BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210401T160000Z
DTEND:20210401T170000Z
DTSTAMP:20260423T112701
CREATED:20210318T150146Z
LAST-MODIFIED:20210318T150146Z
UID:19469-1617274800-1617278400@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-24/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210405T150000Z
DTEND:20210405T160000Z
DTSTAMP:20260423T112701
CREATED:20210322T181359Z
LAST-MODIFIED:20210322T181359Z
UID:19475-1617616800-1617620400@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-17/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210405T190000Z
DTEND:20210405T200000Z
DTSTAMP:20260423T112701
CREATED:20210329T211154Z
LAST-MODIFIED:20210329T211154Z
UID:19499-1617631200-1617634800@hdpusergroup.org
SUMMARY:Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210405T200000Z
DTEND:20210405T210000Z
DTSTAMP:20260423T112701
CREATED:20210322T195434Z
LAST-MODIFIED:20210322T195434Z
UID:19476-1617634800-1617638400@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Next steps 
URL:https://hdpusergroup.org/event/board-thickness-ii-15/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210407T170000Z
DTEND:20210407T180000Z
DTSTAMP:20260423T112701
CREATED:20210310T194936Z
LAST-MODIFIED:20210310T194936Z
UID:19431-1617796800-1617800400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Leg April 7\, 2021 project meeting
DESCRIPTION:  \nLow Ag Alloy Solderpaste BGA Leg April 7\, 2021 project meeting
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-april-7-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210408T150000Z
DTEND:20210408T160000Z
DTSTAMP:20260423T112701
CREATED:20210405T152408Z
LAST-MODIFIED:20210405T152408Z
UID:19536-1617876000-1617879600@hdpusergroup.org
SUMMARY:Call with Casey
DESCRIPTION:Opportunity Discussion 
URL:https://hdpusergroup.org/event/call-with-casey/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210408T160000Z
DTEND:20210408T170000Z
DTSTAMP:20260423T112701
CREATED:20210329T233325Z
LAST-MODIFIED:20210329T233325Z
UID:19503-1617879600-1617883200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss April 8\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment vs Loss April 8\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-april-8-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210409T150000Z
DTEND:20210409T160000Z
DTSTAMP:20260423T112701
CREATED:20210326T134953Z
LAST-MODIFIED:20210326T134953Z
UID:19490-1617962400-1617966000@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Results of Hua's first experiments 
URL:https://hdpusergroup.org/event/disc2a-24/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210412T150000Z
DTEND:20210412T160000Z
DTSTAMP:20260423T112701
CREATED:20210330T124021Z
LAST-MODIFIED:20210330T124021Z
UID:19506-1618221600-1618225200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-16/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210413T150000Z
DTEND:20210413T160000Z
DTSTAMP:20260423T112701
CREATED:20210331T210518Z
LAST-MODIFIED:20210331T210518Z
UID:19518-1618308000-1618311600@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-5/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210413T170000Z
DTEND:20210413T180000Z
DTSTAMP:20260423T112701
CREATED:20210316T172053Z
LAST-MODIFIED:20210316T172053Z
UID:19460-1618315200-1618318800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval 2 Project Review
DESCRIPTION:Review project status
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval-2-project-review/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210413T190000Z
DTEND:20210413T200000Z
DTSTAMP:20260423T112701
CREATED:20210323T194046Z
LAST-MODIFIED:20210323T194046Z
UID:19482-1618322400-1618326000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status on NDAs \nStatus on Design \nStatus of BoD presentation 
URL:https://hdpusergroup.org/event/pcb-feature-min-5/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210413T200000Z
DTEND:20210413T210000Z
DTSTAMP:20260423T112701
CREATED:20210323T202305Z
LAST-MODIFIED:20210323T202305Z
UID:19483-1618326000-1618329600@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Shadowing and splatter addtions to final report \nPhase 2 - Possible topics? 
URL:https://hdpusergroup.org/event/photonic-soldering-28/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210414T150000Z
DTEND:20210414T160000Z
DTSTAMP:20260423T112701
CREATED:20210317T155625Z
LAST-MODIFIED:20210317T155625Z
UID:19467-1618394400-1618398000@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-2/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210415T150000Z
DTEND:20210415T160000Z
DTSTAMP:20260423T112701
CREATED:20210401T160612Z
LAST-MODIFIED:20210401T160612Z
UID:19520-1618480800-1618484400@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-25/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210415T180000Z
DTEND:20210415T190000Z
DTSTAMP:20260423T112701
CREATED:20210329T222942Z
LAST-MODIFIED:20210329T222942Z
UID:19501-1618491600-1618495200@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 April 15\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 April 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-april-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210419T150000Z
DTEND:20210419T160000Z
DTSTAMP:20260423T112701
CREATED:20210406T151730Z
LAST-MODIFIED:20210406T151730Z
UID:19548-1618826400-1618830000@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-18/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210419T180000Z
DTEND:20210419T190000Z
DTSTAMP:20260423T112701
CREATED:20210414T140734Z
LAST-MODIFIED:20210414T140734Z
UID:19624-1618837200-1618840800@hdpusergroup.org
SUMMARY:Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210419T200000Z
DTEND:20210419T210000Z
DTSTAMP:20260423T112701
CREATED:20210405T203422Z
LAST-MODIFIED:20210405T203422Z
UID:19538-1618844400-1618848000@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Several action items 
URL:https://hdpusergroup.org/event/board-thickness-ii-16/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210420T170000Z
DTEND:20210420T180000Z
DTSTAMP:20260423T112701
CREATED:20210409T162755Z
LAST-MODIFIED:20210409T162755Z
UID:19570-1618920000-1618923600@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Progress of various fronts 
URL:https://hdpusergroup.org/event/disc2a-25/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210421T140000Z
DTEND:20210421T150000Z
DTSTAMP:20260423T112701
CREATED:20210317T141840Z
LAST-MODIFIED:20210317T141840Z
UID:19466-1618995600-1618999200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Progress on testing 
URL:https://hdpusergroup.org/event/better-caf-eq-9/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210421T160000Z
DTEND:20210421T170000Z
DTSTAMP:20260423T112701
CREATED:20210319T164851Z
LAST-MODIFIED:20210319T164851Z
UID:19472-1619002800-1619006400@hdpusergroup.org
SUMMARY:Initial kickoff meeting of the new Thermal Analysis Methodology Assessment project
DESCRIPTION:Initial kickoff meeting of the new Thermal Analysis Methodology Assessment project 
URL:https://hdpusergroup.org/event/initial-kickoff-meeting-of-the-new-thermal-analysis-methodology-assessment-project/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210421T160000Z
DTEND:20210421T170000Z
DTSTAMP:20260423T112701
CREATED:20210412T170005Z
LAST-MODIFIED:20210412T170005Z
UID:19584-1619002800-1619006400@hdpusergroup.org
SUMMARY:Initial kickoff meeting of the new Thermal Analysis Methodology Assessment project
DESCRIPTION:  \nWed\, Apr 21\, 2021 11:00 AM GMT-06:00\, Central (Chicago) Meeting number (access code): 1829121323Meeting password: pass123 \nWhen it’s time\, Join the meeting \nJoin by phone:1-650-479-3208 Call-in toll number (US/Canada) Access Code: 1829121323
URL:https://hdpusergroup.org/event/initial-kickoff-meeting-of-the-new-thermal-analysis-methodology-assessment-project-2/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210421T170000Z
DTEND:20210421T180000Z
DTSTAMP:20260423T112701
CREATED:20210412T223011Z
LAST-MODIFIED:20210412T223011Z
UID:19599-1619006400-1619010000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste April 21\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste April 21\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-april-21-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210421T180000Z
DTEND:20210421T190000Z
DTSTAMP:20260423T112701
CREATED:20210329T222400Z
LAST-MODIFIED:20210329T222400Z
UID:19500-1619010000-1619013600@hdpusergroup.org
SUMMARY:Glass Type Comparison April 21\, 2021 project meeting
DESCRIPTION:Glass Type Comparison April 21\, 2021 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-april-21-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210422T010000Z
DTEND:20210422T020000Z
DTSTAMP:20260423T112701
CREATED:20210406T115510Z
LAST-MODIFIED:20210406T115510Z
UID:19539-1619035200-1619038800@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive Project Call
DESCRIPTION:Update on U.L. testing 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-13/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210422T150000Z
DTEND:20210422T160000Z
DTSTAMP:20260423T112701
CREATED:20210420T010013Z
LAST-MODIFIED:20210420T010013Z
UID:19568-1619085600-1619089200@hdpusergroup.org
SUMMARY:Kick off Meeting for Effects of Plating Thickness on CTF at IST
DESCRIPTION:Kick off Meeting for Effects of Plating Thickness on CTF at IST 
URL:https://hdpusergroup.org/event/kick-off-meeting-for-effects-of-plating-thickness-on-ctf-at-ist/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210422T160000Z
DTEND:20210422T170000Z
DTSTAMP:20260423T112701
CREATED:20210412T200755Z
LAST-MODIFIED:20210412T200755Z
UID:19596-1619089200-1619092800@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss April 22\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment vs Loss April 22\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-april-22-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210422T180000Z
DTEND:20210422T190000Z
DTSTAMP:20260423T112701
CREATED:20210415T202736Z
LAST-MODIFIED:20210415T202736Z
UID:19661-1619096400-1619100000@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 April 22\, 2021 meeting
DESCRIPTION:Cu Peel Strength Phase 2 April 22\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-april-22-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210423T150000Z
DTEND:20210423T160000Z
DTSTAMP:20260423T112701
CREATED:20210326T151412Z
LAST-MODIFIED:20210326T151412Z
UID:19491-1619172000-1619175600@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass telecom
DESCRIPTION:Ultra Low Dk Glass telecom 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-telecom-7/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR