BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20200308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20201101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20200204T180000Z
DTEND:20200204T190000Z
DTSTAMP:20260424T113128
CREATED:20200122T133947Z
LAST-MODIFIED:20200122T133947Z
UID:15714-1580817600-1580821200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Call
DESCRIPTION:Review final report 
URL:https://hdpusergroup.org/event/harsh-use-alloy-call-6/
CATEGORIES:Harsh Use Environment Alloy Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200205T010000Z
DTEND:20200205T020000Z
DTSTAMP:20260424T113128
CREATED:20191226T023058Z
LAST-MODIFIED:20191226T023058Z
UID:15418-1580842800-1580846400@hdpusergroup.org
SUMMARY:PTH Creep Fatigue Under Roughness Influence Project Call
DESCRIPTION:PTH Creep Fatigue Under Roughness Influence Project Call 
URL:https://hdpusergroup.org/event/pth-creep-fatigue-under-roughness-influence-project-call-8/
CATEGORIES:PTH Creep Fatigue Under Roughness Influence
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200206T070000Z
DTEND:20200206T080000Z
DTSTAMP:20260424T113128
CREATED:20200109T074235Z
LAST-MODIFIED:20200109T074235Z
UID:15561-1580950800-1580954400@hdpusergroup.org
SUMMARY:Component Rework Reliability Project Call
DESCRIPTION:Component Rework Reliability Project Call 
URL:https://hdpusergroup.org/event/component-rework-reliability-project-call-8/
CATEGORIES:Component Rework Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200207T180000Z
DTEND:20200207T190000Z
DTSTAMP:20260424T113128
CREATED:20200125T034948Z
LAST-MODIFIED:20200125T034948Z
UID:15725-1581076800-1581080400@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass Analysis
DESCRIPTION:Ultra Low Dk Glass Analysis 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-4/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200210T160000Z
DTEND:20200210T170000Z
DTSTAMP:20260424T113128
CREATED:20200129T162117Z
LAST-MODIFIED:20200129T162117Z
UID:15732-1581328800-1581332400@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:We will review the draft for the Santa Clara Meeting and hear any updates from Nik\, Hubert and Eric. 
URL:https://hdpusergroup.org/event/better-caf-equation-10/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200210T170000Z
DTEND:20200210T180000Z
DTSTAMP:20260424T113128
CREATED:20200129T172543Z
LAST-MODIFIED:20200129T172543Z
UID:15733-1581332400-1581336000@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:See where we are regarding resources. 
URL:https://hdpusergroup.org/event/board-thickness-ii-3/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200211T170000Z
DTEND:20200211T180000Z
DTSTAMP:20260424T113128
CREATED:20200130T181344Z
LAST-MODIFIED:20200130T181344Z
UID:15737-1581418800-1581422400@hdpusergroup.org
SUMMARY:Photnic Soldering
DESCRIPTION:Nail down more items of the project. Edit the presentation for Santa Clara 
URL:https://hdpusergroup.org/event/photnic-soldering/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200211T180000Z
DTEND:20200211T190000Z
DTSTAMP:20260424T113128
CREATED:20200128T181708Z
LAST-MODIFIED:20200128T181708Z
UID:15730-1581422400-1581426000@hdpusergroup.org
SUMMARY:ECM2 Project Meeting
DESCRIPTION:Project call 
URL:https://hdpusergroup.org/event/ecm2-project-meeting-2/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T010000Z
DTEND:20200212T020000Z
DTSTAMP:20260424T113128
CREATED:20200108T031440Z
LAST-MODIFIED:20200108T031440Z
UID:15547-1581447600-1581451200@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-15/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T140000Z
DTEND:20200212T150000Z
DTSTAMP:20260424T113128
CREATED:20200204T110625Z
LAST-MODIFIED:20200204T110625Z
UID:15421-1581494400-1581498000@hdpusergroup.org
SUMMARY:PFH Technology Project Call
DESCRIPTION:PFH Technology Project Call 
URL:https://hdpusergroup.org/event/pfh-technology-project-call-12/
CATEGORIES:PFH Technology
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T160000Z
DTEND:20200212T170000Z
DTSTAMP:20260424T113128
CREATED:20200122T170547Z
LAST-MODIFIED:20200122T170547Z
UID:15717-1581501600-1581505200@hdpusergroup.org
SUMMARY:Materials #6 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-project-meeting-3/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T170000Z
DTEND:20200212T180000Z
DTSTAMP:20260424T113128
CREATED:20200112T203637Z
LAST-MODIFIED:20200112T203637Z
UID:15634-1581505200-1581508800@hdpusergroup.org
SUMMARY:Cu Grain Structure Special Meeting placeholder
DESCRIPTION:Cu Grain Structure Special Meeting placeholder 
URL:https://hdpusergroup.org/event/cu-grain-structure-special-meeting-placeholder/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T170000Z
DTEND:20200212T180000Z
DTSTAMP:20260424T113128
CREATED:20200113T182035Z
LAST-MODIFIED:20200113T182035Z
UID:15639-1581505200-1581508800@hdpusergroup.org
SUMMARY:Cu Grain Structure project meeting of Feb 12\, 2020
DESCRIPTION:Cu Grain Structure project meeting of Feb 12\, 2020 
URL:https://hdpusergroup.org/event/cu-grain-structure-project-meeting-of-feb-12-2020/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T180000Z
DTEND:20200212T190000Z
DTSTAMP:20260424T113128
CREATED:20200112T203206Z
LAST-MODIFIED:20200112T203206Z
UID:15631-1581508800-1581512400@hdpusergroup.org
SUMMARY:Low Ag Alloy Special meeting Placeholder
DESCRIPTION:Low Ag Alloy Special Meeting Placeholder 
URL:https://hdpusergroup.org/event/low-ag-alloy-special-meeting-placeholder/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T180000Z
DTEND:20200212T190000Z
DTSTAMP:20260424T113128
CREATED:20200113T182344Z
LAST-MODIFIED:20200113T182344Z
UID:15640-1581508800-1581512400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste – BGA Leg project meeting of Feb 12\, 2020
DESCRIPTION:Low Ag Alloy Solderpaste – BGA Leg project meeting of Feb 12\, 2020 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting-of-feb-12-2020/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200212T190000Z
DTEND:20200212T200000Z
DTSTAMP:20260424T113128
CREATED:20200112T203801Z
LAST-MODIFIED:20200112T203801Z
UID:15635-1581512400-1581516000@hdpusergroup.org
SUMMARY:Glass Stye Comp Special Meeting placeholder
DESCRIPTION:Glass Stye Comp Special Meeting placeholder 
URL:https://hdpusergroup.org/event/glass-stye-comp-special-meeting-placeholder/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200213T170000Z
DTEND:20200213T180000Z
DTSTAMP:20260424T113128
CREATED:20200112T203448Z
LAST-MODIFIED:20200112T203448Z
UID:15633-1581591600-1581595200@hdpusergroup.org
SUMMARY:Cu Peel Strength Special Meeting placeholder
DESCRIPTION:Cu Peel Strength Special Meeting placeholder 
URL:https://hdpusergroup.org/event/cu-peel-strength-special-meeting-placeholder/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200213T170000Z
DTEND:20200213T180000Z
DTSTAMP:20260424T113128
CREATED:20200113T182717Z
LAST-MODIFIED:20200113T182717Z
UID:15641-1581591600-1581595200@hdpusergroup.org
SUMMARY:Cu Peel Strength project meeting of Feb 13\, 2020
DESCRIPTION:Cu Peel Strength project meeting of Feb 13\, 2020 
URL:https://hdpusergroup.org/event/cu-peel-strength-project-meeting-of-feb-13-2020/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200213T180000Z
DTEND:20200213T190000Z
DTSTAMP:20260424T113128
CREATED:20200112T203328Z
LAST-MODIFIED:20200112T203328Z
UID:15632-1581595200-1581598800@hdpusergroup.org
SUMMARY:VeCS Special Meeting Placeholder
DESCRIPTION:VeCS Special Meeting Placeholder 
URL:https://hdpusergroup.org/event/vecs-special-meeting-placeholder/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200213T180000Z
DTEND:20200213T190000Z
DTSTAMP:20260424T113128
CREATED:20200113T184207Z
LAST-MODIFIED:20200113T184207Z
UID:15642-1581595200-1581598800@hdpusergroup.org
SUMMARY:VeCS project meeting of Feb 13\, 2020
DESCRIPTION:VeCS project meeting of Feb 13\, 2020
URL:https://hdpusergroup.org/event/vecs-project-meeting-of-feb-13-2020/
LOCATION:WebEx
CATEGORIES:VeCS Technology Evaluation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200213T200000Z
DTEND:20200213T210000Z
DTSTAMP:20260424T113128
CREATED:20200117T145940Z
LAST-MODIFIED:20200117T145940Z
UID:15698-1581602400-1581606000@hdpusergroup.org
SUMMARY:Mini Power Cycle call
DESCRIPTION:Review test data 
URL:https://hdpusergroup.org/event/mini-power-cycle-call-4/
CATEGORIES:Mini Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200213T210000Z
DTEND:20200213T220000Z
DTSTAMP:20260424T113128
CREATED:20200123T203334Z
LAST-MODIFIED:20200123T203334Z
UID:15723-1581606000-1581609600@hdpusergroup.org
SUMMARY:SAC Aging 3-84 Meeting
DESCRIPTION:Meeting \n  
URL:https://hdpusergroup.org/event/sac-aging-3-84-meeting-6/
CATEGORIES:SAC Aging 3 84
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200218T010000Z
DTEND:20200218T020000Z
DTSTAMP:20260424T113128
CREATED:20200213T070100Z
LAST-MODIFIED:20200213T070100Z
UID:15775-1581966000-1581969600@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project - screening test for adhesion call
DESCRIPTION:High Speed Hybrid PWB Project - screening test for adhesion call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-screening-test-for-adhesion-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200218T160000Z
DTEND:20200219T010000Z
DTSTAMP:20260424T113128
CREATED:20200211T192759Z
LAST-MODIFIED:20200211T192759Z
UID:15769-1582020000-1582052400@hdpusergroup.org
SUMMARY:HDP User Group Board of Directors Meeting
DESCRIPTION:First Board of Directors Meeting for 2020 
URL:https://hdpusergroup.org/event/hdp-user-group-board-of-directors-meeting-2/
CATEGORIES:Board Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200219T140000Z
DTEND:20200220T230000Z
DTSTAMP:20260424T113128
CREATED:20210825T013232Z
LAST-MODIFIED:20210825T013232Z
UID:15239-1582099200-1582218000@hdpusergroup.org
SUMMARY:HDP Annual Member Meeting
DESCRIPTION:There have been changes to the Day 1 Agenda.  Please review the agenda below for current presentation times. \nThe Annual HDP User Group Spring Member Meeting will be February 19-20\, 2020 in Santa Clara\, California\, USA\, hosted by UL.  You can register for the meeting by clicking the “register” button on the meeting page or emailing the HDP Administrator. \nWebEx Information: \n \nHDP Member Meeting Day 1 \nWednesday\, February 19\, 2020 \n8:00 am  |  (UTC-06:00) Central Time (US & Canada)  |  12 hrs \nGlobal call-in numbers \nMeeting number (access code): 628 871 205 \nMeeting password: HDPday1 \nWhen it’s time\, join the meeting. \n \nHDP Member Meeting Day 2 \nThursday\, February 20\, 2020 \n8:00 am  |  (UTC-06:00) Central Time (US & Canada)  |  12 hrs \nGlobal call-in numbers \nMeeting number (access code): 624 763 489 \nMeeting password: HDPday2 \nWhen it’s time\, join the meeting. \nHotel and Meeting Location \nThe meeting will be held at the Embassy Suites Milpitas – Silicon Valley.  HDP has negotiated a nightly room rate of $239\, that includes wi-fi and breakfast.  For assistance with hotel reservations please contact the HDP Administrator.  The deadline for hotel reservations is January 27th. \nEmbassy Suites Milpitas – Silicon Valley901 E Calaveras Blvd.Milpitas\, CA USA 95035 \nAgenda (all times are PST) \nDay 1 Invited Guests and Members      \n \n8:30 Registration\, coffee and socializing \n9:00    Opening of the meeting – Marshall Andrews\, HDP User Group \n\n Self-Introduction of invited guests – All\nSelf-Introduction of Members – All\nAwards – All\nHost Presentation – UL\n\nProjects Review/Status Update – Chair: Jack Fisher\, HDP User Group \n9:45    Printed Wiring Board Assembly \n\nElectro-Chemical Migration 2 – Julie Silk\, Keysight\nPhotonic Soldering – Vahid Akhavan\, NovaCentrix\n\n10:25  Printed Wiring Board Technology \n\nBack Drill under BGA – Karl Sauter\, Oracle\n\n10:45  Group Picture and Break (30min)   \n11:15 Guest Speaker \n\nKevin Knadle – TTM – “Counterfeit Reliability— The Critical Role of Temperature in Making\, Breaking\, and Testing Todays Electronics”\n\n12:15 Lunch (60 minutes) \n12:45  UL Tour \n2:30  Component Technology \n\nLead Frame Surface Finish – Bruce Lee\, MacDermid (Webex)\n\n2:50    New Project Proposals \n\nIPC Micro Via Proj. Overview – Denny Fritz (Webex)\nCITC vs IST – Mike Carano\, RPB Chemicals (Webex)\nNew Project proposal – Paul Cook\, AGC\nLaser Via Lifetime Predictor – Yoshi Hiroshima (Webex)\nMay Automotive Workship – Martin Cotton\n\n3:55    Break (15 min) \n4:10    Material Technology  \n\nUltra-Low Dk Glass Analysis –Scott Hinaga\, Cisco\nCu Grain Structure vs Loss  – Steve Wilkinson\, Juniper\nGlass type comparison – Crystal VanderPan\, U.L.\nBoard Thickness 2 – Eric Lundeen\, i3\n\n5:30    Open Discussion – New industry issues & collaboration opportunities – Jack Fisher\, HDP \n5:45    Feedback from members and Guests \n \n  \n \nDay 2 Members Only \n8:30    Registration\, Coffee and socializing \n9:00    Opening of the meeting\, introductions – Marshall Andrews\, HDP User Group \nProjects Review/Status Update – Chair: Jack Fisher\, HDP User Group \n9:10    B.O.D. Report \n9:20    Printed Wiring Board Assembly \n\nLow Ag Alloy Reliability BGA leg – Rusty Osgood\, Flex / Richard Coyle\, Nokia (Webex)\n\n9:45    Material Technology  \n\nSAC Aging 3-84  – Richard Coyle\, Nokia  (Webex)\n\n10:10 Break (25 min)  \n10:35 Emerging Technology \n\nVeCS Technology Evaluation – Joe Dickson\, WUS\nOpto-electronics II – Greg Bradburn – Cisco\nFuture HDI –Tony Senese\, Panasonic Close Out\n\n11:50  Lunch (45 min) \n12:50 Printed Wiring Board Technology \n\nPb Free PWB Materials Reliability 6 – Steve Wilkinson\, Juniper\nCopper Peel Strength – Jim Fuller\, Sanmina\n\n1:40    Component Technology \n\nMini Power Cycles – Joe Smetana\, Nokia (Webex)\nReliability of Wettable Flank in Routable QFN for Automotive – Dr. Bae\, Haesung\n\n 2:30    Printed Wiring Board Technology  \n\nRF Failure Detection – Joe Smetana\, Nokia (Webex)\nBetter CAF Acceleration Equation – Tony Senese\, Panasonic\nDesign Related PWB Material Damage – Steve Wilkinson\, Juniper\n\n3:45    Break (15 min) \n4:00    Printed Wiring Board Technology (Continue).  \n\nPTH Creep Fatigue Under Roughness Influence – Yoshi Hiroshima\, Fujitsu (Webex)\nHigh Speed Hybrid PWB – Yoshi\, Fujitsu (Webex)\n\n4:40    Printed Wiring Board Technology \n\nPlated Filled Hole Technology – Joe Zou\, Elec&Eltek (Webex)\n\n4:55    Printed Wiring Board Assembly \n\nComponent Rework Reliability – Mei-Ming Khaw\, Keysight (Webex) \n\n5:15   Open Discussion \n\nIndustry issues and problems- collaboration opportunities – Jack Fisher\, HDP \n\n5:45   Any Other Business and Feedback from Attendees \nClose of meeting \n7:00   Dinner \n  \n \n 
URL:https://hdpusergroup.org/event/hdp-annual-member-meeting/
LOCATION:Santa Clara\, California\, USA
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200224T170000Z
DTEND:20200224T180000Z
DTSTAMP:20260424T113128
CREATED:20200210T211023Z
LAST-MODIFIED:20200210T211023Z
UID:15751-1582542000-1582545600@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:See where we are with gathering resources 
URL:https://hdpusergroup.org/event/board-thickness-ii-4/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200226T150000Z
DTEND:20200226T160000Z
DTSTAMP:20260424T113128
CREATED:20200211T191857Z
LAST-MODIFIED:20200211T191857Z
UID:15770-1582707600-1582711200@hdpusergroup.org
SUMMARY:ECM2 project Meeting
DESCRIPTION:Project call \n  
URL:https://hdpusergroup.org/event/ecm2-project-meeting-3/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200227T150000Z
DTEND:20200227T160000Z
DTSTAMP:20260424T113128
CREATED:20200226T144035Z
LAST-MODIFIED:20200226T144035Z
UID:15816-1582794000-1582797600@hdpusergroup.org
SUMMARY:EIPC call to discuss May meeting
DESCRIPTION:Discussion on arrangements for May HDP/EIPC conference. 
URL:https://hdpusergroup.org/event/eipc-call-to-discuss-may-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200227T160000Z
DTEND:20200227T170000Z
DTSTAMP:20260424T113128
CREATED:20200211T042459Z
LAST-MODIFIED:20200211T042459Z
UID:15763-1582797600-1582801200@hdpusergroup.org
SUMMARY:Backdrill under BGA
DESCRIPTION:Backdrill under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-2/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200228T180000Z
DTEND:20200228T190000Z
DTSTAMP:20260424T113128
CREATED:20200211T041010Z
LAST-MODIFIED:20200211T041010Z
UID:15762-1582891200-1582894800@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass Analysis
DESCRIPTION:Ultra Low Dk Glass Telecom 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-5/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR