BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230104T170000Z
DTEND:20230104T180000Z
DTSTAMP:20260421T072435
CREATED:20221208T175328Z
LAST-MODIFIED:20221208T175328Z
UID:23506-1672830000-1672833600@hdpusergroup.org
SUMMARY:TA Methods
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ta-methods-3/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230105T160000Z
DTEND:20230105T170000Z
DTSTAMP:20260421T072435
CREATED:20221206T182404Z
LAST-MODIFIED:20221206T182404Z
UID:23500-1672912800-1672916400@hdpusergroup.org
SUMMARY:Backdrill Transition telecom
DESCRIPTION:Backdrill Transition telecom 
URL:https://hdpusergroup.org/event/backdrill-transition-telecom-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230105T210000Z
DTEND:20230105T220000Z
DTSTAMP:20260421T072435
CREATED:20221201T213955Z
LAST-MODIFIED:20221201T213955Z
UID:23484-1672930800-1672934400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Results of x-sectioning 
URL:https://hdpusergroup.org/event/pcb-feature-min-28/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230109T150000Z
DTEND:20230109T160000Z
DTSTAMP:20260421T072435
CREATED:20221207T170744Z
LAST-MODIFIED:20221207T170744Z
UID:23502-1673254800-1673258400@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-6/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230109T160000Z
DTEND:20230109T170000Z
DTSTAMP:20260421T072435
CREATED:20221219T163256Z
LAST-MODIFIED:20221219T163256Z
UID:23526-1673258400-1673262000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-15/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230109T170000Z
DTEND:20230109T180000Z
DTSTAMP:20260421T072435
CREATED:20230103T161305Z
LAST-MODIFIED:20230103T161305Z
UID:23537-1673262000-1673265600@hdpusergroup.org
SUMMARY:Reduced cost CAF
DESCRIPTION:Reduced cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-5/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230110T010000Z
DTEND:20230110T020000Z
DTSTAMP:20260421T072435
CREATED:20230109T052401Z
LAST-MODIFIED:20230109T052401Z
UID:23493-1673290800-1673294400@hdpusergroup.org
SUMMARY:Non-contact CF Profile Project Call
DESCRIPTION:Non-contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-2/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230110T180000Z
DTEND:20230110T190000Z
DTSTAMP:20260421T072435
CREATED:20221229T170817Z
LAST-MODIFIED:20221229T170817Z
UID:23534-1673352000-1673355600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230111T020000Z
DTEND:20230111T030000Z
DTSTAMP:20260421T072435
CREATED:20221220T072615Z
LAST-MODIFIED:20221220T072615Z
UID:23247-1673380800-1673384400@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-44/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230111T170000Z
DTEND:20230111T180000Z
DTSTAMP:20260421T072435
CREATED:20230104T171138Z
LAST-MODIFIED:20230104T171138Z
UID:23542-1673434800-1673438400@hdpusergroup.org
SUMMARY:TA Methods
DESCRIPTION:Updates from Sarah\, Jason and Tony. Jennie has completed her testing. 
URL:https://hdpusergroup.org/event/ta-methods-4/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230111T200000Z
DTEND:20230111T210000Z
DTSTAMP:20260421T072435
CREATED:20221213T201738Z
LAST-MODIFIED:20221213T201738Z
UID:23518-1673445600-1673449200@hdpusergroup.org
SUMMARY:Photo Soldering 2
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/photo-soldering-2-3/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T140000Z
DTEND:20230112T150000Z
DTSTAMP:20260421T072435
CREATED:20221202T200946Z
LAST-MODIFIED:20221202T200946Z
UID:23489-1673510400-1673514000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/better-caf-eq-25/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T160000Z
DTEND:20230112T170000Z
DTSTAMP:20260421T072435
CREATED:20221201T165934Z
LAST-MODIFIED:20221201T165934Z
UID:23480-1673517600-1673521200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-12/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T170000Z
DTEND:20230112T180000Z
DTSTAMP:20260421T072435
CREATED:20230104T171118Z
LAST-MODIFIED:20230104T171118Z
UID:23501-1673521200-1673524800@hdpusergroup.org
SUMMARY:innerlayer copper balancing
DESCRIPTION:innerlayer copper balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-8/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T180000Z
DTEND:20230112T190000Z
DTSTAMP:20260421T072435
CREATED:20230105T212842Z
LAST-MODIFIED:20230105T212842Z
UID:23554-1673524800-1673528400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/pcb-feature-min-29/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T200000Z
DTEND:20230112T210000Z
DTSTAMP:20260421T072435
