BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
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X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20261007T130000Z
DTEND:20261007T140000Z
DTSTAMP:20261007T004734
CREATED:20260923T141844Z
LAST-MODIFIED:20260923T141844Z
UID:44702-1791360000-1791363600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Call
DESCRIPTION:Project Meeting Call 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-call/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20261007T140000Z
DTEND:20261007T150000Z
DTSTAMP:20261007T004734
CREATED:20260924T141500Z
LAST-MODIFIED:20260924T141500Z
UID:44713-1791363600-1791367200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-30/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20261007T160000Z
DTEND:20261007T170000Z
DTSTAMP:20261007T004734
CREATED:20260722T163217Z
LAST-MODIFIED:20260722T163217Z
UID:41155-1791370800-1791374400@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-10/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20261007T180000Z
DTEND:20261007T190000Z
DTSTAMP:20261007T004734
CREATED:20260923T170319Z
LAST-MODIFIED:20260923T170319Z
UID:44707-1791378000-1791381600@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Liumits
DESCRIPTION:Finalize test vehicles\, aspect ratio\, overall design 
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-liumits/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20261008T010000Z
DTEND:20261008T020000Z
DTSTAMP:20261007T004734
CREATED:20260903T013406Z
LAST-MODIFIED:20260903T013406Z
UID:41352-1791403200-1791406800@hdpusergroup.org
SUMMARY:Correlating CF Profile to Other Properties Project Call
DESCRIPTION:Correlating CF Profile to Other Properties Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-other-properties-project-call/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR