BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20170312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20171105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20170726T150000Z
DTEND:20170726T160000Z
DTSTAMP:20260428T202101
CREATED:20190111T174958Z
LAST-MODIFIED:-00011130T055036Z
UID:11143-1501063200-1501066800@hdpusergroup.org
SUMMARY:Board Thickness
DESCRIPTION:
URL:https://hdpusergroup.org/event/board-thickness-5532/
CATEGORIES:Board Thickness Effect on ATC Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20170726T170000Z
DTEND:20170726T180000Z
DTSTAMP:20260428T202101
CREATED:20190111T175006Z
LAST-MODIFIED:-00011130T055036Z
UID:11153-1501070400-1501074000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste Reliability July 26\, 2017 meeting
DESCRIPTION:Scheduled meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-reliability-july-26-2017-meeting-5547/
CATEGORIES:Low Ag Alloy Solder Paste Reliability
END:VEVENT
END:VCALENDAR