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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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TZNAME:CDT
DTSTART:20190310T080000
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DTSTART:20191103T070000
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DTSTART:20191016T160000Z
DTEND:20191016T170000Z
DTSTAMP:20260426T111802
CREATED:20191013T192606Z
LAST-MODIFIED:20191013T192606Z
UID:15118-1571223600-1571227200@hdpusergroup.org
SUMMARY:Cu grain Structure vs Loss project meeting
DESCRIPTION:Cu grain Structure vs Loss project meeting 
URL:https://hdpusergroup.org/event/cu-grain-structure-vs-loss-project-meeting-2/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20191016T170000Z
DTEND:20191016T180000Z
DTSTAMP:20260426T111802
CREATED:20191013T193052Z
LAST-MODIFIED:20191013T193052Z
UID:15119-1571227200-1571230800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste reliability - BGA Leg project meeting
DESCRIPTION:Low Ag Alloy Solderpaste reliability - BGA Leg project meeting of Oct 16th 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-reliability-bga-leg-project-meeting-2/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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