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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
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BEGIN:VEVENT
DTSTART:20260611T140000Z
DTEND:20260611T150000Z
DTSTAMP:20260528T135210
CREATED:20260513T142900Z
LAST-MODIFIED:20260513T142900Z
UID:40044-1781168400-1781172000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-22/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T150000Z
DTEND:20260611T160000Z
DTSTAMP:20260528T135210
CREATED:20260521T141322Z
LAST-MODIFIED:20260521T141322Z
UID:40339-1781172000-1781175600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-21/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T160000Z
DTEND:20260611T170000Z
DTSTAMP:20260528T135210
CREATED:20260521T162633Z
LAST-MODIFIED:20260521T162633Z
UID:40343-1781175600-1781179200@hdpusergroup.org
SUMMARY:TCE Materials-CTE Validation
DESCRIPTION:CTE x-y and Z axis validation 
URL:https://hdpusergroup.org/event/tce-materials-cte-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T170000Z
DTEND:20260611T180000Z
DTSTAMP:20260528T135210
CREATED:20260515T130324Z
LAST-MODIFIED:20260515T130324Z
UID:40290-1781179200-1781182800@hdpusergroup.org
SUMMARY:Paste Interconnect Exploratory Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-exploratory-meeting-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T180000Z
DTEND:20260611T190000Z
DTSTAMP:20260528T135210
CREATED:20260515T133549Z
LAST-MODIFIED:20260515T133549Z
UID:40291-1781182800-1781186400@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limitations
DESCRIPTION:What are limitations related to plated through hole reliabilty? With designs approaching 30:1 and beyond\, what are the factors that contribute either to the success or failure of the the PTH? \nIs there a new or revised standard that is required to set expectations for rugged environments as well as those end products that must perform 24/7 365 days per year? \nthe kick-off meeting provided many ideas of key factos that could influence PTH plating sucess and reliability. \nIn addition\, the first order of business is to decide on a test vehicle and decide on a few key parameters to study initially. This project is considered a multi-phase exercise that will be set up as various parts. 
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limitations/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T190000Z
DTEND:20260611T200000Z
DTSTAMP:20260528T135210
CREATED:20260515T125154Z
LAST-MODIFIED:20260515T125154Z
UID:40289-1781186400-1781190000@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-Ups
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-21/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR