732-1677229200-1677232800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-22/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230227T160000Z
DTEND:20230227T170000Z
DTSTAMP:20260421T060153
CREATED:20230130T172530Z
LAST-MODIFIED:20230130T172530Z
UID:23713-1677492000-1677495600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-17/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230301T040000Z
DTEND:20230301T043000Z
DTSTAMP:20260421T060153
CREATED:20230301T002721Z
LAST-MODIFIED:20230301T002721Z
UID:23834-1677621600-1677623400@hdpusergroup.org
SUMMARY:Non Contact CF Profile Discussion on Randomized CF Codes
DESCRIPTION:Non Contact CF Profile Discussion on Randomized CF Codes 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-discussion-on-randomized-cf-codes/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR