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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
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DTSTART:20241103T070000
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DTSTART:20241030T150000Z
DTEND:20241030T160000Z
DTSTAMP:20260419T093257
CREATED:20241002T155218Z
LAST-MODIFIED:20241002T155218Z
UID:28070-1730282400-1730286000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-25/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T160000Z
DTEND:20241030T170000Z
DTSTAMP:20260419T093257
CREATED:20241015T152049Z
LAST-MODIFIED:20241015T152049Z
UID:28170-1730286000-1730289600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing – Phase 2
DESCRIPTION:Inner Layer Cu Balancing – Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20241030T200000Z
DTEND:20241030T210000Z
DTSTAMP:20260419T093257
CREATED:20241002T190549Z
LAST-MODIFIED:20241002T190549Z
UID:27764-1730300400-1730304000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Hopefully had both a CAD source and PCB manufacturer onboard before the meeting or by the end of the meeting. 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-7/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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