BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20220701T190000Z
DTEND:20220701T200000Z
DTSTAMP:20260421T165049
CREATED:20220623T125220Z
LAST-MODIFIED:20220623T125220Z
UID:22822-1656684000-1656687600@hdpusergroup.org
SUMMARY:LiloTree Website Orientation
DESCRIPTION:Website orientation and project Q & A with LiloTree. 
URL:https://hdpusergroup.org/event/lilotree-website-orientation/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220705T170000Z
DTEND:20220705T180000Z
DTSTAMP:20260421T165049
CREATED:20220628T203400Z
LAST-MODIFIED:20220628T203400Z
UID:22873-1657022400-1657026000@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-call-7/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220706T140000Z
DTEND:20220706T150000Z
DTSTAMP:20260421T165049
CREATED:20220620T153611Z
LAST-MODIFIED:20220620T153611Z
UID:22793-1657098000-1657101600@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Copper surfae roughness modeling as a way to determine insertion loss. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220706T150000Z
DTEND:20220706T160000Z
DTSTAMP:20260421T165049
CREATED:20220615T155911Z
LAST-MODIFIED:20220615T155911Z
UID:22773-1657101600-1657105200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-2/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220706T160000Z
DTEND:20220706T170000Z
DTSTAMP:20260421T165049
CREATED:20220624T131000Z
LAST-MODIFIED:20220624T131000Z
UID:22836-1657105200-1657108800@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Project status 
URL:https://hdpusergroup.org/event/ta-method/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220706T180000Z
DTEND:20220706T190000Z
DTSTAMP:20260421T165049
CREATED:20220706T150936Z
LAST-MODIFIED:20220706T150936Z
UID:22715-1657112400-1657116000@hdpusergroup.org
SUMMARY:Glass Composition
DESCRIPTION:review progress related to glass composition 
URL:https://hdpusergroup.org/event/glass-composition/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220707T140000Z
DTEND:20220707T150000Z
DTSTAMP:20260421T165049
CREATED:20220623T144500Z
LAST-MODIFIED:20220623T144500Z
UID:22824-1657184400-1657188000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/june-23-1000-am-1100-am-edt-single-surface-finish-meeting/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220708T020000Z
DTEND:20220708T030000Z
DTSTAMP:20260421T165049
CREATED:20220707T235546Z
LAST-MODIFIED:20220707T235546Z
UID:22912-1657227600-1657231200@hdpusergroup.org
SUMMARY:test event july 7 pm
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/test-event-july-7-pm/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220708T140000Z
DTEND:20220708T150000Z
DTSTAMP:20260421T165049
CREATED:20220603T141636Z
LAST-MODIFIED:20220603T141636Z
UID:22705-1657270800-1657274400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-14/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220709T130000Z
DTEND:20220709T220000Z
DTSTAMP:20260421T165049
CREATED:20220709T183135Z
LAST-MODIFIED:20220709T183135Z
UID:22921-1657353600-1657386000@hdpusergroup.org
SUMMARY:Copper Peel Strength 2
DESCRIPTION:Copper Peel Strength evaluation 
URL:https://hdpusergroup.org/event/copper-peel-strength-2/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220711T150000Z
DTEND:20220711T160000Z
DTSTAMP:20260421T165049
CREATED:20220620T160032Z
LAST-MODIFIED:20220620T160032Z
UID:22797-1657533600-1657537200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-7/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220711T160000Z
DTEND:20220711T170000Z
DTSTAMP:20260421T165049
CREATED:20220628T114345Z
LAST-MODIFIED:20220628T114345Z
UID:22841-1657537200-1657540800@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer copper balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-5/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220712T150000Z
DTEND:20220712T160000Z
DTSTAMP:20260421T165049
CREATED:20220630T122654Z
LAST-MODIFIED:20220630T122654Z
UID:22889-1657620000-1657623600@hdpusergroup.org
SUMMARY:Manage Backdrill Transition Kickoff
DESCRIPTION:Manage Backdrill Transition Kickoff 
URL:https://hdpusergroup.org/event/manage-backdrill-transition-kickoff/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220712T160000Z
DTEND:20220712T170000Z
DTSTAMP:20260421T165049
CREATED:20220705T122058Z
LAST-MODIFIED:20220705T122058Z
UID:22898-1657623600-1657627200@hdpusergroup.org
SUMMARY:Reduced Cost CAF telecom
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T010000Z
DTEND:20220713T020000Z
DTSTAMP:20260421T165049
CREATED:20220624T074026Z
LAST-MODIFIED:20220624T074026Z
UID:22746-1657656000-1657659600@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-13/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T140000Z
DTEND:20220713T150000Z
DTSTAMP:20260421T165049
CREATED:20220622T150531Z
