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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20190310T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20191103T070000
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BEGIN:VEVENT
DTSTART:20190123T140000Z
DTEND:20190123T230000Z
DTSTAMP:20260427T101045
CREATED:20190122T153920Z
LAST-MODIFIED:20190122T153920Z
UID:12017-1548230400-1548262800@hdpusergroup.org
SUMMARY:non-member project meeting test
DESCRIPTION:test
URL:https://hdpusergroup.org/event/non-member-project-meeting-test/
CATEGORIES:melissa test 010219
END:VEVENT
BEGIN:VEVENT
DTSTART:20190123T140000Z
DTEND:20190123T230000Z
DTSTAMP:20260427T101045
CREATED:20190123T113138Z
LAST-MODIFIED:20190123T113138Z
UID:12025-1548230400-1548262800@hdpusergroup.org
SUMMARY:test event - irelene
DESCRIPTION:test
URL:https://hdpusergroup.org/event/test-event-irelene/
CATEGORIES:Project test mailing list
END:VEVENT
BEGIN:VEVENT
DTSTART:20190123T160000Z
DTEND:20190123T170000Z
DTSTAMP:20260427T101045
CREATED:20190111T175724Z
LAST-MODIFIED:-00011130T055036Z
UID:11671-1548237600-1548241200@hdpusergroup.org
SUMMARY:HDP Opto Phase 2
DESCRIPTION:
URL:https://hdpusergroup.org/event/hdp-opto-phase-2-6968/
CATEGORIES:Optoelectronics II
END:VEVENT
BEGIN:VEVENT
DTSTART:20190123T180000Z
DTEND:20190123T190000Z
DTSTAMP:20260427T101045
CREATED:20190218T192526Z
LAST-MODIFIED:-00011130T055036Z
UID:12643-1548244800-1548248400@hdpusergroup.org
SUMMARY:HDP Low Ag Alloy Solderpaste Project meeting Jan 23\, 2019
DESCRIPTION:Low Ag Alloy Solderpaste project meeting of Jan 23\, 2019 Agenda:  Discuss the proposed separation of the SAC305 profile temperature alloys (mid temp alloys) and the low temperature alloys into two phases. Start the SAC305 temperature alloys immediately and follow up with the low temperature alloys shortly/concurrently. 
URL:https://hdpusergroup.org/event/hdp-low-ag-alloy-solderpaste-project-meeting-jan-23-2019/
CATEGORIES:Low Ag Alloy Solder Paste Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20190123T200000Z
DTEND:20190123T210000Z
DTSTAMP:20260427T101045
CREATED:20190111T175720Z
LAST-MODIFIED:-00011130T055036Z
UID:11666-1548252000-1548255600@hdpusergroup.org
SUMMARY:ECM 2 Project Meeting
DESCRIPTION:
URL:https://hdpusergroup.org/event/ecm-2-project-meeting-6958/
CATEGORIES:Electro-Chemical Migration 2
END:VEVENT
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