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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20240725T140000Z
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CREATED:20240718T160104Z
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UID:27052-1721898000-1721901600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Response from Singapore \nNext steps 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20240725T150000Z
DTEND:20240725T160000Z
DTSTAMP:20260420T014103
CREATED:20240627T153219Z
LAST-MODIFIED:20240627T153219Z
UID:26896-1721901600-1721905200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-13/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20240725T200000Z
DTEND:20240725T210000Z
DTSTAMP:20260420T014103
CREATED:20240710T202911Z
LAST-MODIFIED:20240710T202911Z
UID:27027-1721919600-1721923200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping out the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-3/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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