LAST-MODIFIED:20220622T150531Z
UID:22819-1657702800-1657706400@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-8/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T170000Z
DTEND:20220713T180000Z
DTSTAMP:20260421T165049
CREATED:20220629T172935Z
LAST-MODIFIED:20220629T172935Z
UID:22842-1657713600-1657717200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste -BGA leg project meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting/2022-07-13/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T130000Z
DTEND:20220714T140000Z
DTSTAMP:20260421T165049
CREATED:20220630T133358Z
LAST-MODIFIED:20220630T133358Z
UID:22890-1657785600-1657789200@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:What can we do for drop testing \nThermocouple update \nBuild Update 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-18/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T140000Z
DTEND:20220714T150000Z
DTSTAMP:20260421T165049
CREATED:20220608T144843Z
LAST-MODIFIED:20220608T144843Z
UID:22747-1657789200-1657792800@hdpusergroup.org
SUMMARY:ECM 3 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-project-meeting-5/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T160000Z
DTEND:20220714T170000Z
DTSTAMP:20260421T165049
CREATED:20220623T161549Z
LAST-MODIFIED:20220623T161549Z
UID:22827-1657796400-1657800000@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Project Call
DESCRIPTION:Review Data Analysis \nDiscuss Final Report 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-3/
LOCATION:Virtual
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T190000Z
DTEND:20220714T200000Z
DTSTAMP:20260421T165049
CREATED:20220630T192324Z
LAST-MODIFIED:20220630T192324Z
UID:22893-1657807200-1657810800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review quotes \nFollow up on what Paul puts together out of previous minutes and what Kuldip proposed 
URL:https://hdpusergroup.org/event/microvia-rel-13/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T200000Z
DTEND:20220714T210000Z
DTSTAMP:20260421T165049
CREATED:20220630T200909Z
LAST-MODIFIED:20220630T200909Z
UID:22894-1657810800-1657814400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Calumet status 
URL:https://hdpusergroup.org/event/pcb-feature-min-23/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220715T170000Z
DTEND:20220715T180000Z
DTSTAMP:20260421T165049
CREATED:20220628T203659Z
LAST-MODIFIED:20220628T203659Z
UID:22874-1657886400-1657890000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-call-5/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220720T150000Z
DTEND:20220720T160000Z
DTSTAMP:20260421T165049
CREATED:20220706T160703Z
LAST-MODIFIED:20220706T160703Z
UID:22902-1658311200-1658314800@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-3/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220720T160000Z
DTEND:20220720T170000Z
DTSTAMP:20260421T165049
CREATED:20220706T162404Z
LAST-MODIFIED:20220706T162404Z
UID:22903-1658314800-1658318400@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Sample status 
URL:https://hdpusergroup.org/event/ta-method-2/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220721T140000Z
DTEND:20220721T150000Z
DTSTAMP:20260421T165049
CREATED:20220707T142358Z
LAST-MODIFIED:20220707T142358Z
UID:22909-1658394000-1658397600@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-14/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220726T160000Z
DTEND:20220726T170000Z
DTSTAMP:20260421T165049
CREATED:20220719T124424Z
LAST-MODIFIED:20220719T124424Z
UID:22953-1658833200-1658836800@hdpusergroup.org
SUMMARY:Reduced Cost CAf telecom
DESCRIPTION:Reduced Cost CAf telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom-2/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220727T140000Z
DTEND:20220727T150000Z
DTSTAMP:20260421T165049
CREATED:20220713T163621Z
LAST-MODIFIED:20220713T163621Z
UID:22931-1658912400-1658916000@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-9/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220727T183000Z
DTEND:20220727T193000Z
DTSTAMP:20260421T165049
CREATED:20220715T181343Z
LAST-MODIFIED:20220715T181343Z
UID:22944-1658928600-1658932200@hdpusergroup.org
SUMMARY:AGC\, HDP technical direction discussion
DESCRIPTION:AGC\, HDP technical direction discussion 
URL:https://hdpusergroup.org/event/agc-hdp-technical-direction-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220728T130000Z
DTEND:20220728T140000Z
DTSTAMP:20260421T165049
CREATED:20220714T132516Z
LAST-MODIFIED:20220714T132516Z
UID:22934-1658995200-1658998800@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Project updates from Ara\, Tim and Thilo 
URL:https://hdpusergroup.org/event/photonic-soldering-2-8/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR