BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20220602T190000Z
DTEND:20220602T200000Z
DTSTAMP:20260421T182023
CREATED:20220505T182126Z
LAST-MODIFIED:20220505T182126Z
UID:22523-1654178400-1654182000@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model June 2 meeting
DESCRIPTION:Cu Surface Roughness Model meeting to discuss results of May Members Meeting and Kickoff meeting 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-june-2-meeting/
LOCATION:Virtual
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220602T190000Z
DTEND:20220602T200000Z
DTSTAMP:20260421T182023
CREATED:20220525T004930Z
LAST-MODIFIED:20220525T004930Z
UID:22529-1654178400-1654182000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue on Project Definition 
URL:https://hdpusergroup.org/event/microvia-rel-11/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220602T200000Z
DTEND:20220602T210000Z
DTSTAMP:20260421T182023
CREATED:20220525T005032Z
LAST-MODIFIED:20220525T005032Z
UID:22527-1654182000-1654185600@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status of build 
URL:https://hdpusergroup.org/event/pcb-feature-min-21/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220603T140000Z
DTEND:20220603T150000Z
DTSTAMP:20260421T182023
CREATED:20220513T144544Z
LAST-MODIFIED:20220513T144544Z
UID:22572-1654246800-1654250400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-13/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220607T150000Z
DTEND:20220607T160000Z
DTSTAMP:20260421T182023
CREATED:20220524T152801Z
LAST-MODIFIED:20220524T152801Z
UID:22634-1654596000-1654599600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Project Call
DESCRIPTION:Review Neil's Data 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-project-call/
LOCATION:Virtual
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220608T010000Z
DTEND:20220608T020000Z
DTSTAMP:20260421T182023
CREATED:20220512T015806Z
LAST-MODIFIED:20220512T015806Z
UID:22561-1654632000-1654635600@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-12/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220608T140000Z
DTEND:20220608T150000Z
DTSTAMP:20260421T182023
CREATED:20220510T143951Z
LAST-MODIFIED:20220510T143951Z
UID:22549-1654678800-1654682400@hdpusergroup.org
SUMMARY:ECM 3 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-project-meeting-6/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220609T140000Z
DTEND:20220609T150000Z
DTSTAMP:20260421T182023
CREATED:20220427T144514Z
LAST-MODIFIED:20220427T144514Z
UID:22450-1654765200-1654768800@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-5/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220610T170000Z
DTEND:20220610T180000Z
DTSTAMP:20260421T182023
CREATED:20220531T151426Z
LAST-MODIFIED:20220531T151426Z
UID:22667-1654862400-1654866000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-call-3/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220614T020000Z
DTEND:20220614T030000Z
DTSTAMP:20260421T182023
CREATED:20220609T125910Z
LAST-MODIFIED:20220609T125910Z
UID:22749-1655154000-1655157600@hdpusergroup.org
SUMMARY:Grace Electron - HDP Website Access Meeting
DESCRIPTION:Grace Electron - HDP Website Access Meeting 
URL:https://hdpusergroup.org/event/grace-electron-hdp-website-access-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220615T020000Z
DTEND:20220615T030000Z
DTSTAMP:20260421T182023
CREATED:20220601T021757Z
LAST-MODIFIED:20220601T021757Z
UID:22681-1655240400-1655244000@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-41/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220615T150000Z
DTEND:20220615T160000Z
DTSTAMP:20260421T182023
CREATED:20220525T162337Z
LAST-MODIFIED:20220525T162337Z
UID:22649-1655287200-1655290800@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220616T150000Z
DTEND:20220616T160000Z
DTSTAMP:20260421T182023
CREATED:20220510T151504Z
LAST-MODIFIED:20220510T151504Z
UID:22554-1655373600-1655377200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Status of testing 
URL:https://hdpusergroup.org/event/better-caf-eq-17/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220616T160000Z
DTEND:20220616T170000Z
DTSTAMP:20260421T182023
CREATED:20220616T120843Z
LAST-MODIFIED:20220616T120843Z
UID:22777-1655377200-1655380800@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Talk about drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-15/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220620T140000Z
DTEND:20220620T150000Z
DTSTAMP:20260421T182023
CREATED:20220603T012915Z
LAST-MODIFIED:20220603T012915Z
UID:22701-1655715600-1655719200@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Review model evaluation protocol \n  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220620T150000Z
DTEND:20220620T160000Z
DTSTAMP:20260421T182023
CREATED:20220523T225705Z
LAST-MODIFIED:20220523T225705Z
UID:22595-1655719200-1655722800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-6/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220621T170000Z
DTEND:20220621T180000Z
DTSTAMP:20260421T182023
CREATED:20220524T172400Z
LAST-MODIFIED:20220524T172400Z
UID:22644-1655812800-1655816400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-call-6/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220622T140000Z
DTEND:20220622T150000Z
DTSTAMP:20260421T182023
CREATED:20220609T150312Z
LAST-MODIFIED:20220609T150312Z
UID:22750-1655888400-1655892000@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-7/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220623T130000Z
DTEND:20220623T140000Z
DTSTAMP:20260421T182023
CREATED:20220622T193556Z
LAST-MODIFIED:20220622T193556Z
UID:22785-1655971200-1655974800@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Talk about thermocouples and drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-16/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220623T140000Z
DTEND:20220623T150000Z
DTSTAMP:20260421T182023
CREATED:20220526T143627Z
LAST-MODIFIED:20220526T143627Z
UID:22652-1655974800-1655978400@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-13/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220623T150000Z
DTEND:20220623T160000Z
DTSTAMP:20260421T182023
CREATED:20220617T122822Z
LAST-MODIFIED:20220617T122822Z
UID:22786-1655978400-1655982000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Uo dates from Hubert and Jason 
URL:https://hdpusergroup.org/event/better-caf-eq-18/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220623T160000Z
DTEND:20220623T170000Z
DTSTAMP:20260421T182023
CREATED:20220602T163626Z
LAST-MODIFIED:20220602T163626Z
UID:22695-1655982000-1655985600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs. Loss Project Call
DESCRIPTION:Review Joe's latest analysis 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-2/
LOCATION:Virtual
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220624T170000Z
DTEND:20220624T180000Z
DTSTAMP:20260421T182023
CREATED:20220613T195143Z
LAST-MODIFIED:20220613T195143Z
UID:22764-1656072000-1656075600@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project Call
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-call-4/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220628T150000Z
DTEND:20220628T160000Z
DTSTAMP:20260421T182023
CREATED:20220617T151907Z
LAST-MODIFIED:20220617T151907Z
UID:22790-1656410400-1656414000@hdpusergroup.org
SUMMARY:Reduced Cost CAF Kickoff telecom
DESCRIPTION:Reduced Cost CAF Kickoff telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-kickoff-telecom/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220629T150000Z
DTEND:20220629T160000Z
DTSTAMP:20260421T182023
CREATED:20220617T152207Z
LAST-MODIFIED:20220617T152207Z
UID:22791-1656496800-1656500400@hdpusergroup.org
SUMMARY:Manage Primary Drill Damage Kickoff Telecom
DESCRIPTION:Manage Primary Drill Damage Kickoff Telecom 
URL:https://hdpusergroup.org/event/manage-primary-drill-damage-kickoff-telecom/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220630T130000Z
DTEND:20220630T140000Z
DTSTAMP:20260421T182023
CREATED:20220623T133044Z
LAST-MODIFIED:20220623T133044Z
UID:22823-1656576000-1656579600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Thermocoupling status \nNews about drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-17/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220630T190000Z
DTEND:20220630T200000Z
DTSTAMP:20260421T182023
CREATED:20220622T150650Z
LAST-MODIFIED:20220622T150650Z
UID:22698-1656597600-1656601200@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Paul’s progress on gettng fabricator(s) \nThis meeting will happen even if no progress. 
URL:https://hdpusergroup.org/event/microvia-rel-12/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220630T200000Z
DTEND:20220630T210000Z
DTSTAMP:20260421T182023
CREATED:20220622T171410Z
LAST-MODIFIED:20220622T171410Z
UID:22700-1656601200-1656604800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Calumet status? 
URL:https://hdpusergroup.org/event/pcb-feature-min-22/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR