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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20200219T140000Z
DTEND:20200220T230000Z
DTSTAMP:20260426T045953
CREATED:20210825T013232Z
LAST-MODIFIED:20210825T013232Z
UID:15239-1582099200-1582218000@hdpusergroup.org
SUMMARY:HDP Annual Member Meeting
DESCRIPTION:There have been changes to the Day 1 Agenda.  Please review the agenda below for current presentation times. \nThe Annual HDP User Group Spring Member Meeting will be February 19-20\, 2020 in Santa Clara\, California\, USA\, hosted by UL.  You can register for the meeting by clicking the “register” button on the meeting page or emailing the HDP Administrator. \nWebEx Information: \n \nHDP Member Meeting Day 1 \nWednesday\, February 19\, 2020 \n8:00 am  |  (UTC-06:00) Central Time (US & Canada)  |  12 hrs \nGlobal call-in numbers \nMeeting number (access code): 628 871 205 \nMeeting password: HDPday1 \nWhen it’s time\, join the meeting. \n \nHDP Member Meeting Day 2 \nThursday\, February 20\, 2020 \n8:00 am  |  (UTC-06:00) Central Time (US & Canada)  |  12 hrs \nGlobal call-in numbers \nMeeting number (access code): 624 763 489 \nMeeting password: HDPday2 \nWhen it’s time\, join the meeting. \nHotel and Meeting Location \nThe meeting will be held at the Embassy Suites Milpitas – Silicon Valley.  HDP has negotiated a nightly room rate of $239\, that includes wi-fi and breakfast.  For assistance with hotel reservations please contact the HDP Administrator.  The deadline for hotel reservations is January 27th. \nEmbassy Suites Milpitas – Silicon Valley901 E Calaveras Blvd.Milpitas\, CA USA 95035 \nAgenda (all times are PST) \nDay 1 Invited Guests and Members      \n \n8:30 Registration\, coffee and socializing \n9:00    Opening of the meeting – Marshall Andrews\, HDP User Group \n\n Self-Introduction of invited guests – All\nSelf-Introduction of Members – All\nAwards – All\nHost Presentation – UL\n\nProjects Review/Status Update – Chair: Jack Fisher\, HDP User Group \n9:45    Printed Wiring Board Assembly \n\nElectro-Chemical Migration 2 – Julie Silk\, Keysight\nPhotonic Soldering – Vahid Akhavan\, NovaCentrix\n\n10:25  Printed Wiring Board Technology \n\nBack Drill under BGA – Karl Sauter\, Oracle\n\n10:45  Group Picture and Break (30min)   \n11:15 Guest Speaker \n\nKevin Knadle – TTM – “Counterfeit Reliability— The Critical Role of Temperature in Making\, Breaking\, and Testing Todays Electronics”\n\n12:15 Lunch (60 minutes) \n12:45  UL Tour \n2:30  Component Technology \n\nLead Frame Surface Finish – Bruce Lee\, MacDermid (Webex)\n\n2:50    New Project Proposals \n\nIPC Micro Via Proj. Overview – Denny Fritz (Webex)\nCITC vs IST – Mike Carano\, RPB Chemicals (Webex)\nNew Project proposal – Paul Cook\, AGC\nLaser Via Lifetime Predictor – Yoshi Hiroshima (Webex)\nMay Automotive Workship – Martin Cotton\n\n3:55    Break (15 min) \n4:10    Material Technology  \n\nUltra-Low Dk Glass Analysis –Scott Hinaga\, Cisco\nCu Grain Structure vs Loss  – Steve Wilkinson\, Juniper\nGlass type comparison – Crystal VanderPan\, U.L.\nBoard Thickness 2 – Eric Lundeen\, i3\n\n5:30    Open Discussion – New industry issues & collaboration opportunities – Jack Fisher\, HDP \n5:45    Feedback from members and Guests \n \n  \n \nDay 2 Members Only \n8:30    Registration\, Coffee and socializing \n9:00    Opening of the meeting\, introductions – Marshall Andrews\, HDP User Group \nProjects Review/Status Update – Chair: Jack Fisher\, HDP User Group \n9:10    B.O.D. Report \n9:20    Printed Wiring Board Assembly \n\nLow Ag Alloy Reliability BGA leg – Rusty Osgood\, Flex / Richard Coyle\, Nokia (Webex)\n\n9:45    Material Technology  \n\nSAC Aging 3-84  – Richard Coyle\, Nokia  (Webex)\n\n10:10 Break (25 min)  \n10:35 Emerging Technology \n\nVeCS Technology Evaluation – Joe Dickson\, WUS\nOpto-electronics II – Greg Bradburn – Cisco\nFuture HDI –Tony Senese\, Panasonic Close Out\n\n11:50  Lunch (45 min) \n12:50 Printed Wiring Board Technology \n\nPb Free PWB Materials Reliability 6 – Steve Wilkinson\, Juniper\nCopper Peel Strength – Jim Fuller\, Sanmina\n\n1:40    Component Technology \n\nMini Power Cycles – Joe Smetana\, Nokia (Webex)\nReliability of Wettable Flank in Routable QFN for Automotive – Dr. Bae\, Haesung\n\n 2:30    Printed Wiring Board Technology  \n\nRF Failure Detection – Joe Smetana\, Nokia (Webex)\nBetter CAF Acceleration Equation – Tony Senese\, Panasonic\nDesign Related PWB Material Damage – Steve Wilkinson\, Juniper\n\n3:45    Break (15 min) \n4:00    Printed Wiring Board Technology (Continue).  \n\nPTH Creep Fatigue Under Roughness Influence – Yoshi Hiroshima\, Fujitsu (Webex)\nHigh Speed Hybrid PWB – Yoshi\, Fujitsu (Webex)\n\n4:40    Printed Wiring Board Technology \n\nPlated Filled Hole Technology – Joe Zou\, Elec&Eltek (Webex)\n\n4:55    Printed Wiring Board Assembly \n\nComponent Rework Reliability – Mei-Ming Khaw\, Keysight (Webex) \n\n5:15   Open Discussion \n\nIndustry issues and problems- collaboration opportunities – Jack Fisher\, HDP \n\n5:45   Any Other Business and Feedback from Attendees \nClose of meeting \n7:00   Dinner \n  \n \n 
URL:https://hdpusergroup.org/event/hdp-annual-member-meeting/
LOCATION:Santa Clara\, California\, USA
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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