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DTSTART:20240918T140000Z
DTEND:20240918T150000Z
DTSTAMP:20260419T222544
CREATED:20240905T143853Z
LAST-MODIFIED:20240905T143853Z
UID:27400-1726650000-1726653600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-14/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20240918T150000Z
DTEND:20240918T160000Z
DTSTAMP:20260419T222544
CREATED:20240904T153459Z
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UID:27380-1726653600-1726657200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-15/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240918T200000Z
DTEND:20240918T210000Z
DTSTAMP:20260419T222544
CREATED:20240828T202441Z
LAST-MODIFIED:20240828T202441Z
UID:27265-1726671600-1726675200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue defining the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-6/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20240919T000000Z
DTEND:20240919T010000Z
DTSTAMP:20260419T222544
CREATED:20240905T024818Z
LAST-MODIFIED:20240905T024818Z
UID:27394-1726686000-1726689600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-6/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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