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X-WR-CALDESC:Events for HDP User Group
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TZOFFSETFROM:-0600
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DTSTART:20240310T080000
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DTSTART:20240327T140000Z
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LAST-MODIFIED:20240306T153227Z
UID:25825-1711530000-1711533600@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-7/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20240327T150000Z
DTEND:20240327T160000Z
DTSTAMP:20260420T075200
CREATED:20240306T161502Z
LAST-MODIFIED:20240306T161502Z
UID:25826-1711533600-1711537200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-9/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20240327T160000Z
DTEND:20240327T170000Z
DTSTAMP:20260420T075200
CREATED:20240307T144630Z
LAST-MODIFIED:20240307T144630Z
UID:25818-1711537200-1711540800@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-8/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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