CREATED:20221208T202416Z
LAST-MODIFIED:20221208T202416Z
UID:23508-1673532000-1673535600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:First meeting of the year 
URL:https://hdpusergroup.org/event/microvia-rel-24/
CATEGORIES:Microvia Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T200000Z
DTEND:20230112T210000Z
DTSTAMP:20260421T072435
CREATED:20221208T215250Z
LAST-MODIFIED:20221208T215250Z
UID:23510-1673532000-1673535600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Hope to start project work 
URL:https://hdpusergroup.org/event/microvia-rel-25/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T210000Z
DTEND:20230112T220000Z
DTSTAMP:20260421T072435
CREATED:20221221T212923Z
LAST-MODIFIED:20221221T212923Z
UID:23530-1673535600-1673539200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Project Call
DESCRIPTION:Review final data analysis 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-5/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230113T150000Z
DTEND:20230113T160000Z
DTSTAMP:20260421T072435
CREATED:20221216T152924Z
LAST-MODIFIED:20221216T152924Z
UID:23522-1673600400-1673604000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CFT at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CFT at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-cft-at-ist-project-call/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230117T160000Z
DTEND:20230117T170000Z
DTSTAMP:20260421T072435
CREATED:20221207T171215Z
LAST-MODIFIED:20221207T171215Z
UID:23503-1673949600-1673953200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-3/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230118T170000Z
DTEND:20230118T180000Z
DTSTAMP:20260421T072435
CREATED:20221218T061904Z
LAST-MODIFIED:20221218T061904Z
UID:23525-1674039600-1674043200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Deternining if peel strengths less that 4 lbs/inch will be reliable 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-7/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230118T180000Z
DTEND:20230118T190000Z
DTSTAMP:20260421T072435
CREATED:20221201T145251Z
LAST-MODIFIED:20221201T145251Z
UID:23475-1674043200-1674046800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste -BGA leg project meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting-2/2023-01-18/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T140000Z
DTEND:20230119T150000Z
DTSTAMP:20260421T072435
CREATED:20230117T150334Z
LAST-MODIFIED:20230117T150334Z
UID:23661-1674115200-1674118800@hdpusergroup.org
SUMMARY:A meeting with NXTEC
DESCRIPTION:HDP Value & Technical Direction 
URL:https://hdpusergroup.org/event/a-meeting-with-nxtec/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T160000Z
DTEND:20230119T170000Z
DTSTAMP:20260421T072435
CREATED:20221208T162331Z
LAST-MODIFIED:20221208T162331Z
UID:23505-1674122400-1674126000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-20/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T170000Z
DTEND:20230119T180000Z
DTSTAMP:20260421T072435
CREATED:20230109T173633Z
LAST-MODIFIED:20230109T173633Z
UID:23594-1674126000-1674129600@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Redduced Cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-6/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T190000Z
DTEND:20230119T200000Z
DTSTAMP:20260421T072435
CREATED:20230112T182719Z
LAST-MODIFIED:20230112T182719Z
UID:23650-1674133200-1674136800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Writing report 
URL:https://hdpusergroup.org/event/pcb-feature-min-30/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230124T180000Z
DTEND:20230124T190000Z
DTSTAMP:20260421T072435
CREATED:20230118T160854Z
LAST-MODIFIED:20230118T160854Z
UID:23667-1674561600-1674565200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230125T150000Z
DTEND:20230125T160000Z
DTSTAMP:20260421T072435
CREATED:20230109T152825Z
LAST-MODIFIED:20230109T152825Z
UID:23581-1674637200-1674640800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230126T170000Z
DTEND:20230126T180000Z
DTSTAMP:20260421T072435
CREATED:20230118T003927Z
LAST-MODIFIED:20230118T003927Z
UID:23599-1674730800-1674734400@hdpusergroup.org
SUMMARY:Backdrill transition
DESCRIPTION:backdrill transition 
URL:https://hdpusergroup.org/event/backdrill-transition/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230130T160000Z
DTEND:20230130T170000Z
DTSTAMP:20260421T072435
CREATED:20230109T165354Z
LAST-MODIFIED:20230109T165354Z
UID:23592-1675072800-1675076400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-16/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR