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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20251002T140000Z
DTEND:20251002T150000Z
DTSTAMP:20260417T183128
CREATED:20250910T153008Z
LAST-MODIFIED:20250910T153008Z
UID:37287-1759395600-1759399200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:D-Coupon IST CITC Reliability Testing Project meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-6/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20251002T140000Z
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DTSTAMP:20260417T183128
CREATED:20251002T150606Z
LAST-MODIFIED:20251002T150606Z
UID:37566-1759395600-1759399200@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing Project
DESCRIPTION:Evaluate how typical D-Coupon\, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used. 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20251002T150000Z
DTEND:20251002T160000Z
DTSTAMP:20260417T183128
CREATED:20250918T160223Z
LAST-MODIFIED:20250918T160223Z
UID:37355-1759399200-1759402800@hdpusergroup.org
SUMMARY:PCB Flatness at Large Package Attach Locations
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-large-package-attach-locations-3/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20251002T160000Z
DTEND:20251002T170000Z
DTSTAMP:20260417T183128
CREATED:20250918T163932Z
LAST-MODIFIED:20250918T163932Z
UID:37356-1759402800-1759406400@hdpusergroup.org
SUMMARY:TCE Materials-CTE method validation
DESCRIPTION:Finalize test plan and shipment addresses 
URL:https://hdpusergroup.org/event/tce-materials-cte-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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