BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210701T150000Z
DTEND:20210701T160000Z
DTSTAMP:20260423T052839
CREATED:20210617T155605Z
LAST-MODIFIED:20210617T155605Z
UID:20091-1625133600-1625137200@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-4/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T160000Z
DTEND:20210701T170000Z
DTSTAMP:20260423T052839
CREATED:20210621T164614Z
LAST-MODIFIED:20210621T164614Z
UID:20104-1625137200-1625140800@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs Loss July 1\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment Vs Loss July 1\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-july-1-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210701T180000Z
DTEND:20210701T190000Z
DTSTAMP:20260423T052839
CREATED:20210621T164952Z
LAST-MODIFIED:20210621T164952Z
UID:20105-1625144400-1625148000@hdpusergroup.org
SUMMARY:Cu Peel Strength July 1\, 2021 project meeting
DESCRIPTION:Cu Peel Strength July 1\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-july-1-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210702T150000Z
DTEND:20210702T160000Z
DTSTAMP:20260423T052839
CREATED:20210618T170446Z
LAST-MODIFIED:20210618T170446Z
UID:20098-1625220000-1625223600@hdpusergroup.org
SUMMARY:Tech. Direction telecom
DESCRIPTION:Tech. Direction telecom 
URL:https://hdpusergroup.org/event/tech-direction-telecom/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210702T160000Z
DTEND:20210702T170000Z
DTSTAMP:20260423T052839
CREATED:20210618T170041Z
LAST-MODIFIED:20210618T170041Z
UID:20100-1625223600-1625227200@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-23/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210709T150000Z
DTEND:20210709T160000Z
DTSTAMP:20260423T052839
CREATED:20210630T225641Z
LAST-MODIFIED:20210630T225641Z
UID:20152-1625824800-1625828400@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project
DESCRIPTION:Project status review. 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210712T150000Z
DTEND:20210712T160000Z
DTSTAMP:20260423T052839
CREATED:20210628T171938Z
LAST-MODIFIED:20210628T171938Z
UID:20135-1626084000-1626087600@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-21/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210713T150000Z
DTEND:20210713T160000Z
DTSTAMP:20260423T052839
CREATED:20210622T161654Z
LAST-MODIFIED:20210622T161654Z
UID:20117-1626170400-1626174000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-10/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210713T190000Z
DTEND:20210713T200000Z
DTSTAMP:20260423T052839
CREATED:20210629T201351Z
LAST-MODIFIED:20210629T201351Z
UID:20150-1626184800-1626188400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Progress on materials to Calumet and status of design 
URL:https://hdpusergroup.org/event/pcb-feature-min-10/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210713T200000Z
DTEND:20210713T210000Z
DTSTAMP:20260423T052839
CREATED:20210624T202429Z
LAST-MODIFIED:20210624T202429Z
UID:20125-1626188400-1626192000@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:We are moving to Definition 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-4/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T130000Z
DTEND:20210714T140000Z
DTSTAMP:20260423T052839
CREATED:20210616T131348Z
LAST-MODIFIED:20210616T131348Z
UID:20085-1626249600-1626253200@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Hua to give summary of 2\, 3 & 4 via stacks on and off. \nStatus update on Intel backdrill samples. 
