BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260514T150000Z
DTEND:20260514T160000Z
DTSTAMP:20260514T010148
CREATED:20260423T153415Z
LAST-MODIFIED:20260423T153415Z
UID:40063-1778752800-1778756400@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-6/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T160000Z
DTEND:20260514T170000Z
DTSTAMP:20260514T010148
CREATED:20260430T153754Z
LAST-MODIFIED:20260430T153754Z
UID:40098-1778756400-1778760000@hdpusergroup.org
SUMMARY:Thermal cooling methods-New Idea Discussion
DESCRIPTION:Discussion new idea project for Thermal Cooling Methods. \nNew Project Idea Call \n“Cooling Methods for Heat Dissipation” \nThere are significant challenges introduced by advanced packaging in terms of power delivery and thermal management.  \nNew thermal solutions (not including liquid cooling) for implementation with advanced substrates\, 3D Heterogeneous Integration and other design aspects\, are needed to reduce hotspots\, maintain thermal targets\, and enable long-term reliability in complex multilayer stacks. \nExpected solutions could include vertical heat extraction with TIM (Thermal Interface Materials)\, heat spreaders\, heat sinks and active and passive cooling of advanced package devices to allow the system to operate at higher power density levels. Consideration of any advanced materials including laminates is a possible solution.  \nPlease join us for a Project Idea Initiation call on May 14\, 2026 at 11:00 am Central time US. 
URL:https://hdpusergroup.org/event/thermal-cooling-methods-new-idea-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T170000Z
DTEND:20260514T180000Z
DTSTAMP:20260514T010148
CREATED:20260511T132158Z
LAST-MODIFIED:20260511T132158Z
UID:40137-1778760000-1778763600@hdpusergroup.org
SUMMARY:Paste Interconnect Exploratory Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-exploratory-meeting-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T180000Z
DTEND:20260514T190000Z
DTSTAMP:20260514T010148
CREATED:20260430T153913Z
LAST-MODIFIED:20260430T153913Z
UID:40103-1778763600-1778767200@hdpusergroup.org
SUMMARY:High aspect ratio through hole plating limits
DESCRIPTION:New Project Idea Call \n  \nHigh Aspect Ratio Through Hole Limits \nWith AI\, High Performance Computing\, Data Centers\, ADAS among other technologies\, layer counts are increasing. In addition\, aspect ratios of the plated through holes are becoming more challenging. It has long been recognized that copper plating thickness in the via as well as plating uniformity\, play a significant role in the overall long-term reliability of the via. As via diameters decrease and aspect ratios increase\, how much copper is required to ensure the long-term reliability of the vias? As aspect ratios increase\, fluid dynamics and chemical composition of the plating solution take on increased importance. What is the physical limitation of the PTH aspect ratio? Where does the reliability decrease? Can this be modeled?  Industry test methods such as IST and other accepted methods  can be employed to test to fail. \nThis new project idea call will take place on May 14\, 2026 at 1:00 pm Central Time U.S. Via Webex \nPlease join us for this important meeting. 
URL:https://hdpusergroup.org/event/high-aspect-ratio-through-hole-plating-limits/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T190000Z
DTEND:20260514T200000Z
DTSTAMP:20260514T010148
CREATED:20260416T194737Z
LAST-MODIFIED:20260416T194737Z
UID:40034-1778767200-1778770800@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Look at last round of FA \nWork on final report 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-20/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T200000Z
DTEND:20260514T210000Z
DTSTAMP:20260514T010148
CREATED:20260430T204845Z
LAST-MODIFIED:20260430T204845Z
UID:40107-1778770800-1778774400@hdpusergroup.org
SUMMARY:Cu Outer Layer Trace Adhesion
DESCRIPTION:Review final report and DATA 
URL:https://hdpusergroup.org/event/cu-outer-layer-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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