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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20210314T080000
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DTSTART:20210218T160000Z
DTEND:20210218T170000Z
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CREATED:20210128T164113Z
LAST-MODIFIED:20210128T164113Z
UID:19171-1613642400-1613646000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Inner Layer Copper Balancing Telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-3/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210218T170000Z
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CREATED:20210204T170131Z
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UID:19204-1613646000-1613649600@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-22/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210218T193000Z
DTEND:20210218T203000Z
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CREATED:20210128T203830Z
LAST-MODIFIED:20210128T203830Z
UID:19173-1613655000-1613658600@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Progress on: \nQFN samples to Dr Lu \nQFN materials properties \nQFN dimensions \nModelling of different board thicknesses and initial part work \n  
URL:https://hdpusergroup.org/event/board-thickness-ii-13/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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