BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
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END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210601T150000Z
DTEND:20210601T160000Z
DTSTAMP:20260423T070231
CREATED:20210519T053049Z
LAST-MODIFIED:20210519T053049Z
UID:19880-1622541600-1622545200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-19/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210601T190000Z
DTEND:20210601T200000Z
DTSTAMP:20260423T070231
CREATED:20210525T143607Z
LAST-MODIFIED:20210525T143607Z
UID:19975-1622556000-1622559600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Start of new project 
URL:https://hdpusergroup.org/event/photonic-soldering-ii/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210601T200000Z
DTEND:20210601T210000Z
DTSTAMP:20260423T070231
CREATED:20210519T050927Z
LAST-MODIFIED:20210519T050927Z
UID:19783-1622559600-1622563200@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Next Steps \nPresentation for BoD and one for quarterly meeting 
URL:https://hdpusergroup.org/event/pcb-feature-min-8/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210602T150000Z
DTEND:20210602T160000Z
DTSTAMP:20260423T070231
CREATED:20210525T101958Z
LAST-MODIFIED:20210525T101958Z
UID:19972-1622628000-1622631600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-21/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210602T160000Z
DTEND:20210602T170000Z
DTSTAMP:20260423T070231
CREATED:20210512T175925Z
LAST-MODIFIED:20210512T175925Z
UID:19821-1622631600-1622635200@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-2/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T150000Z
DTEND:20210603T160000Z
DTSTAMP:20260423T070231
CREATED:20210524T155218Z
LAST-MODIFIED:20210524T155218Z
UID:19955-1622714400-1622718000@hdpusergroup.org
SUMMARY:ECM 2 project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-call-5/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T160000Z
DTEND:20210603T170000Z
DTSTAMP:20260423T070231
CREATED:20210521T192952Z
LAST-MODIFIED:20210521T192952Z
UID:19947-1622718000-1622721600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss June 3\, 2021 meeting
DESCRIPTION:Cu Surface Treatment vs Loss June 3\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-june-3-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T170000Z
DTEND:20210603T180000Z
DTSTAMP:20260423T070231
CREATED:20210519T164239Z
LAST-MODIFIED:20210519T164239Z
UID:19924-1622721600-1622725200@hdpusergroup.org
SUMMARY:TA Analysis Eval Placeholder
DESCRIPTION:TA Analysis Eval Placeholder 
URL:https://hdpusergroup.org/event/ta-analysis-eval-placeholder/
CATEGORIES:Staff Calendar
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T170000Z
DTEND:20210603T180000Z
DTSTAMP:20260423T070231
CREATED:20210520T143906Z
LAST-MODIFIED:20210520T143906Z
UID:19941-1622721600-1622725200@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Eval June 3\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Eval June 3\, 2021 meeting. \nNOTE we will be going back to Wednesdays at 11AM CST on June 16th 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-eval-june-3-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T180000Z
DTEND:20210603T190000Z
DTSTAMP:20260423T070231
CREATED:20210521T192624Z
LAST-MODIFIED:20210521T192624Z
UID:19946-1622725200-1622728800@hdpusergroup.org
SUMMARY:Cu Peel Strength June 3\, 2021 project meeting
DESCRIPTION:Cu Peel Strength June 3\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-june-3-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210604T140000Z
DTEND:20210604T150000Z
DTSTAMP:20260423T070231
CREATED:20210825T225642Z
LAST-MODIFIED:20210825T225642Z
UID:19789-1622797200-1622800800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210604T170000Z
DTEND:20210604T180000Z
DTSTAMP:20260423T070231
CREATED:20210524T155431Z
LAST-MODIFIED:20210524T155431Z
UID:19956-1622808000-1622811600@hdpusergroup.org
SUMMARY:Technology Direction telecom
DESCRIPTION:Technology Direction telecom 
URL:https://hdpusergroup.org/event/technology-direction-telecom/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210608T150000Z
DTEND:20210608T160000Z
DTSTAMP:20260423T070231
CREATED:20210525T162427Z
LAST-MODIFIED:20210525T162427Z
UID:19976-1623146400-1623150000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-8/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210608T170000Z
DTEND:20210608T180000Z
DTSTAMP:20260423T070231
CREATED:20210601T132546Z
LAST-MODIFIED:20210601T132546Z
UID:19999-1623153600-1623157200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Update
DESCRIPTION:Periodic project update 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-update/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210609T010000Z
DTEND:20210609T020000Z
DTSTAMP:20260423T070231
CREATED:20210531T053655Z
LAST-MODIFIED:20210531T053655Z
UID:19998-1623182400-1623186000@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC - Test Vehicle Discussion
DESCRIPTION:LVH Lifetime Predictor for TC - Test Vehicle Discussion 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-test-vehicle-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210609T140000Z
DTEND:20210609T150000Z
DTSTAMP:20260423T070231
CREATED:20210603T202748Z
LAST-MODIFIED:20210603T202748Z
UID:20018-1623229200-1623232800@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Hua's latest results 
URL:https://hdpusergroup.org/event/disc2a-28/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210609T150000Z
DTEND:20210609T160000Z
DTSTAMP:20260423T070231
CREATED:20210525T134255Z
LAST-MODIFIED:20210525T134255Z
UID:19974-1623232800-1623236400@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-5/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210609T170000Z
DTEND:20210609T180000Z
DTSTAMP:20260423T070231
CREATED:20210526T001508Z
LAST-MODIFIED:20210526T001508Z
UID:19985-1623240000-1623243600@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Dr Lu update \nOmar's work 
URL:https://hdpusergroup.org/event/board-thickness-ii-19/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210610T000000Z
DTEND:20210610T010000Z
DTSTAMP:20260423T070231
CREATED:20210601T142559Z
LAST-MODIFIED:20210601T142559Z
UID:20000-1623265200-1623268800@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive
DESCRIPTION:Call to discuss ATC results 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-10/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210610T200000Z
DTEND:20210610T210000Z
DTSTAMP:20260423T070231
CREATED:20210601T195302Z
LAST-MODIFIED:20210601T195302Z
UID:20004-1623337200-1623340800@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Status of membership \nMoving from Idea to Definition 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210611T150000Z
DTEND:20210611T160000Z
DTSTAMP:20260423T070231
CREATED:20210606T173717Z
LAST-MODIFIED:20210606T173717Z
UID:20028-1623405600-1623409200@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Project Update Meeting
DESCRIPTION:Periodic Project review meeting 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-project-update-meeting/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210615T150000Z
DTEND:20210615T160000Z
DTSTAMP:20260423T070231
CREATED:20210601T151111Z
LAST-MODIFIED:20210601T151111Z
UID:20002-1623751200-1623754800@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-20/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210615T200000Z
DTEND:20210615T210000Z
DTSTAMP:20260423T070231
CREATED:20210601T204522Z
LAST-MODIFIED:20210601T204522Z
UID:20005-1623769200-1623772800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Next step in finalizing design 
URL:https://hdpusergroup.org/event/pcb-feature-min-9/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T010000Z
DTEND:20210616T020000Z
DTSTAMP:20260423T070231
CREATED:20210825T232711Z
LAST-MODIFIED:20210825T232711Z
UID:19724-1623787200-1623790800@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-33/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T130000Z
DTEND:20210616T140000Z
DTSTAMP:20260423T070231
CREATED:20210609T173350Z
LAST-MODIFIED:20210609T173350Z
UID:20066-1623830400-1623834000@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:More info from Hua. 
URL:https://hdpusergroup.org/event/disc2a-29/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T150000Z
DTEND:20210616T160000Z
DTSTAMP:20260423T070231
CREATED:20210520T150430Z
LAST-MODIFIED:20210520T150430Z
UID:19930-1623837600-1623841200@hdpusergroup.org
SUMMARY:ECM 2 project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-call-4/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T160000Z
DTEND:20210616T170000Z
DTSTAMP:20260423T070231
CREATED:20210608T191535Z
LAST-MODIFIED:20210608T191535Z
UID:20042-1623841200-1623844800@hdpusergroup.org
SUMMARY:Thermal Analysis Mehthodology Evaluation June 16\, 2021 meeting
DESCRIPTION:Thermal Analysis Mehthodology Evaluation June 16\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-mehthodology-evaluation-june-16-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210616T180000Z
DTEND:20210616T190000Z
DTSTAMP:20260423T070231
CREATED:20210609T165509Z
LAST-MODIFIED:20210609T165509Z
UID:20055-1623848400-1623852000@hdpusergroup.org
SUMMARY:Glass Type Composition June 16\, 2021 meeting
DESCRIPTION:Glass Type Composition June 16\, 2021 meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-june-16-2021-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210617T150000Z
DTEND:20210617T160000Z
DTSTAMP:20260423T070231
CREATED:20210602T174029Z
LAST-MODIFIED:20210602T174029Z
UID:20017-1623924000-1623927600@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-3/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210618T150000Z
DTEND:20210618T160000Z
DTSTAMP:20260423T070231
CREATED:20210609T180652Z
LAST-MODIFIED:20210609T180652Z
UID:20025-1624010400-1624014000@hdpusergroup.org
SUMMARY:Technology Direction telecom
DESCRIPTION:Technology Direction telecom 
URL:https://hdpusergroup.org/event/technology-direction-telecom-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR