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X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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TZOFFSETFROM:-0600
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DTSTART:20240310T080000
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DTSTART:20240515T140000Z
DTEND:20240515T150000Z
DTSTAMP:20260420T044332
CREATED:20240501T144845Z
LAST-MODIFIED:20240501T144845Z
UID:26303-1715763600-1715767200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-11/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T150000Z
DTEND:20240515T160000Z
DTSTAMP:20260420T044332
CREATED:20240501T155522Z
LAST-MODIFIED:20240501T155522Z
UID:26304-1715767200-1715770800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting \n  \n  \n  
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T200000Z
DTEND:20240515T210000Z
DTSTAMP:20260420T044332
CREATED:20240507T141541Z
LAST-MODIFIED:20240507T141541Z
UID:26356-1715785200-1715788800@hdpusergroup.org
SUMMARY:NEW PROJECT - Outer Trace Adhesion
DESCRIPTION:HDP recently completed a project about the adhesion strength of inner layer copper traces.  This new project proposes to investigate and validate a quantitative test method for determining the adhesion strength of ultra thin traces on the outside of a PCB.  Come bring your ideas to this kick-off meeting. 
URL:https://hdpusergroup.org/event/new-project-outer-trace-adhesion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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