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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20250309T080000
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DTSTART:20251102T070000
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DTSTART:20250625T140000Z
DTEND:20250625T150000Z
DTSTAMP:20260421T051555
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LAST-MODIFIED:20250604T142907Z
UID:36010-1750842000-1750845600@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-20/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250625T160000Z
DTEND:20250625T170000Z
DTSTAMP:20260421T051555
CREATED:20250528T161234Z
LAST-MODIFIED:20250528T161234Z
UID:35860-1750849200-1750852800@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-21/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250625T200000Z
DTEND:20250625T210000Z
DTSTAMP:20260421T051555
CREATED:20250528T214437Z
LAST-MODIFIED:20250528T214437Z
UID:35862-1750863600-1750867200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Status of coupon build \nData analysis of the trial run 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-16/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250626T010000Z
DTEND:20250626T020000Z
DTSTAMP:20260421T051555
CREATED:20250528T012238Z
LAST-MODIFIED:20250528T012238Z
UID:35857-1750881600-1750885200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-20/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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