BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210503T150000Z
DTEND:20210503T160000Z
DTSTAMP:20260423T100702
CREATED:20210420T015632Z
LAST-MODIFIED:20210420T015632Z
UID:19679-1620036000-1620039600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-19/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210504T190000Z
DTEND:20210504T200000Z
DTSTAMP:20260423T100702
CREATED:20210419T204337Z
LAST-MODIFIED:20210419T204337Z
UID:19671-1620136800-1620140400@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Dr Lu's progress \n<ore modellling \nX-ray & x-section data 
URL:https://hdpusergroup.org/event/board-thickness-ii-17/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210504T200000Z
DTEND:20210504T210000Z
DTSTAMP:20260423T100702
CREATED:20210428T210649Z
LAST-MODIFIED:20210428T210649Z
UID:19750-1620140400-1620144000@hdpusergroup.org
SUMMARY:PCB Feature Min.
DESCRIPTION:Somacis \nInfo Kevin needs \n  
URL:https://hdpusergroup.org/event/pcb-feature-min-7/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210505T150000Z
DTEND:20210505T160000Z
DTSTAMP:20260423T100702
CREATED:20210414T153753Z
LAST-MODIFIED:20210414T153753Z
UID:19626-1620208800-1620212400@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-3/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210505T160000Z
DTEND:20210505T170000Z
DTSTAMP:20260423T100702
CREATED:20210426T224244Z
LAST-MODIFIED:20210426T224244Z
UID:19714-1620212400-1620216000@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Evaluation May 5\, 2021 project meeting
DESCRIPTION:Thermal Analysis Methodology Evaluation May 5\, 2021 project meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-evaluation-may-5-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210505T200000Z
DTEND:20210505T210000Z
DTSTAMP:20260423T100702
CREATED:20210428T201927Z
LAST-MODIFIED:20210428T201927Z
UID:19749-1620226800-1620230400@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Final Report \nScope of new project 
URL:https://hdpusergroup.org/event/photonic-soldering-30/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210506T140000Z
DTEND:20210506T150000Z
DTSTAMP:20260423T100702
CREATED:20210204T142536Z
LAST-MODIFIED:20210204T142536Z
UID:19200-1620291600-1620295200@hdpusergroup.org
SUMMARY:PFH Technology 2 Project Call
DESCRIPTION:PFH Technology 2 Project Call 
URL:https://hdpusergroup.org/event/pfh-technology-2-project-call/
CATEGORIES:PFH Technology 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210506T180000Z
DTEND:20210506T190000Z
DTSTAMP:20260423T100702
CREATED:20210426T191508Z
LAST-MODIFIED:20210426T191508Z
UID:19707-1620306000-1620309600@hdpusergroup.org
SUMMARY:HDP Cu Peel Strength P2 project May 6\, 2021 meeting
DESCRIPTION:HDP Cu Peel Strength P2 project May 6\, 2021 meeting 
URL:https://hdpusergroup.org/event/hdp-cu-peel-strength-p2-project-may-6-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210507T140000Z
DTEND:20210507T150000Z
DTSTAMP:20260423T100702
CREATED:20210423T083819Z
LAST-MODIFIED:20210423T083819Z
UID:19689-1620378000-1620381600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on Cycles To Failure At IST Project Meeting
DESCRIPTION:Effects of Plating Thickness on Cycles To Failure At IST Project Meeting 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-cycles-to-failure-at-ist-project-meeting/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210510T150000Z
DTEND:20210510T160000Z
DTSTAMP:20260423T100702
CREATED:20210427T121420Z
LAST-MODIFIED:20210427T121420Z
UID:19717-1620640800-1620644400@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-17/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210511T170000Z
DTEND:20210511T180000Z
DTSTAMP:20260423T100702
CREATED:20210420T174045Z
LAST-MODIFIED:20210420T174045Z
UID:19683-1620734400-1620738000@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Hua's new results 
URL:https://hdpusergroup.org/event/disc2a-26/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210511T170000Z
DTEND:20210511T180000Z
DTSTAMP:20260423T100702
CREATED:20210429T162335Z
LAST-MODIFIED:20210429T162335Z
UID:19777-1620734400-1620738000@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval2 Project Call
DESCRIPTION:Project Review Call \n  \nMeeting Logistics: \nMeeting link:https://hdpug.webex.com/hdpug/j.php?MTID=m07eae7a2772790e0d14ef8067dcac71d Meeting number:182 265 0602Password:qmH8bFR3zs5 
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval2-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210512T170000Z
DTEND:20210512T180000Z
DTSTAMP:20260423T100702
CREATED:20210428T165741Z
LAST-MODIFIED:20210428T165741Z
UID:19745-1620820800-1620824400@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210514T150000Z
DTEND:20210514T160000Z
DTSTAMP:20260423T100702
CREATED:20210427T122621Z
LAST-MODIFIED:20210427T122621Z
UID:19718-1620986400-1620990000@hdpusergroup.org
SUMMARY:Ultra Low Dk glass Telecom
DESCRIPTION:Ultra Low Dk glass Telecom 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-telecom-8/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210517T150000Z
DTEND:20210517T160000Z
DTSTAMP:20260423T100702
CREATED:20210415T152456Z
LAST-MODIFIED:20210415T152456Z
UID:19630-1621245600-1621249200@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-26/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210518T150000Z
DTEND:20210518T160000Z
DTSTAMP:20260423T100702
CREATED:20210421T142154Z
LAST-MODIFIED:20210421T142154Z
UID:19686-1621332000-1621335600@hdpusergroup.org
SUMMARY:CAF Eq
DESCRIPTION:Project update \nQuarterly report 
URL:https://hdpusergroup.org/event/caf-eq-2/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210518T160000Z
DTEND:20210518T170000Z
DTSTAMP:20260423T100702
CREATED:20210510T163222Z
LAST-MODIFIED:20210510T163222Z
UID:19798-1621335600-1621339200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-18/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210518T160000Z
DTEND:20210518T170000Z
DTSTAMP:20260423T100702
CREATED:20210512T140429Z
LAST-MODIFIED:20210512T140429Z
UID:19813-1621335600-1621339200@hdpusergroup.org
SUMMARY:Automotive Strategy Mtg
DESCRIPTION:Meeting to get in sink 
URL:https://hdpusergroup.org/event/automotive-strategy-mtg/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210518T190000Z
DTEND:20210518T200000Z
DTSTAMP:20260423T100702
CREATED:20210519T040653Z
LAST-MODIFIED:20210519T040653Z
UID:19879-1621346400-1621350000@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Quarterly presentations 
URL:https://hdpusergroup.org/event/photonic-soldering-31/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210519T140000Z
DTEND:20210519T150000Z
DTSTAMP:20260423T100702
CREATED:20210519T040959Z
LAST-MODIFIED:20210519T040959Z
UID:19826-1621414800-1621418400@hdpusergroup.org
SUMMARY:Review “Solder Joint Reliability with Surface Finishes” Project
DESCRIPTION:Review “Solder Joint Reliability with Surface Finishes” Project \n\n\nMeeting Information\n\n\n\nMeeting link:\nhttps://hdpug.webex.com/hdpug/j.php?MTID=mb10110a7d838fc9ba4ae166c5d1eaed9\nMeeting number:\n182 291 9388\nPassword:\npass123\n
URL:https://hdpusergroup.org/event/review-solder-joint-reliability-with-surface-finishes-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210519T150000Z
DTEND:20210519T160000Z
DTSTAMP:20260423T100702
CREATED:20210504T123115Z
LAST-MODIFIED:20210504T123115Z
UID:19780-1621418400-1621422000@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-20/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210519T160000Z
DTEND:20210519T170000Z
DTSTAMP:20260423T100702
CREATED:20210505T160545Z
LAST-MODIFIED:20210505T160545Z
UID:19785-1621422000-1621425600@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-4/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210519T170000Z
DTEND:20210519T180000Z
DTSTAMP:20260423T100702
CREATED:20210519T041530Z
LAST-MODIFIED:20210519T041530Z
UID:19878-1621425600-1621429200@hdpusergroup.org
SUMMARY:TA Methodology Evaluation May 19\, 2021 meeting Updated time to noon May 19
DESCRIPTION:  \nTA Methodology Evaluation May 19\, 2021 meeting> Note updated time to noon May 19 \nTA Methodology Evaluation May 19\, 2021 meetingHosted by HDP Staff \nhttps://hdpug.webex.com/hdpug/j.php?MTID=m9d1cd359d49479218abad511134c12e5Wednesday\, May 19\, 2021 11:00 am | 1 hour | (UTC-05:00) Central Time (US & Canada)Meeting number: 182 502 6229Password: pass123 \nJoin by video systemDial 1825026229@hdpug.webex.comYou can also dial 173.243.2.68 and enter your meeting number. \nJoin by phone1-650-479-3208 Call-in toll number (US/Canada)Access code: 182 502 6229
URL:https://hdpusergroup.org/event/ta-methodology-evaluation-may-19-2021-meeting-updated-time-to-noon-may-19/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210520T150000Z
DTEND:20210520T160000Z
DTSTAMP:20260423T100702
CREATED:20210427T151025Z
LAST-MODIFIED:20210427T151025Z
UID:19721-1621504800-1621508400@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:nnerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-7/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210520T160000Z
DTEND:20210520T170000Z
DTSTAMP:20260423T100702
CREATED:20210510T232254Z
LAST-MODIFIED:20210510T232254Z
UID:19799-1621508400-1621512000@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs loss May 20\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment Vs loss May 20\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-may-20-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210520T170000Z
DTEND:20210520T180000Z
DTSTAMP:20260423T100702
CREATED:20210519T041836Z
LAST-MODIFIED:20210519T041836Z
UID:19854-1621512000-1621515600@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Presentation \n\n\nMeeting Information\n\n\n\nMeeting link:\nhttps://hdpug.webex.com/hdpug/j.php?MTID=m6ca14b23993612bd4af85487200e7511\nMeeting number:\n182 909 1432\nPassword:\npass123\n
URL:https://hdpusergroup.org/event/disc2a-27/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210520T170000Z
DTEND:20210520T180000Z
DTSTAMP:20260423T100702
CREATED:20210519T154447Z
LAST-MODIFIED:20210519T154447Z
UID:19920-1621512000-1621515600@hdpusergroup.org
SUMMARY:TA Eval projectmeeting placeholder
DESCRIPTION:TA Eval placeholder 
URL:https://hdpusergroup.org/event/ta-eval-projectmeeting-placeholder/
CATEGORIES:Staff Calendar
END:VEVENT
BEGIN:VEVENT
DTSTART:20210520T170000Z
DTEND:20210520T180000Z
DTSTAMP:20260423T100702
CREATED:20210519T154453Z
LAST-MODIFIED:20210519T154453Z
UID:19921-1621512000-1621515600@hdpusergroup.org
SUMMARY:TA Eval projectmeeting placeholder
DESCRIPTION:TA Eval placeholder 
URL:https://hdpusergroup.org/event/ta-eval-projectmeeting-placeholder-2/
CATEGORIES:Staff Calendar
END:VEVENT
BEGIN:VEVENT
DTSTART:20210520T170000Z
DTEND:20210520T180000Z
DTSTAMP:20260423T100702
CREATED:20210519T154559Z
LAST-MODIFIED:20210519T154559Z
UID:19922-1621512000-1621515600@hdpusergroup.org
SUMMARY:TA Eval project meeting placeholder
DESCRIPTION:TA Eval placeholder 
URL:https://hdpusergroup.org/event/ta-eval-project-meeting-placeholder/
CATEGORIES:Staff Calendar
END:VEVENT
BEGIN:VEVENT
DTSTART:20210520T180000Z
DTEND:20210520T190000Z
DTSTAMP:20260423T100702
CREATED:20210510T232817Z
LAST-MODIFIED:20210510T232817Z
UID:19800-1621515600-1621519200@hdpusergroup.org
SUMMARY:Cu Peel Strength P2 May 20\, 2021 Project meeting
DESCRIPTION:Cu Peel Strength P2 May 20\, 2021 Project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-p2-may-20-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR