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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZOFFSETFROM:-0600
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DTSTART:20230312T080000
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230112T140000Z
DTEND:20230112T150000Z
DTSTAMP:20260421T085736
CREATED:20221202T200946Z
LAST-MODIFIED:20221202T200946Z
UID:23489-1673510400-1673514000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Next update 
URL:https://hdpusergroup.org/event/better-caf-eq-25/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T160000Z
DTEND:20230112T170000Z
DTSTAMP:20260421T085736
CREATED:20221201T165934Z
LAST-MODIFIED:20221201T165934Z
UID:23480-1673517600-1673521200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-12/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T170000Z
DTEND:20230112T180000Z
DTSTAMP:20260421T085736
CREATED:20230104T171118Z
LAST-MODIFIED:20230104T171118Z
UID:23501-1673521200-1673524800@hdpusergroup.org
SUMMARY:innerlayer copper balancing
DESCRIPTION:innerlayer copper balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-8/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T180000Z
DTEND:20230112T190000Z
DTSTAMP:20260421T085736
CREATED:20230105T212842Z
LAST-MODIFIED:20230105T212842Z
UID:23554-1673524800-1673528400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Work on final report 
URL:https://hdpusergroup.org/event/pcb-feature-min-29/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T200000Z
DTEND:20230112T210000Z
DTSTAMP:20260421T085736
CREATED:20221208T202416Z
LAST-MODIFIED:20221208T202416Z
UID:23508-1673532000-1673535600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:First meeting of the year 
URL:https://hdpusergroup.org/event/microvia-rel-24/
CATEGORIES:Microvia Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T200000Z
DTEND:20230112T210000Z
DTSTAMP:20260421T085736
CREATED:20221208T215250Z
LAST-MODIFIED:20221208T215250Z
UID:23510-1673532000-1673535600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Hope to start project work 
URL:https://hdpusergroup.org/event/microvia-rel-25/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230112T210000Z
DTEND:20230112T220000Z
DTSTAMP:20260421T085736
CREATED:20221221T212923Z
LAST-MODIFIED:20221221T212923Z
UID:23530-1673535600-1673539200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Project Call
DESCRIPTION:Review final data analysis 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-5/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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