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X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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TZOFFSETFROM:-0600
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DTSTART:20190310T080000
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DTSTART:20190612T160000Z
DTEND:20190612T170000Z
DTSTAMP:20260427T010640
CREATED:20190603T215806Z
LAST-MODIFIED:20190603T215806Z
UID:13800-1560337200-1560340800@hdpusergroup.org
SUMMARY:Cu Grain Structure vs Loss Placeholder
DESCRIPTION:  \n  \n  \nPlaceholder for Cu Grain Structure Vs Loss project
URL:https://hdpusergroup.org/event/cu-grain-structure-vs-loss/2019-06-12/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20190612T160000Z
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CREATED:20190607T180743Z
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UID:13992-1560337200-1560340800@hdpusergroup.org
SUMMARY:Cu Grain Structure Project Meeting of June 12\, 2019
DESCRIPTION:Cu Grain Structure Project Meeting of June 12\, 2019 
URL:https://hdpusergroup.org/event/cu-grain-structure-project-meeting-of-june-12-2019/
LOCATION:WebEx
CATEGORIES:Cu Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20190612T170000Z
DTEND:20190612T180000Z
DTSTAMP:20260427T010640
CREATED:20190603T214341Z
LAST-MODIFIED:20190603T214341Z
UID:13799-1560340800-1560344400@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste project meeting
DESCRIPTION:June 12\, 2019 Project meeting for Low Ag Alloy Solderpaste BGA leg 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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