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DTSTART:20251016T140000Z
DTEND:20251016T150000Z
DTSTAMP:20260417T153612
CREATED:20250924T143411Z
LAST-MODIFIED:20250924T143411Z
UID:37371-1760605200-1760608800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Hopefully finalize fall meeeting presentation 
URL:https://hdpusergroup.org/event/better-caf-eq-51/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20251016T150000Z
DTEND:20251016T160000Z
DTSTAMP:20260417T153612
CREATED:20250924T153519Z
LAST-MODIFIED:20250924T153519Z
UID:37372-1760608800-1760612400@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-3/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20251016T160000Z
DTEND:20251016T170000Z
DTSTAMP:20260417T153612
CREATED:20251002T200522Z
LAST-MODIFIED:20251002T200522Z
UID:37576-1760612400-1760616000@hdpusergroup.org
SUMMARY:TCE Materials-CTE Method validation
DESCRIPTION:There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However\, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critical and will positively affect solder joint reliability. System developments in packaging are driving the size of packages to grow\, and I/O pitches to become finer. Both of these factors are impacting the reliability of products\, as more x-y stress is being placed on the solder joints. \nThe industry lacks a validated universal test method designed to measure CTE \nMaterials suppliers and OEMs rely on their own internal testing methodologies with no standard method. \nThis project will develop a standard test method through a validation process to measure CTE in the Z and X-Y axes. \n  
URL:https://hdpusergroup.org/event/tce-materials-cte-method-validation-2/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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