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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20200625T130000Z
DTEND:20200625T180000Z
DTSTAMP:20260424T052602
CREATED:20210825T135521Z
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SUMMARY:HDP June 2020 Automotive Technology Webinar
DESCRIPTION:To download presentations click here – https://hdpusergroup.org/published-papers/ \nPlease use the registration button on this page\, or send an email to kima77@hdpug.org with the information below to register for June 25\, 2020\, at 8:00 AM US CST HDP sponsored Automotive Electronics Technology Webinar. \nRequired registration information: \nName – \nCompany –  \nEmail – \nOptional registration information: \nTitle – \nPhone- \n \nThis no-charge Webinar is open to the public and will be an opportunity to gain information on Automotive standards and technology. \nSpeakers will include: \nJan Vardaman – TechSearch International – Moderator \nDr. Stefan Gutschling – ZVEI – Mobility Trends and their Impact on the Automotive Supply Chain \nAlun Morgan – Ventec International – Power PCB requirements for Automotive Applications \nThorsten Meyer – Infineon – Automotive Packaging Trends – Challenges and Solutions \nArthur Creidler – U.L. – Regulatory landscape for vehicle electronics and primary evaluation tools for PCB reliability demands in the new e-mobility market. \nRaj Kumar – TTM Technologies – Considerations for Automotive PCB Manufacturing \nThere will be an opportunity for questions using the chat function of Webex. Questions will be collated during the session and speakers will address as many as time permits at the end of the talks.  \nAfter registration\, you will be sent a confirmation email with Webex logistics for the call and a few weeks before the call\, a calendar reminder for the call.  \n 
URL:https://hdpusergroup.org/event/hdp-june-2020-automotive-technology-webinar/2020-06-25/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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