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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20240310T080000
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DTSTART:20240213T160000Z
DTEND:20240213T170000Z
DTSTAMP:20260420T092449
CREATED:20240201T230020Z
LAST-MODIFIED:20240201T230020Z
UID:25420-1707818400-1707822000@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-6/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20240213T170000Z
DTEND:20240213T180000Z
DTSTAMP:20260420T092449
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UID:25061-1707822000-1707825600@hdpusergroup.org
SUMMARY:New Project idea High Speed Coupon
DESCRIPTION:An HDP member proposed this new HDP project idea at HDP Member Meeting in October\, and other members have expressed interest. After two HDP “New Idea” meetings\, the status of the now revised new project idea as of the January 16 Webex call is as follows: \n\nThe Team has discussed two different purposes for this kind of testing; DVT for design verification/validation testing and for ongoing volume production control. There are many different DVT test methods being used and for a variety of reasons. As frustrating as this is for the laminate manufacturers who are developing new materials\, the concensus appears that it is unrealistic to think that HDP can come up with a very high frequency test coupon that everyone in the industry would agree to use beyond requiring a general higher speed 4-wire test method.\n \n \nThere is some interest by the participants in this new project undertaking to learn the ability of more practical volume production signal integrity test methods (ex: Delta-L V4\, Cisco’s S-3) to detect certain “minor” PCB Fab manufacturing variations which would not be acceptable in higher speed applications. Possible factors of interest include:\n* Resin Content 65% versus 75%\n* Nominal trace width change of more than 10 percent\n* Change of alternate oxide treatment and/or significant change in the depth of etch\n* Copper foil change from HVLP-2 to HVLP-1 or to RTF-2\nNote these changes may be combined and not significantly affect the standard board impedance test results.\n \nThe goals for the meeting on Feb 13 are for the team to discuss further and better define this new project\, then to select a project technical content leader.\nNote HDP Facilitator (Karl Sauter) does the project admin and work on resources.\n \nTo participate in this project\, send email to: Karls@hdpug.org\n\n  
URL:https://hdpusergroup.org/event/new-project-idea-high-speed-coupon/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20240213T230000Z
DTEND:20240214T000000Z
DTSTAMP:20260420T092449
CREATED:20240207T170119Z
LAST-MODIFIED:20240207T170119Z
UID:25572-1707843600-1707847200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Do we proceed or not? 
URL:https://hdpusergroup.org/event/porosity-2/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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