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DTSTART:20250916T170000Z
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CREATED:20250905T130039Z
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UID:37154-1758024000-1758027600@hdpusergroup.org
SUMMARY:Proposed HDP Cleaning Project
DESCRIPTION:Component sizes are climbing – 90 x 100\, 100 x 100\, even 165 x 165 mm2.  Current no-clean flux chemistries may not meet the requirements of all OEMs/customers. How is our industry going to deal with this?  In some instances\, cleaner raw materials for fluxes\, etc. will be sufficient\, but not in others. That inevitably leaves companies with the task of cleaning. What chemistries\, equipment and process parameters are required to clean under a 100 x 100 mm2 component with\, for example\, a 0.4 mm pitch and minimal standoff?  \nDo we have custom-made glass components (expensive) manufactured\, use traditional dummy components\, use FR4 “sandwiches”\, or transparent plastic held on with glue only? The latter begs the question; do we go for BGA/CSP or QFN/LGA standoffs? Traditional aqueous\, semi-aqueous\, solvent-based and/or something like super critical fluid cleaning?   The project will NOT compare chemistries or equipment types to determine which is “best”.  The team will strive to develop a focused plan that can be executed by team member companies in a reasonable time period. \nIf interested\, please join a Webex meeting where the possibility of an HDPUG-lead project will be discussed. All in the electronics industry are invited to participate for at least the planning portion of the project.   \n  
URL:https://hdpusergroup.org/event/proposed-hdp-cleaning-project/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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