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DTSTART:20250904T140000Z
DTEND:20250904T150000Z
DTSTAMP:20260417T214852
CREATED:20250821T141943Z
LAST-MODIFIED:20250821T141943Z
UID:36876-1756976400-1756980000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact SMTAi Paper Review
DESCRIPTION:Reflow Cycle Via Reliability Impact SMTAi Paper Review 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-smtai-paper-review-3/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20250904T150000Z
DTEND:20250904T160000Z
DTSTAMP:20260417T214852
CREATED:20250821T161200Z
LAST-MODIFIED:20250821T161200Z
UID:36888-1756980000-1756983600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-15/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250904T160000Z
DTEND:20250904T170000Z
DTSTAMP:20260417T214852
CREATED:20250814T165214Z
LAST-MODIFIED:20250814T165214Z
UID:36696-1756983600-1756987200@hdpusergroup.org
SUMMARY:TCE Materials x-Y test method validation
DESCRIPTION:Review test parameters. \nfinalize particpants \nRequest implementation 
URL:https://hdpusergroup.org/event/tce-materials-x-y-test-method-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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