Events for June 2021

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Events for June 2021

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Calendar of Events

Calendar of Events
Sunday Monday Tuesday Wednesday Thursday Friday Saturday
30
31
1

8:00am - 9:00am Weekly Sttafff Call

10:00am - 11:00am Reliability and Power Cycles telecom

2:00pm - 3:00pm Photonic Soldering II

2

10:00am - 11:00am Backdrill Under BGA telecom

11:00am - 12:00pm Single Surface Finish for Soldered & Compression Contact Pads

11:00am - 12:00pm Thermal Analysis Methodology Evaluation Placeholder

3

10:00am - 11:00am ECM 2 project Call

11:00am - 12:00pm Cu Surface Treatment vs Loss meeting Placeholder

11:00am - 12:00pm Cu Surface Treatment vs Loss June 3, 2021 meeting

4

9:00am - 10:00am Effects of Plating Thickness on CTF at IST Project Call

12:00pm - 1:00pm Technology Direction telecom

5
6
7
8

8:00am - 9:00am Weekly Sttafff Call

10:00am - 11:00am Innerlayer Copper Balancing telecom

1:00pm - 2:00pm Harsh Use Alloy Place Holder

9

9:00am - 10:00am DISC2A

10:00am - 11:00am Materials #6 meeting

12:00pm - 1:00pm Board Thickness II

10

3:00pm - 4:00pm Photonic Soldering II

11

10:00am - 11:00am Ultra-Low Dk Glass Project Update Meeting

12
13
14
15

8:00am - 9:00am Weekly Sttafff Call

10:00am - 11:00am Reliability and Power Cycles telecom

3:00pm - 4:00pm PCB Feature Min

16

8:00am - 9:00am DISC2A

10:00am - 11:00am ECM 2 project Call

11:00am - 12:00pm Thermal Analysis Methodology Evaluation Placeholder

17

10:00am - 11:00am Single Surface Finish for Soldered & Compression Contact Pads

11:00am - 12:00pm Cu Surface Treatment vs Loss meeting Placeholder

1:00pm - 2:00pm Cu Peel Strength Phase 2 meeting Placeholder

18

10:00am - 11:00am Technology Direction telecom

11:00am - 12:00pm Backdrill Under BGA telecom

19

8:00am - 9:00am Caffeine test

20
21
22

8:00am - 9:00am Weekly Sttafff Call

10:00am - 11:00am Better CAF EQ

11:00am - 12:00pm Innerlayer Copper Balancing telecom

23

9:00am - 10:00am Key High-Density Design Considerations for High-Reliability 5G Radio Access Network (RAN) Webinar

24

9:00am - 10:00am PFH Technology Phase 2 Project Call

1:00pm - 2:00pm ECM 2 project Call

3:00pm - 4:00pm Photonic Soldering II

25

9:00am - 10:00am Effects of Plating Thickness on CTF at IST

10:00am - 11:00am Ultra-Low Dk Glass Project Review

11:00am - 12:00pm Ultr-Low Dk Glass

26
27
28

10:00am - 11:00am Reliability and Power Cycles

8:00pm - 9:00pm LVH Lifetime Predictor for TC Project Call

29

8:00am - 9:00am Weekly Sttafff Call

1:00pm - 2:00pm Board Thickness II

3:00pm - 4:00pm PCB Feature Miniaturization

30

10:00am - 11:00am Materials #6 meeting

11:00am - 12:00pm Thermal Analysis Methodology Evaluation Placeholder

11:00am - 12:00pm Thermal Analysis Methodology Evaluation June 30, 2021 project meeting

1

10:00am - 11:00am Single Surface Finish for Soldered & Compression Contact Pads

11:00am - 12:00pm Cu Surface Treatment vs Loss meeting Placeholder

11:00am - 12:00pm Cu Surface Treatment Vs Loss July 1, 2021 project meeting

2

10:00am - 11:00am Tech. Direction telecom

11:00am - 12:00pm Backdrill Under BGA telecom

3
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