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X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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DTSTART:20240310T080000
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DTSTART:20241204T160000Z
DTEND:20241204T170000Z
DTSTAMP:20260419T222417
CREATED:20241113T162821Z
LAST-MODIFIED:20241113T162821Z
UID:28390-1733306400-1733310000@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-2/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20241204T170000Z
DTEND:20241204T180000Z
DTSTAMP:20260419T222417
CREATED:20241030T163629Z
LAST-MODIFIED:20241030T163629Z
UID:28283-1733310000-1733313600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing - Phase 2
DESCRIPTION:I/L Cu Balancing - Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-2/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T210000Z
DTEND:20241204T220000Z
DTSTAMP:20260419T222417
CREATED:20241030T203621Z
LAST-MODIFIED:20241030T203621Z
UID:28285-1733324400-1733328000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Talk about design\, fab\, # of samples\, material type(s) 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-8/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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