Events for April 2020

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Events for April 2020

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Calendar of Events

Calendar of Events
Sunday Monday Tuesday Wednesday Thursday Friday Saturday
29
30
31

12:00pm - 1:00pm Harsh Use Alloy Call

1

11:00am - 12:00pm Cu Grain Structure vs Loss Placeholder

11:00am - 12:00pm Cu Grain Structure vs Loss Project Meeting

12:00pm - 1:00pm Low Ag Alloy Solderpaste project placeholder

2

10:00am - 11:00am Reliability and Power Cycles kickoff telecom

11:00am - 12:00pm Cu Peel Strength project placeholder

11:00am - 12:00pm Cu Peel Strength project meeting of April 2, 2020

3

8:00am - 9:00am Logo Call

10:00am - 11:00am ECM2 project call

1:00pm - 2:00pm DISC2A

4
5
6
7

10:00am - 11:00am Backdrill Under BGA

8

10:00am - 11:00am Materials #6 Call

3:00pm - 4:00pm Photonic Soldering

7:00pm - 8:00pm Lead Frame Surface finish

9

10:00am - 11:00am ECM2 Project call

10

12:00pm - 1:00pm Ultra Low Dk Glass

11
12
13
14

10:00am - 11:00am CAF Eq

8:00pm - 9:00pm High Speed Hyrbid PWB Project Call

15

9:00am - 10:00am PFH Technology Project Call

11:00am - 12:00pm Cu Grain Structure vs Loss Placeholder

11:00am - 12:00pm Cu Grain Structure vs Loss project meeting of April 15, 2020

16

2:00am - 3:00am Component Rework Reliability Project Call

10:00am - 11:00am ECM2 Project call

11:00am - 12:00pm Cu Peel Strength project placeholder

17

1:00pm - 2:00pm DISC2A

3:00pm - 4:00pm Board Thickness II

18
19
20
21

10:00am - 11:00am Backdrill Under BGA telecom

22

3:00pm - 4:00pm Photonic Soldering

4:00pm - 5:00pm Photonic Soldering Weekly Call – Reschedule

23

11:00am - 12:00pm SAC Aging 3-84 project call

24

12:00pm - 1:00pm Ultra Low Dk Glass Telecom

25
26
27
28

1:00am - 3:30am LVH Lifetime Predictor for TC

8:00am - 10:00am Temporary Staff call USE THIS

29

11:00am - 12:00pm Cu Grain Structure vs Loss Placeholder

11:00am - 12:00pm Cu Surface Treatment project meeting of April 29, 2020

12:00pm - 1:00pm Low Ag Alloy Solderpaste project placeholder

30

10:00am - 11:00am ECM2 Project call

11:00am - 12:00pm Cu Peel Strength project placeholder

11:00am - 12:00pm Cu Peel Strength April 30, 2020 meeting

1

1:00pm - 2:00pm DISC2A

3:00pm - 4:00pm Board Thickness II

2
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