URL:https://hdpusergroup.org/event/disc2a-30/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T160000Z
DTEND:20210714T170000Z
DTSTAMP:20260423T052839
CREATED:20210701T210650Z
LAST-MODIFIED:20210701T210650Z
UID:20169-1626260400-1626264000@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment July 14\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Assessment July 14\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-july-14-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T170000Z
DTEND:20210714T180000Z
DTSTAMP:20260423T052839
CREATED:20210701T210131Z
LAST-MODIFIED:20210701T210131Z
UID:20167-1626264000-1626267600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste July 14\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste July 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-july-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T180000Z
DTEND:20210714T190000Z
DTSTAMP:20260423T052839
CREATED:20210621T165659Z
LAST-MODIFIED:20210621T165659Z
UID:20106-1626267600-1626271200@hdpusergroup.org
SUMMARY:Glass Type Composition July 14\, 2021 project meeting
DESCRIPTION:Glass Type Composition July 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-july-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T160000Z
DTEND:20210715T170000Z
DTSTAMP:20260423T052839
CREATED:20210701T203604Z
LAST-MODIFIED:20210701T203604Z
UID:20157-1626346800-1626350400@hdpusergroup.org
SUMMARY:Cu Foil Surface Treatment vs Loss July 15\, 2021 project meeting
DESCRIPTION:Cu Foil Surface Treatment vs Loss July 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-foil-surface-treatment-vs-loss-july-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T180000Z
DTEND:20210715T190000Z
DTSTAMP:20260423T052839
CREATED:20210701T204626Z
LAST-MODIFIED:20210701T204626Z
UID:20162-1626354000-1626357600@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 July 15\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 July 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-july-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T203000Z
DTEND:20210715T213000Z
DTSTAMP:20260423T052839
CREATED:20210715T145914Z
LAST-MODIFIED:20210715T145914Z
UID:20207-1626363000-1626366600@hdpusergroup.org
SUMMARY:Marketing Brainstorm session
DESCRIPTION:Call to discuss video and marketing 
URL:https://hdpusergroup.org/event/marketing-brainstorm-session/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210716T140000Z
DTEND:20210716T150000Z
DTSTAMP:20260423T052839
CREATED:20210825T225632Z
LAST-MODIFIED:20210825T225632Z
UID:20127-1626426000-1626429600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-2/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210716T150000Z
DTEND:20210716T160000Z
DTSTAMP:20260423T052839
CREATED:20210702T154522Z
LAST-MODIFIED:20210702T154522Z
UID:20173-1626429600-1626433200@hdpusergroup.org
SUMMARY:Technology direction telecom
DESCRIPTION:Technology direction telecom 
URL:https://hdpusergroup.org/event/technology-direction-telecom-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210716T160000Z
DTEND:20210716T170000Z
DTSTAMP:20260423T052839
CREATED:20210705T020909Z
LAST-MODIFIED:20210705T020909Z
UID:20177-1626433200-1626436800@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-24/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210720T170000Z
DTEND:20210720T180000Z
DTSTAMP:20260423T052839
CREATED:20210705T194742Z
LAST-MODIFIED:20210705T194742Z
UID:20151-1626782400-1626786000@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval Project Review Call
DESCRIPTION:Rescheduled Project Review Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval-project-review-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210720T190000Z
DTEND:20210720T200000Z
DTSTAMP:20260423T052839
CREATED:20210713T191020Z
LAST-MODIFIED:20210713T191020Z
UID:20204-1626789600-1626793200@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status of build 
URL:https://hdpusergroup.org/event/pcb-feature-min-11/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210722T000000Z
DTEND:20210722T010000Z
DTSTAMP:20260423T052839
CREATED:20210707T201608Z
LAST-MODIFIED:20210707T201608Z
UID:20190-1626894000-1626897600@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive Project Call
DESCRIPTION:Review latest data 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-15/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210722T150000Z
DTEND:20210722T160000Z
DTSTAMP:20260423T052839
CREATED:20210701T154618Z
LAST-MODIFIED:20210701T154618Z
UID:20154-1626948000-1626951600@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-5/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210723T150000Z
DTEND:20210723T160000Z
DTSTAMP:20260423T052839
CREATED:20210719T153952Z
LAST-MODIFIED:20210719T153952Z
UID:20248-1627034400-1627038000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Review
DESCRIPTION:Project Review 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-review-2/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210727T150000Z
DTEND:20210727T160000Z
DTSTAMP:20260423T052839
CREATED:20210622T151424Z
LAST-MODIFIED:20210622T151424Z
UID:20115-1627380000-1627383600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/better-caf-eq-11/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210727T160000Z
DTEND:20210727T170000Z
DTSTAMP:20260423T052839
CREATED:20210720T124447Z
LAST-MODIFIED:20210720T124447Z
UID:20253-1627383600-1627387200@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-11/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210727T190000Z
DTEND:20210727T200000Z
DTSTAMP:20260423T052839
CREATED:20210726T122813Z
LAST-MODIFIED:20210726T122813Z
UID:20264-1627394400-1627398000@hdpusergroup.org
SUMMARY:PCB Feature Mon
DESCRIPTION:Update from Paul 
URL:https://hdpusergroup.org/event/pcb-feature-mon/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T130000Z
DTEND:20210728T140000Z
DTSTAMP:20260423T052839
CREATED:20210714T131653Z
LAST-MODIFIED:20210714T131653Z
UID:20206-1627459200-1627462800@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Update on backdrill samples being prepared. 
URL:https://hdpusergroup.org/event/disc2a-31/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210728T140000Z
DTEND:20210728T150000Z
DTSTAMP:20260423T052839
CREATED:20210624T183630Z
LAST-MODIFIED:20210624T183630Z
UID:20123-1627462800-1627466400@hdpusergroup.org
SUMMARY:ECM 2 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-call-7/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR