BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210302T180000Z
DTEND:20210302T190000Z
DTSTAMP:20260423T124816
CREATED:20210216T183238Z
LAST-MODIFIED:20210216T183238Z
UID:19280-1614686400-1614690000@hdpusergroup.org
SUMMARY:Harsh Use Alloy 2
DESCRIPTION:Project review call.
URL:https://hdpusergroup.org/event/harsh-use-alloy-2-2/
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210302T200000Z
DTEND:20210302T210000Z
DTSTAMP:20260423T124816
CREATED:20210209T210141Z
LAST-MODIFIED:20210209T210141Z
UID:19246-1614693600-1614697200@hdpusergroup.org
SUMMARY:PCB Feature Miniaturization
DESCRIPTION:Progress on TV design 
URL:https://hdpusergroup.org/event/pcb-feature-miniaturization-4/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210302T210000Z
DTEND:20210302T220000Z
DTSTAMP:20260423T124816
CREATED:20210301T204439Z
LAST-MODIFIED:20210301T204439Z
UID:19384-1614697200-1614700800@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Draft final report \nOther soder pastes \nHeat sinking 
URL:https://hdpusergroup.org/event/photonic-soldering-26/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210303T020000Z
DTEND:20210303T050000Z
DTSTAMP:20260423T124816
CREATED:20210824T222527Z
LAST-MODIFIED:20210824T222527Z
UID:19201-1614715200-1614726000@hdpusergroup.org
SUMMARY:HDP March 2021 Virtual Member Meeting Asia
DESCRIPTION:March 2021 Virtual meeting review for Asia members.  Meeting is for members only.  Please register for the meeting by clicking the register button on this page\, or emailing the HDP Administrator at kima77@hdpug.org. \nMeeting Call Information \nHDP March 2-3\, 2021 Virtual Member Meeting Asia \nTuesday\, March 2\, 20218:00 PM  |  (UTC-06:00) Central Time (US & Canada)  |  4 hrsGlobal call-in numbersMeeting number (access code): 182 644 2636Meeting password: Mar2021AsiaWhen it’s time\, join the meetingJoin by phone1-650-479-3208 Call-in toll number (US/Canada)Global call-in numbers \n 
URL:https://hdpusergroup.org/event/hdp-march-2021-virtual-member-meeting-asia/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210304T160000Z
DTEND:20210304T170000Z
DTSTAMP:20260423T124816
CREATED:20210218T180409Z
LAST-MODIFIED:20210218T180409Z
UID:19317-1614852000-1614855600@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/1100am-1200pm-ecm2-project-call-2/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210305T140000Z
DTEND:20210305T150000Z
DTSTAMP:20260423T124816
CREATED:20210211T162928Z
LAST-MODIFIED:20210211T162928Z
UID:19247-1614931200-1614934800@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Progress by Hua on samples Jason sends. \nAny progres by Kevin on samples for depth of grind experiment. \nThilo's sample. \nIMEC progress. 
URL:https://hdpusergroup.org/event/disc2a-22/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210305T170000Z
DTEND:20210305T180000Z
DTSTAMP:20260423T124816
CREATED:20210301T190042Z
LAST-MODIFIED:20210301T190042Z
UID:19366-1614942000-1614945600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-15/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210308T160000Z
DTEND:20210308T170000Z
DTSTAMP:20260423T124816
CREATED:20210302T010440Z
LAST-MODIFIED:20210302T010440Z
UID:19386-1615197600-1615201200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-13/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210310T010000Z
DTEND:20210310T020000Z
DTSTAMP:20260423T124816
CREATED:20210224T022211Z
LAST-MODIFIED:20210224T022211Z
UID:19367-1615316400-1615320000@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-30/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210310T160000Z
DTEND:20210310T170000Z
DTSTAMP:20260423T124816
CREATED:20210301T210905Z
LAST-MODIFIED:20210301T210905Z
UID:19385-1615370400-1615374000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-4/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210310T180000Z
DTEND:20210310T190000Z
DTSTAMP:20260423T124816
CREATED:20210215T212428Z
LAST-MODIFIED:20210215T212428Z
UID:19273-1615377600-1615381200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Leg March 10\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA Leg March 10\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-march-10-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210311T020000Z
DTEND:20210311T030000Z
DTSTAMP:20260423T124816
CREATED:20210305T125346Z
LAST-MODIFIED:20210305T125346Z
UID:19400-1615406400-1615410000@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive Project Call
DESCRIPTION:Call to discuss testing with U.L. 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-12/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210311T170000Z
DTEND:20210311T180000Z
DTSTAMP:20260423T124816
CREATED:20210205T195517Z
LAST-MODIFIED:20210205T195517Z
UID:19220-1615460400-1615464000@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs Loss March 11\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment Vs Loss March 11\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-march-11-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210311T190000Z
DTEND:20210311T200000Z
DTSTAMP:20260423T124816
CREATED:20210215T212125Z
LAST-MODIFIED:20210215T212125Z
UID:19272-1615467600-1615471200@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 March 11\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 March 11\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-march-11-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210315T140000Z
DTEND:20210315T150000Z
DTSTAMP:20260423T124816
CREATED:20210309T162515Z
LAST-MODIFIED:20210309T162515Z
UID:19427-1615798800-1615802400@hdpusergroup.org
SUMMARY:Interview
DESCRIPTION:Interview Discussion 
URL:https://hdpusergroup.org/event/interview/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210315T150000Z
DTEND:20210315T160000Z
DTSTAMP:20260423T124816
CREATED:20210312T162614Z
LAST-MODIFIED:20210312T162614Z
UID:19438-1615802400-1615806000@hdpusergroup.org
SUMMARY:Reliability and Power Cycles Telecom
DESCRIPTION:Reliability and Power Cycles Telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-14/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210315T200000Z
DTEND:20210315T210000Z
DTSTAMP:20260423T124816
CREATED:20210315T135240Z
LAST-MODIFIED:20210315T135240Z
UID:19448-1615820400-1615824000@hdpusergroup.org
SUMMARY:meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210316T170000Z
DTEND:20210316T180000Z
DTSTAMP:20260423T124816
CREATED:20210216T182854Z
LAST-MODIFIED:20210312T180133Z
UID:19278-1615896000-1615899600@hdpusergroup.org
SUMMARY:Harsh Use Alloy 2 Call
DESCRIPTION:Harsh Use Alloy 2 Project Meeting
URL:https://hdpusergroup.org/event/harsh-use-allow-2-call/
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210316T180000Z
DTEND:20210316T190000Z
DTSTAMP:20260423T124816
CREATED:20210312T172039Z
LAST-MODIFIED:20210312T172039Z
UID:19432-1615899600-1615903200@hdpusergroup.org
SUMMARY:New Tg Thermal Analysis Project Discussion March 16\, 2021 (Change in time)
DESCRIPTION:Discussion on forming a new project on Tg Thermal Analysis at new time 1 PM CST 
URL:https://hdpusergroup.org/event/new-tg-thermal-analysis-project-discussion-march-16-2021/
LOCATION:WebEx
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210316T190000Z
DTEND:20210316T200000Z
DTSTAMP:20260423T124816
CREATED:20210312T120340Z
LAST-MODIFIED:20210312T120340Z
UID:19390-1615903200-1615906800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Progress of embership or NDAs for PCB houese \nDesign proposal 
URL:https://hdpusergroup.org/event/pcb-feature-min-3/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210317T140000Z
DTEND:20210317T150000Z
DTSTAMP:20260423T124816
CREATED:20210314T204204Z
LAST-MODIFIED:20210314T204204Z
UID:19443-1615971600-1615975200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Next steps 
URL:https://hdpusergroup.org/event/better-caf-eq-8/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210317T150000Z
DTEND:20210317T160000Z
DTSTAMP:20260423T124816
CREATED:20210217T172112Z
LAST-MODIFIED:20210217T172112Z
UID:19286-1615975200-1615978800@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210318T140000Z
DTEND:20210318T150000Z
DTSTAMP:20260423T124816
CREATED:20210304T162933Z
LAST-MODIFIED:20210304T162933Z
UID:19393-1616058000-1616061600@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-23/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210322T150000Z
DTEND:20210322T160000Z
DTSTAMP:20260423T124816
CREATED:20210316T165414Z
LAST-MODIFIED:20210316T165414Z
UID:19457-1616407200-1616410800@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-16/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210322T190000Z
DTEND:20210322T200000Z
DTSTAMP:20260423T124816
CREATED:20210314T205519Z
LAST-MODIFIED:20210314T205519Z
UID:19319-1616421600-1616425200@hdpusergroup.org
SUMMARY:Board  Thickness II
DESCRIPTION:Dr Lu’s progress \nRichard finding old data \nOmar’s initial modelling work 
URL:https://hdpusergroup.org/event/board-thickness-ii-14/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210322T200000Z
DTEND:20210322T210000Z
DTSTAMP:20260423T124816
CREATED:20210315T211523Z
LAST-MODIFIED:20210315T211523Z
UID:19452-1616425200-1616428800@hdpusergroup.org
SUMMARY:meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210323T190000Z
DTEND:20210323T200000Z
DTSTAMP:20260423T124816
CREATED:20210317T125527Z
LAST-MODIFIED:20210317T125527Z
UID:19464-1616508000-1616511600@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:progress on design 
URL:https://hdpusergroup.org/event/pcb-feature-min-4/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210323T200000Z
DTEND:20210323T210000Z
DTSTAMP:20260423T124816
CREATED:20210302T214007Z
LAST-MODIFIED:20210302T214007Z
UID:19392-1616511600-1616515200@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:X-sections\, Shadowing\, Solder balls and Heat sinking 
URL:https://hdpusergroup.org/event/photonic-soldering-27/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210324T120000Z
DTEND:20210324T130000Z
DTSTAMP:20260423T124816
CREATED:20210323T153754Z
LAST-MODIFIED:20210323T153754Z
UID:19481-1616569200-1616572800@hdpusergroup.org
SUMMARY:Gen 3 Discussion
DESCRIPTION:Discuss CAF testing requirements 
URL:https://hdpusergroup.org/event/gen-3-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210324T180000Z
DTEND:20210324T190000Z
DTSTAMP:20260423T124816
CREATED:20210309T183530Z
LAST-MODIFIED:20210309T183530Z
UID:19428-1616590800-1616594400@hdpusergroup.org
SUMMARY:Glass Type Comparison March 24\, 2021 project meeting
DESCRIPTION:  \nGlass Type Comparison March 24\, 2021 project meeting
URL:https://hdpusergroup.org/event/glass-type-comparison-march-24-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR